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From Detection to Safety: Reframing Fault Simulation for Functional Safety

From Detection to Safety: Reframing Fault Simulation for Functional Safety
by Lauro Rizzatti on 07-06-2026 at 10:00 am

From Detection to Safety Figure 1

In the early 1980s, when computer-aided engineering (CAE), the precursor to modern electronic design automation (EDA), was just taking shape, my professional trajectory shifted in a way that would prove foundational. I joined Teradyne, the Boston-based leader in automated test equipment (ATE), and I encountered for the first time the world of logic and fault simulation through its LASAR platform. What stood out was not only the simulation capability itself, but LASAR’s ability to generate a fault dictionary, a precomputed mapping between modeled physical defects and their corresponding test response patterns, used in manufacturing testing to rapidly diagnose failing devices under test.

Introduction

Classical fault simulation, as exemplified by LASAR fault simulator, emerged in an era dominated by manufacturing yield and quality. The problem to be solved was clearly defined: given a physical defect, can it be detected during testing, and once detected, can it be diagnosed efficiently? Every aspect of the methodology, specifically, fault models, simulation algorithms, and resulting artifacts, was optimized around that objective.

At the heart of this approach was abstraction. Physical defects, with all their analog complexity, were modeled as logical faults, most notably stuck-at-0 and stuck-at-1 conditions at the gate or board level. This abstraction proved remarkably effective. It enabled scalable simulation across large designs, allowing engineers to reason about defect coverage without being burdened by transistor-level detail.

Equally important was performance. Simulation engines were engineered for throughput, not introspection. Algorithms such as parallel and concurrent fault simulation allowed thousands of faults to be evaluated efficiently against a common set of test vectors. The goal was not to understand system behavior under fault, but to ensure that faults could be detected and identified.

The output of this process reflected its purpose. Test vectors ensured coverage; fault dictionaries enabled diagnosis. When a device fails on the production floor, the observed failure signature could be cross-referenced against the dictionary to pinpoint likely defect locations. This closed the loop between design, test, and manufacturing.

But this paradigm was fundamentally rooted in a manufacturing worldview. Faults were random, independent, and undesirable deviations from an otherwise correct design. The system itself was assumed to be functionally sound; the role of fault simulation was simply to expose and localize physical imperfections.

From Manufacturing Defects to Functional Safety: Redefining the Role of Faults

As semiconductor systems have evolved—driven by the stringent safety requirements of automotive, industrial, and medical applications, as well as the reliability demands of datacenter and networking infrastructures, namely, the role of faults has been fundamentally redefined. In functional safety, the question is no longer whether a defect can be detected, but whether the system can tolerate, mitigate, or safely respond to faults during operation. Faults are no longer viewed solely as manufacturing artifacts; they are modeled as an inherent part of the system’s operational environment. Likewise, in datacenter and networking applications, faults are addressed through the lens of Reliability, Availability, and Serviceability (RAS), extending their relevance throughout the product lifecycle. This lifecycle perspective is further enabled by Silicon Lifecycle Management (SLM), which provides continuous monitoring, optimization, diagnosis, and debug capabilities from deployment through field operation.

This shift demands a rethinking of fault simulation itself. The metrics change, from fault coverage to safety coverage. The artifacts evolve, from fault dictionaries to safety cases. And the simulation context expands, from isolated logic evaluation to full-system behavioral validation under fault conditions.

In this new landscape, classical fault simulation is not obsolete, it is foundational. But it represents only the starting point of a broader journey: one that moves from detection to resilience, from diagnosis to assurance, and ultimately, from manufacturing quality to functional safety.

Functional safety verification, as framed by standards such as ISO 26262, begins from a different premise altogether. The concern is no longer limited to whether a defect can be detected before a product ships but extends to how the system behaves when faults inevitably occur during operation. This shift, while subtle in wording, fundamentally transforms the role of fault simulation. The problem is no longer static and binary, but dynamic and contextual. It is no longer sufficient to know that a fault is detectable; one must understand when it is detected, how it propagates through the system, and whether the system responds in a manner that preserves safety.

Functional Safety Verification Methodology: FMEDA and The Role of Fault Emulation

At the heart of functional safety lies a simple question: how do we know that a complex system will behave safely in the presence of faults? It is this question that defines the methodology of functional safety and gives rise to frameworks such as Failure Modes, Effects, and Diagnostic Analysis (FMEDA).

FMEDA provides the analytical backbone of the safety process. It decomposes a system into its constituent elements, assigns failure modes, estimates their occurrence rates, and classifies their effects as safe or dangerous. It also attributes diagnostic coverage to safety mechanisms, based on design intent. Yet, by its very nature, FMEDA operates at an abstract level. It is a model of expected behavior, not a demonstration of actual behavior.

This gap between assumption and evidence is where fault simulation, and increasingly, fault emulation, enters the picture. Their role is not merely to detect faults, but to validate the assumptions embedded in the FMEDA. A safety mechanism may be credited with a certain level of coverage on paper, but that claim must be substantiated through experimentation. By injecting faults corresponding to modeled failure modes and observing the system’s response, engineers can measure whether those mechanisms behave as intended.

