CAST Compression IP Webinar 800x100 (2)

CEO Interview with Dr. Maksym Plakhotnyuk of ATLANT 3D

CEO Interview with Dr. Maksym Plakhotnyuk of ATLANT 3D
by Daniel Nenni on 07-13-2025 at 8:00 am

Maksym Plakhotnyuk (1)

 

Dr. Maksym Plakhotnyuk, is the CEO and Founder of ATLANT 3D, a pioneering deep-tech company at the forefront of innovation, developing the world’s most advanced atomic-scale manufacturing platform. Maksym is the inventor of the first-ever atomic layer advanced manufacturing technology, enabling atomic-precision development… Read More


CEO Interview with Carlos Pardo of KD

CEO Interview with Carlos Pardo of KD
by Daniel Nenni on 07-13-2025 at 6:00 am

kd carlos pardo ceo cofounder screen 2

Carlos Pardo has a distinguished career as a manager in the microelectronics industry, excelling in leading R&D teams. He possesses extensive expertise in the high-tech silicon sector, encompassing both hardware and software development. Previously, he served as the Technical Director at SIDSA, where he managed R&D… Read More


Podcast EP297: An Overview of sureCore’s New Silicon Services with Paul Wells

Podcast EP297: An Overview of sureCore’s New Silicon Services with Paul Wells
by Daniel Nenni on 07-11-2025 at 10:00 am

Dan is joined by sureCore CEO Paul Wells. Paul has worked in the semiconductor industry for over 25 years including two years as director of engineering for Pace Networks, where he led a multidisciplinary, 70 strong product development team creating a broadcast quality video & data mini-headend. Before that, he worked for… Read More


CEO Interview with Darin Davis of SILICET

CEO Interview with Darin Davis of SILICET
by Daniel Nenni on 07-11-2025 at 6:00 am

Davis Silicet

With over 30 years of diverse industry experience, Darin leads SILICET, a semiconductor IP licensing firm.   He spearheaded a strategic pivot to focus on a seamless LDMOS innovation that delivers unmatched cost, performance and reliability advantages – backed by a robust global patent portfolio.  Prior to co-founding SILICET,… Read More


Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD Modeling

Altair SimLab: Tackling 3D IC Multiphysics Challenges for Scalable ECAD Modeling
by Kalar Rajendiran on 07-10-2025 at 10:00 am

What is SimLab

The semiconductor industry is rapidly moving beyond traditional 2D packaging, embracing technologies such as 3D integrated circuits (3D ICs) and 2.5D advanced packaging. These approaches combine heterogeneous chiplets, silicon interposers, and complex multi-layer routing to achieve higher performance and integration.… Read More


AI Booming is Fueling Interface IP 23.5% YoY Growth

AI Booming is Fueling Interface IP 23.5% YoY Growth
by Eric Esteve on 07-10-2025 at 6:00 am

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AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More


Podcast EP296: How Agentic and Autonomous Systems Make Scientists More Productive with SanboxAQ’s Tiffany Callahan

Podcast EP296: How Agentic and Autonomous Systems Make Scientists More Productive with SanboxAQ’s Tiffany Callahan
by Daniel Nenni on 07-09-2025 at 8:00 am

Dan is joined by Dr. Tiffany Callahan from SandboxAQ. As one of the early movers in the evolving sciences of computational biology, machine learning and artificial intelligence, Tiffany serves as the technical lead for agentic and autonomous systems at SandboxAQ. She has authored over 50 peer-reviewed publications, launched… Read More


Insider Opinions on AI in EDA. Accellera Panel at DAC

Insider Opinions on AI in EDA. Accellera Panel at DAC
by Bernard Murphy on 07-09-2025 at 6:00 am

Accellera Panel on AI in EDA min

In AI it is easy to be distracted by hype and miss the real advances in technology and adoption that are making a difference today. Accellera hosted a panel at DAC on just this topic, moderated by Dan Nenni (Mr. SemiWiki). Panelists were: Chuck Alpert, Cadence’s AI Fellow driving cross-functional Agentic AI solutions throughout… Read More


Revolutionizing Simulation Turnaround: How Siemens’ SmartCompile Transforms SoC Verification

Revolutionizing Simulation Turnaround: How Siemens’ SmartCompile Transforms SoC Verification
by Kalar Rajendiran on 07-08-2025 at 10:00 am

SmartCompile

In the race to deliver ever-larger SoCs under shrinking schedules, simulation is becoming a bottleneck. With debug cycles constrained by long iteration times—even for minor code changes—teams are finding traditional flows too rigid and slow. The problem is further magnified in continuous integration and continuous deployment… Read More