In this context, the notion of fault “detection” evolves into something far richer. It is no longer sufficient to know whether a fault is detected; one must also understand when it is detected, under what conditions it becomes active, how long it remains latent, and whether the system transitions into a safe state within the required time bounds. These temporal and behavioral dimensions are essential for accurately computing diagnostic coverage and, ultimately, for constructing a credible safety case.

This shift fundamentally transforms the nature of fault verification. Traditional fault simulation evaluated faults largely in isolation, often at the gate or block level. Modern functional safety verification, by contrast, is built around fault injection campaigns that unfold over time within a running system. Faults are introduced while real software is executing, realistic workloads are applied, and the system interacts with its environment. A fault may be injected, remain dormant, become activated only under specific runtime conditions, and propagate across multiple subsystems before being detected, if detected at all.

Nowhere is this complexity more evident than in automotive systems. Today’s vehicles are composed of highly distributed architectures, integrating multiple SoCs and ECUs from different vendors. Each ECU performs a specific function, explicitly, perception, control, actuation, or user interaction, but safety depends on their coordinated behavior.

Consider a representative scenario. The ECU controlling brake actuators must respond to inputs from sensor-processing ECUs, which in turn interpret data from radar or LiDAR systems. Another ECU communicates warnings or status to the driver. If a fault occurs in the actuator path, the system must detect it, determine its impact, and respond appropriately, whether by triggering automated braking, alerting the driver, or handing back control. These interactions span long paths across multiple hardware and software layers, making them inherently system-level in nature.

Validating such end-to-end behaviors dramatically increases the scope and complexity of fault verification. Fault lists for modern designs routinely reach into the millions. Even after applying fault reduction and optimization techniques, the remaining fault space is vast. When extended across multiple ECUs, the combinatorial explosion can push the effective fault space into the billions.

In principle, simulation can manage this challenge. In practice, it cannot do so within acceptable timeframes. Simulation remains indispensable for detailed analysis and localized fault scenarios, but it does not scale efficiently to long, system-level executions involving full software stacks. Running such campaigns purely in simulation can take weeks or even months, an impractical proposition for safety-critical development programs.

This is precisely where fault emulation becomes essential.

Fault emulation complements simulation by providing the performance needed to execute large-scale, system-level fault campaigns. The industry has therefore converged into a hybrid methodology. Faults that are local to an IP or confined within a single ECU are typically handled in simulation, where modeling flexibility and observability are highest. However, faults that propagate across longer paths—spanning subsystems, ECUs, and software layers—are offloaded to emulation, where execution speed enables practical turnaround times.

Crucially, this hybrid approach is unified under the concept of a single fault campaign. All faults, regardless of where they are executed, belong to a common framework. A shared fault database serves as both input and output across simulation, formal analysis, and emulation engines. This enables seamless partitioning of the campaign without disrupting the user flow. From the engineer’s perspective, the campaign is a single entity, producing a unified set of results that feed back into FMEDA and into the safety case.

Time-to-results become a defining constraint in this process. Safety engineers cannot afford to wait weeks for coverage data. They need results within days to iterate on designs, refine assumptions, and close verification gaps. Fault emulation provides the acceleration required to meet these timelines, particularly for scenarios involving long execution paths and complex software interactions.

At the same time, consistency between simulation and emulation is critical. Since fault simulation has been the foundation of safety verification for decades, emulation must adhere to the same use model, supporting similar fault definitions, campaign structures, and reporting formats. The use of a common fault database is key to achieving this congruency, allowing users to move between engines without reauthoring their flows.

There are, of course, differences in implementation. Certain fault models, particularly those involving timing semantics or detailed memory behavior, are naturally expressed in simulation. In emulation, these abstractions may need to be adapted. For example, memories may reside off-chip and be accessed through physical interfaces, shifting the point at which faults can be meaningfully injected or observed. Yet these differences are largely technical details. From a methodological standpoint, the objective remains unchanged: to exercise faults, observe system behavior, and measure safety coverage.

The results of these fault campaigns form a critical part of the safety case. FMEDA provides the analytical argument; fault simulation and emulation provide the empirical evidence. Together, they create a closed-loop methodology: assumptions are made, experiments are conducted, results are measured, and the analysis is refined.

An Example of a Unified Functional Safety Verification Solution

Modern functional safety verification demands far more than isolated fault simulation runs or disconnected analysis tools. As semiconductor designs grow in complexity, the verification challenge increasingly requires a unified methodology capable of connecting architectural safety intent, FMEDA data, RTL implementation, software workloads, and safety metrics into a single coherent flow.

From an EDA technology perspective several key technologies are needed: Fast fault simulation and emulation, formal fault reduction, fault probability calculation, fault campaign management, fault coverage and debug and all of that connecting to a unified fault database. Figure 1 shows an example.

Table I shows typical results a user should expect on a RISC-V reference design and a SoC design.

RISC-V Design VC Z01X ZeBu
Wall Clock Compile 34sec 1hr 50min
Runtime (Linux Boot) > 4 months (estimated) 7hr 22 min
SoC Design VC Z01X ZeBu
Wall clock Compile 35sec 7hr 8min
Runtime (Linux Boot) 39hr 25min 4hr 52min@1Host

58min@8Hosts

Fault Results Number of Hard Faults 133 (Hyper Faults) Dropped from Fault Simulation Detected: 101

Not-detected: 32

Runtime > 40hr 20min 12hr@1Host

Table I: Benchmark results highlighting the throughput and accuracy-of-results (Source: Synopsys)

In both test cases, the data illustrates how fault emulation complements traditional fault simulation by enabling the execution of dramatically longer software workloads while simultaneously achieving levels of fault coverage closure that would be impossible to reach through simulation alone. The benchmarks also underscore the remarkable gains obtained not only in raw performance, but also in accuracy-of-results and confidence in the final safety metrics.

Conclusion

Seen in this light, the relationship between classical fault simulation and functional safety verification is not one of replacement, but of transformation. The foundational ideas developed in the context of traditional fault simulation, that is, modeling faults, propagating their effects, and measuring coverage, remain relevant. However, the scope of verification has expanded dramatically. Today’s safety-critical systems must be validated not only at the hardware level, but also in the context of software behavior, safety mechanisms, system interactions, and real-world operating conditions.

This shift has elevated fault emulation from performance optimization to a critical enabler of functional safety verification. By executing large-scale fault campaigns at near-realistic speeds, fault emulation makes it practical to evaluate millions of fault scenarios across complex hardware-software systems and generate the coverage data required for FMEDA analysis.

Yet fault emulation alone is not enough. The value lies not merely in the speed of the underlying hardware engines, but in their integration into a broader software-defined safety verification flow. Automated fault classification, safety metric calculation, campaign management, results analysis, and traceability are all essential components of a complete FMEDA methodology. Together, these capabilities bridge the gap between low-level fault behavior and system-level safety goals, enabling development teams to achieve the rigorous diagnostic coverage demanded by modern standards such as ISO 26262.

As systems continue to grow in complexity, this combination of fault emulation and software-driven safety analysis will remain a cornerstone of functional safety verification.

Also Read:

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Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog

Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog
by Daniel Nenni on 07-06-2026 at 6:00 am

Pavona image

Chris Morrison is VP Product Marketing at Agile Analog, the customizable analog IP company. He has over 18 years’ experience of developing strong relationships with key partners across the semiconductor industry and delivering innovative analog, digital, power management and audio products, working for international companies including Dialog Semiconductor. Chris has an engineering degree in computer and electronic systems from the University of Strathclyde, and a masters’ degree in system level integration from the University of Edinburgh.

Tell us a bit about the GlobalPlatform Pavona initiative? How did this come about?

GlobalPlatform recently launched Pavona, a community-governed open-source silicon distribution, to provide chip designers with certification-ready secure silicon IP components and reference designs for developing embedded and high-performance silicon systems. This initiative is a result of the work of the GlobalPlatform Trusted Open Source Silicon Task Force which identified the need to create a secure, standards-based foundation for open-source silicon development.

What are the key goals of this initiative?

This open-source silicon distribution aims to deliver production-quality, certification-ready IP components and reference top-level designs, providing a composable framework for building secure-by-default silicon aligned with FIPS 140-3 and Common Criteria certification requirements.

Previous open source initiatives have focused primarily on individual cores. Pavona evolves beyond single-use, monolithic open-source silicon designs toward a platform that scales across markets and applications. Pavona introduces a modular distribution model with a composition engine and curated IP library. This enables integrators to select, configure and assemble open silicon subsystems tailored to their specific architecture, to deliver innovative solutions for datacenter servers, AI accelerators or IoT devices.

Who are the main founding members? 

Hosted by GlobalPlatform, Pavona is supported by a Governing Board of contributing members who fund the project’s operations, while an independent Technical Steering Committee holds sole responsibility for the project’s technical roadmap and oversight.

Agile Analog is delighted to join major semiconductor players, including Meta, Qualcomm, Analog Devices and zeroRISC, as one of the founding members of GlobalPlatform’s Pavona initiative. The members span a wide range of organizations from across the ecosystem – IP providers, semiconductor companies, software suppliers, standards bodies and end-product stakeholders – ensuring that all areas are considered for successful commercial deployment.

Why did Agile Analog want to be involved?

Analog IP is the critical bridge between the digital security domain and the physical world. Agile Analog’s configurable analog IP, including tamper prevention and tamper detection IP, provides the essential physical security layer to protect Pavona’s digital security stack, strengthening the physical hardware security. We are excited to bring our process-portable analog capabilities into an open ecosystem with this level of security rigor.

What are the initial focus areas of the Pavona initiative?

Pavona launches with two successfully taped-out reference designs: a standalone chip root of trust and an integrated root of trust for chiplet architectures fabricated at TSMC 3nm. The inclusion of silicon-proven reference designs gives the initiative a different starting point from projects that remain solely at the simulation or specification level. Pavona also offers the first openly available silicon distribution featuring a production-grade post-quantum cryptography (PQC) stack for embedded systems, addressing the escalating threat of attacks from future quantum computers.

6) How does this initiative fit with Agile Analog’s portfolio/roadmap?

While Pavona focuses heavily on the digital security stack (such as roots of trust and PQC algorithms like ML-KEM and ML-DSA), digital security is only as good as the hardware it sits on. Agile Analog’s role is to provide the essential physical security layer that wraps around these.

Our agileSecure anti-tamper security IP has become a key part of our product portfolio and we offer solutions that can strengthen hardware security and protect Pavona deployments from supply, clock, thermal and electromagnetic attacks. We will continue to build out our product roadmap to offer additional protection going forward.

CONTACT AGILE ANALOG

Also Read:

Hardening the Silicon: Why Analog Anti-Tamper IP is the New Security Baseline

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Podcast EP319: What Makes Agile Analog a Unique Company with Chris Morrison


CEO Interview with Brice Cruchon, CEO of Dracula Technologies

CEO Interview with Brice Cruchon, CEO of Dracula Technologies
by Daniel Nenni on 07-03-2026 at 4:00 pm

Brice Cruchon CEO Dracula Technologies Photo 2024

Brice Cruchon is the Founder and CEO of Dracula Technologies, a company he established in 2011 to develop and industrialize organic photovoltaic (OPV) technologies for indoor energy harvesting. He holds a Master’s degree in Chemistry from the University of Nantes (France) and has built a career spanning chemistry, intellectual property, innovation management, and technology commercialization.

With more than 28 years of executive leadership experience, Brice has extensive expertise in innovation strategy, intellectual property, technology financing, and industrial scale-up. Under his leadership, Dracula Technologies has evolved from a deep-tech startup into an industrial company, marked by the launch of its first manufacturing facility in Valence, France. Today, he is leading the company’s international expansion with the vision of making light energy harvesting a mainstream power source for ultra-low-power electronics and enabling the widespread adoption of battery-free IoT devices.

Tell us about your company?

When we founded Dracula Technologies, we were convinced that billions of connected devices could not continue to rely on disposable batteries. At the time, indoor energy harvesting was still considered a niche technology. Today, the conversation has shifted. As IoT deployments scale and sustainability becomes a priority, customers are looking for practical alternatives. That’s exactly where we bring value.

Dracula Technologies specializes in organic energy harvesting solutions for the global IoT market. We are best known for our LAYER® organic photovoltaic (OPV) technology, which harvests energy from ambient indoor light to power connected devices without disposable batteries.

LAYER® is specifically designed to operate under low and variable indoor lighting conditions, making it well suited for autonomous IoT devices. We also introduced LAYER® Vault, an integrated energy harvesting solution that combines our OPV technology with energy storage. It simplifies system design, reduces development complexity and helps OEMs accelerate time to market for autonomous connected devices.

Over the past decade, we have developed expertise in organic materials, device architecture, additive manufacturing and proprietary digital printing processes. Those capabilities have enabled us to move from laboratory innovation to industrial production. Today, our Green Micropower Factory in Valence, France, is the world’s largest facility dedicated exclusively to the production of organic photovoltaic modules using our patented digital printing process. This enables us to deliver high-volume, customized solutions while continuing to scale with customer demand.

What problems are you solving?

The first challenge we address is battery dependence in connected devices. As billions of IoT sensors are deployed worldwide, replacing and maintaining batteries becomes increasingly costly, labor intensive and environmentally challenging.

The semiconductor industry has made tremendous progress in reducing power consumption. As devices become more energy efficient, energy harvesting becomes an increasingly practical way to power them.

Our technology enables manufacturers to harvest energy from indoor light, reducing or even eliminating the need for disposable batteries in many applications. This helps lower maintenance costs, improve device autonomy, support sustainability goals and ensure continuous data transmission.

Replacing one battery is easy. Replacing thousands or even millions of batteries quickly becomes a significant operational and financial challenge. Customers are looking for ways to improve reliability while reducing maintenance and operating costs.

Our objective isn’t simply to replace batteries. It’s to make energy harvesting a practical power source for the next generation of connected electronics.

More broadly, we also see opportunities to address manufacturing challenges across the electronics industry. Companies are looking for more sustainable, scalable and resource-efficient production approaches. Our expertise in organic materials and additive manufacturing opens the door to new possibilities in organic electronics, including OLED and other future applications.

What application areas are your strongest?

Our technology has evolved well beyond powering individual sensors. Today, our strongest application areas are smart buildings and intelligent infrastructure, smart labels and asset tracking, smart retail, connected devices and industrial IoT.

Smart buildings are one of our fastest-growing markets. Together with partners such as Schneider Electric and Orioma, we have developed ambient light-powered solutions ranging from smart thermostats to intelligent occupancy and environmental sensors. These solutions help simplify installation, reduce wiring and maintenance, and enable smarter, more energy-efficient buildings.

Another major focus is smart labels, asset tracking and logistics. Working with partners including Linxens, Paragon ID, MOKOSmart and truvami, we have developed ambient light-powered RFID and Bluetooth® Low Energy tracking solutions for retail, warehouses, factories and supply chain applications. These solutions provide real-time tracking, environmental monitoring and asset visibility while significantly reducing battery maintenance.

We are also seeing strong momentum in smart retail. Our collaboration with CoolR demonstrates how ambient light energy harvesting can power connected retail monitoring solutions operating in refrigerated and other challenging indoor environments where battery replacement is particularly costly.

Connected devices represent another important area of growth. Our collaboration with Atmosic Technologies demonstrates how ambient light energy harvesting can enable battery-free remote controls and other ultra-low-power connected devices designed for long operational lifetimes with minimal maintenance.

Beyond these application-specific collaborations, we continue to work closely with technology ecosystem partners including STMicroelectronics, e-peas, and Semtech to help OEMs accelerate the development of battery-free and battery-assisted connected devices. We are also collaborating with Powercast on battery-free Bluetooth® Low Energy sensor nodes that combine RF wireless power with our LAYER® organic photovoltaic technology. By combining complementary energy harvesting technologies, these solutions can support more reliable operation in environments where available energy sources vary.

One thing we’ve learned is that there isn’t a single killer application. Every year we discover new use cases where eliminating battery maintenance creates real value for customers. What all these applications have in common is the need for reliable, maintenance-free operation over many years.

What keeps your customers up at night?

For many of our customers, the challenge is not the sensor itself. It is how to power and maintain large deployments over many years.

Replacing one battery is easy. Replacing thousands or even millions of batteries quickly becomes a significant operational and financial challenge. Customers are looking for ways to improve reliability while reducing maintenance and operating costs.

Sustainability is another important consideration. Manufacturers are under pressure to reduce waste, improve resource efficiency and meet increasingly ambitious environmental goals. Eliminating disposable batteries wherever possible is one way to address those challenges.

Across the electronics industry, companies are also looking at how future manufacturing technologies can improve both performance and sustainability. We believe organic electronics will play an important role in that evolution.

What does the competitive landscape look like and how do you differentiate?

The energy harvesting market includes several technologies, each suited to different operating environments. Our focus is on harvesting low levels of ambient indoor light efficiently and at industrial scale.

Indoor environments present unique challenges. Light levels are much lower than outdoors and vary depending on the application. Maximizing energy generation under these conditions requires materials and device architectures specifically designed for indoor illumination. We have spent more than a decade continuously improving the efficiency of our organic photovoltaic technology for these environments. Our latest generation can generate usable energy from light levels as low as 5 lux, allowing us to address applications operating in extremely low indoor illumination.

Performance is important, but performance alone isn’t enough. Customers also want technologies they can manufacture, integrate and deploy reliably at scale. That’s where we’ve invested a great deal of effort over the past decade.

Many organizations develop innovative materials in the laboratory. We have developed both the technology and the manufacturing capability to produce organic photovoltaic modules in volume using our proprietary digital printing process.

Moving from innovative materials to repeatable, high-volume manufacturing is one of the biggest challenges in organic electronics. We believe our ability to bridge that gap is one of our greatest strengths.

Finally, the knowledge we have developed in organic materials, printing processes and device manufacturing extends beyond OPV and creates opportunities to explore adjacent organic electronics applications.

What new features and technologies are you working on?

Innovation has always been central to our strategy, but our roadmap is largely driven by our customers. They continually challenge us to improve performance, reduce footprint and make our technology even easier to integrate into their products.

Most recently, we introduced a new generation of our OPV technology. It delivers a 30 percent increase in overall performance while improving operation under indoor LED lighting. It also incorporates advances in our proprietary organic photovoltaic materials and gives designers greater flexibility to optimize size and power according to their application requirements.

Innovation is not only about improving efficiency. It’s also about building long-term technology leadership. Today, our innovation is supported by a portfolio of 30 patents across nine internationally recognized patent families covering organic materials, photovoltaic device architecture and manufacturing processes. This intellectual property gives us a strong foundation to continue advancing our core OPV technology while exploring new opportunities in organic electronics.

Innovation is also about making our technology easier to integrate and faster to deploy. Our goal is to reduce complexity for OEMs so they can bring new products to market more quickly.

While OPV remains our core business, it is only one application of a broader technology platform. The expertise we have developed creates opportunities across a broader range of organic electronics applications. That’s why we recently announced that we are exploring the potential of applying this expertise to OLED technology.

Our ambition is to make organic electronics a practical technology for large-scale commercial applications.

Also Read:

Executive Interview with Genta Taniguchi of Kyocera

CEO Interview with Tom (TJ) Jackson of Softchip

CEO Interview with Yossi Meyouhas of Xsight Labs


Podcast EP353: What Real-Time Visibility Is and Why it Matters with yieldHUB’s John O’Donnell

Podcast EP353: What Real-Time Visibility Is and Why it Matters with yieldHUB’s John O’Donnell
by Daniel Nenni on 07-03-2026 at 2:00 pm

Daniel is joined by John O’Donnell, Founder and CEO of yieldHUB, a pioneering leader in advanced data analytics for the semiconductor industry. Since establishing the company in 2005 he has transformed it from a two-person startup into a trusted multinational partner that empowers some of the world’s leading semiconductor companies to improve yield, reduce test costs, boost engineering efficiency and enhance quality.

Dan explores real-time visibility of the test floor with John, who explains how Yield Hub Live delivers this unique capability. John describes the many benefits real-time visibility can deliver. Insights into test floor operations allow KPIs to be developed around activities such as retest, binning, and tester idle time. This kind of visibility allows significant optimization of operations regarding items such as efficiency, quality and yield.

The impact of real-time visibility can be significant and is very accessible. John explains that yieldHUB has built the required infrastructure over several years. This allows real-time visibility to be implemented in a large operation within weeks, with important insights delivered in days after implementation.

Contact yieldHUB

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.


Executive Interview with Genta Taniguchi of Kyocera

Executive Interview with Genta Taniguchi of Kyocera
by Daniel Nenni on 07-03-2026 at 2:00 pm

Headshot Genta Taniguchi

Genta Taniguchi serves as Executive Officer and Head of the Corporate Ceramic Materials Semiconductor Components Group at Kyocera Corporation. He leads initiatives in advanced ceramics and semiconductor-related technologies, supporting the company’s global business in electronic and communication components.

With extensive experience in Kyocera’s core materials and semiconductor businesses, he plays a key role in driving innovation and strengthening the company’s global competitiveness in advanced ceramics and semiconductor packaging solutions.

Tell us about your company.

Kyocera was founded in 1959 in Kyoto, Japan, as a manufacturer of advanced ceramic materials designed to solve specific engineering challenges. Today, Kyocera provides semiconductor, electronic and optical components, communications-related components, machine tools, printing devices and document solutions. Even as the company has grown, advanced ceramics remain our core competency. With more than 73,000 employees across 279 group companies worldwide, Kyocera operates on a global scale.

Kyocera’s first subsidiary outside of Japan, Kyocera International, Inc., was established in Sunnyvale, California in 1969, during the emergence of Silicon Valley. In 1971 we acquired ceramic package manufacturing operations from Fairchild Semiconductor in San Diego, becoming the first Japanese technology company with a manufacturing plant in the State of California.

While Kyocera is widely recognized as a leader in advanced ceramics and holds a leading share of the global ceramic package market, what truly sets us apart is our integrated development and manufacturing infrastructure, spanning materials, design, evaluation and mass production. These foundational technologies are key to maximizing semiconductor performance.

As fields such as AI, data centers, optical communications and mobility continue to evolve, demand is growing for our semiconductor-related technologies, including ceramic packages, semiconductor manufacturing components, substrates, wireless and optical components and assembly services. Through these technologies, Kyocera continues to contribute to the advancement of many industries.

What problems are you solving?

Our engineering solutions focus on the intersection of four major challenges in next-generation electronics: performance, reliability, mass producibility and sustainability. AI semiconductors and optical devices are expected to deliver unprecedented performance improvements, from computational processing to communication speed. In the process, however, challenges like heat generation, increased power consumption, packaging density, signal integrity and long-term reliability are becoming even more severe.

Kyocera addresses these challenges through its ceramic packaging technologies, combining advanced materials, manufacturing processes and high-frequency design expertise. For example, we are developing advanced semiconductor packages for AI data centers, including multilayer ceramic core substrates that provide outstanding rigidity and enable fine wiring.

In next-generation optical communications, we manufacture high-speed communication packages and substrates to support further breakthroughs in data transmission speeds.

Focusing on materials and packaging technologies, our role is to support the evolution of semiconductors and optical devices, contributing to improved performance and reliability.

What application areas are your strongest?

Kyocera’s ceramics deliver a set of mechanical, chemical, thermal and electrical properties not found in any other material. As a result, we can design solutions to solve engineering challenges that conventional materials cannot solve.

Looking ahead, as AI becomes more widespread, advanced semiconductor packaging will be increasingly critical to optimizing computing performance, power efficiency and thermal management. Kyocera’s strength is its ability to provide technologies that address all these areas simultaneously.

What keeps your customers up at night?

Our customers’ main concerns are managing increasingly complex development challenges driven by technological advances and ensuring supply chain stability during mass production.

In AI, data centers, automotive electronics and telecommunications infrastructure, product generations evolve rapidly. Performance requirements rise year after year. At the same time, there can be no compromise on quality, reliability or supply chain stability.

In semiconductors and optical communications, even seemingly minor differences in the characteristics of packages or substrates can significantly affect the final product’s power consumption, thermal performance, signal integrity and manufacturing yield. Customers need partners who can help them solve these challenges with an eye toward next-generation architecture. They need more than components that merely meet specifications.

By integrating our extensive technological capabilities, including materials development, evaluation, analysis and process technologies, we support customers from design to mass production.

What does the competitive landscape look like, and how do you differentiate?

First, Kyocera’s differentiation is in materials technologies, particularly advanced ceramics. We offer different ceramic material formulations, including oxides, non-oxides. Our expertise spans ceramic materials, metallization, heterogeneous material bonding and analysis technologies.

Second, we have extensive experience in semiconductor package design and manufacturing to maximize semiconductor performance.

Third, we have a global manufacturing, sales and technical support infrastructure.

Focusing on an individual differentiator is no longer enough. Kyocera’s business model begins with a deep understanding of the customer’s design philosophy, which allows us to provide comprehensive proposals covering materials, structures, processes and reliability evaluation.

What new features/technology are you working on?

One key area is advanced semiconductor packaging for AI data centers. In April 2026, we announced the development of multilayer ceramic core substrates. These are designed to achieve higher rigidity and enable finer wiring for xPUs, switch ASICs and other advanced semiconductors in development.

At OFC 2026, we exhibited products for the latest high-speed optical communications, including solutions for co-packaged optics (CPO).

How do customers normally engage with your company?

It generally starts by discussing technical challenges. We listen to the latest challenges the customer is confronting. These may involve thermal, mechanical, electrical or optical challenges, not only at the individual device level, but also at the system or module level in terms of how overall requirements are fulfilled. This gives us a foundation to propose the optimal materials, structures, packages and processes for highly individual needs.

Kyocera operates globally. Through our regional sales and technical networks, we engage closely with our customers. Our strength lies in our ability to support every stage of the process: technical consultations, joint development, prototyping, evaluation and mass production. This support also includes direct collaboration between our engineers and those of our customers to solve challenges together.

In semiconductors, optical communications, AI, automotive and industrial equipment, balancing speed of response with quality is critical. Kyocera aims to help our customers commercialize game-changing products. Whether the initial engagement begins through our website, a trade show or a private meeting, we strive to connect from an early stage and support our customers’ long-term technical roadmaps.

Also Read:

CEO Interview with Tom (TJ) Jackson of Softchip

CEO Interview with Yossi Meyouhas of Xsight Labs

CEO Interview with Mark Goranson of EMASS


Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative Matters

Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative Matters
by Daniel Nenni on 07-03-2026 at 10:00 am

Driving the Future through the “Talent Empowering Program” Why TSMC Charity Foundation’s Youth Career Initiative Matters

The future of work will not be shaped by technology alone. It will be shaped by whether young people are given the confidence, skills, and guidance to participate in that future. This is why the TSMC Charity Foundation’s “Technical and Vocational Talent Empowerment Program” matters. By connecting schools, industry partners, local governments, and universities, the program addresses one of the most urgent challenges facing education today: the gap between what students learn in school and what they need to succeed in real careers.

Launched through collaboration with the Hsinchu County and City Governments, Kuang-Fu High School, and Minth University of Science and Technology, the program focuses on both teachers and students. Its dual strategy is simple but powerful: help junior high school teachers provide better career guidance, while giving vocational high school students practical exposure to industry expectations. According to TSMC’s sustainability report on the initiative, the program invited 27 junior high school teachers from Hsinchu City to visit vocational education sites and learn directly from educators and automotive industry leaders.

This teacher-focused approach is especially important. Students often make early decisions about academic tracks and career pathways before they fully understand the opportunities available to them. When teachers are equipped with current industry knowledge, they can guide students more effectively and help them choose paths that match their interests, strengths, and long-term goals. This is not just career counseling; it is a form of social empowerment.

The program also gives students something that traditional classrooms often struggle to provide: hands-on experience. Through visits, demonstrations, mentorship, and exposure to departments such as automotive technology and intelligent vehicles, students gain a clearer picture of what modern technical careers look like. Industry partners including Lexus, Mazda, and Porsche-related representatives helped introduce students and teachers to hiring trends, industry-academia collaboration, and pathways from vocational education to employment.

Why does this matter? Because technical and vocational education can be a powerful engine of upward mobility. For many young people, especially those outside elite academic tracks, practical skills can become a direct route to stable employment, dignity, and long-term development. The TSMC Charity Foundation’s broader work has long included rural empowerment and employability initiatives, including career exploration videos, job fairs, and partnerships designed to help students understand real workplace possibilities.

The initiative also matters to industry. Taiwan’s economy depends heavily on advanced manufacturing, semiconductors, smart mobility, and precision technology. These sectors require not only engineers and researchers, but also skilled technicians, operators, maintenance professionals, and applied specialists. A sustainable talent pipeline cannot be built at the point of hiring alone. It must begin earlier, when students are forming their identities and imagining their futures.

At its core, the Talent Empowering Program is not simply about filling jobs. It is about helping young people see possibilities that may once have felt distant or invisible. Alumni mentorship, industry visits, and applied learning experiences allow students to connect classroom knowledge with real-world purpose. That connection can transform hesitation into confidence and uncertainty into direction.

The program’s significance also lies in its collaborative model. No single school, company, or government agency can solve the education-employment gap alone. By bringing together public institutions, vocational schools, universities, and global industry brands, the TSMC Charity Foundation demonstrates how social impact can be practical, targeted, and scalable.

Bottom line: As the Foundation continues expanding career exploration opportunities in 2026, the program offers an important lesson: investing in youth competitiveness is not charity in the narrow sense. It is an investment in social resilience, industrial sustainability, and shared prosperity. When young people are empowered to build skills, understand industries, and choose careers with confidence, they do more than prepare for the future. They help drive it.

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Foundation IP for Intel 18A: Technical Overview and Why It Matters

Foundation IP for Intel 18A: Technical Overview and Why It Matters
by Daniel Nenni on 07-03-2026 at 6:00 am

Intel 18A Foundation IP Synopsys

Synopsys Foundation IP for Intel 18A is a portfolio of semiconductor building blocks designed to help system-on-chip developers build advanced chips with better power, performance, and area, often called PPA. The offering includes embedded memory compilers, standard-cell logic libraries, and input/output libraries for Intel’s 18A process technology. In practical terms, this means chip designers do not need to create every low-level circuit block from scratch. Instead, they can use pre-designed, characterized, and silicon-proven IP blocks that are optimized for Intel 18A and integrated into standard design flows.

Having spent a significant portion of my career in Standard Cells, SRAM, I/Os and other IP (Sagantec, Prolific, Virage Logic, Solido Design), I know first hand how important this is. In fact, Synopsys bought Virage Logic and is still the #1 SRAM provider. Siemens EDA bought Solido and they are also #1 in SRAM and Standard Cell characterization. Sagantec ended up at Applied Materials and Arm bought Prolific.

Technically, the memory portion is one of the most important parts of the portfolio. Modern SoCs rely heavily on embedded SRAM and register files because processors, AI accelerators, networking chips, and storage controllers all need fast local memory. Synopsys provides several memory architectures, including single-port SRAM, one-port register files, two-port register files, and pseudo-two-port memory options. These are offered in high-speed, high-density, and ultra-high-density versions, allowing designers to choose whether performance, area, or power efficiency is the priority. The datasheet also highlights advanced power-management modes such as light sleep, deep sleep, shutdown, periphery-off operation, power gating, level shifters, and support for dynamic voltage and frequency scaling. These features matter because memory can consume a large share of chip area and energy, especially in AI and high-performance computing designs.

The logic library portion provides standard cells, which are the basic logic gates and sequential elements used to construct digital circuits. Synopsys offers two major architectures: H180 for high-speed designs and H160 for high-density designs. The high-speed library targets applications such as GHz-class processors, high-speed communications, and high-performance computing, while the high-density library supports compact and power-efficient SoC implementation. The libraries support multiple threshold-voltage options, including high-performance and low-leakage variants, giving designers flexibility to tune timing, leakage, and switching power across different parts of a chip. The inclusion of multi-bit flip-flop kits is especially relevant for AI workloads because blocks with high switching activity can benefit significantly from reduced clock power.

The portfolio also includes power optimization kits, isolation cells, level shifters, retention flip-flops, power switches, and ECO kits. These components are essential for real commercial chip design because modern SoCs are divided into many power domains. Some blocks may be shut down, placed into standby, or run at different voltages depending on workload. Without robust power-management cells, it is difficult to achieve aggressive battery-life, thermal, and reliability targets.

The IO libraries extend the offering beyond internal logic and memory. Synopsys provides GPIO, I3C, I2C, crystal oscillator, and LVDS IP. These blocks allow the SoC to communicate with sensors, peripherals, clocks, boards, and high-speed external interfaces. The datasheet notes support for programmable IO voltages, fail-safe options, Schmitt triggers, spike filtering, power sequencing independence, open-drain modes, and LVDS power-saving features. These details are not glamorous, but they are crucial because many chip failures occur at interfaces, power boundaries, and system-level integration points rather than inside the main compute core.

Why does this matter?

First, foundation IP reduces design risk. At advanced process nodes, creating reliable memories, logic cells, and IO from scratch is expensive, slow, and technically risky.

Second, it accelerates time to market because teams can focus engineering effort on differentiated architecture rather than basic circuit infrastructure.

Third, it improves PPA, which directly affects product competitiveness in mobile, automotive, AI, HPC, networking, servers, and storage. The automotive-grade support, including ISO 26262 ASIL-D random hardware fault analysis and AEC-Q100 reliability qualification, makes the IP relevant for safety-critical SoCs.

Bottom Line: Synopsys Foundation IP for Intel 18A matters because it turns a cutting-edge manufacturing process into a practical design platform that companies can use to build real, reliable, power-efficient chips faster.

Also Read:

Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?

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WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools

WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools
by Daniel Nenni on 07-02-2026 at 2:00 pm

webinar square AI 2026 v2

The real promise of AI in EDA is not to replace EDA tools or reinvent design flows, it is to help engineers accomplish existing tasks even more complex design tasks faster, more safely, and with far less tool expertise than was previously required.

The webinar explores what a truly effective AI-powered EDA tool should look like, and what it must deliver to make that promise real.

REGISTER HERE

First Aspects to Consider

Security comes first. The ideal tool runs entirely on-premise and requires no external communication once installed, ensuring your sensitive design data never leaves your infrastructure. Flexibility matters just as much. The tool should work equally well with commercial and open-source LLMs, giving several corporations the freedom to choose what fits their environment and their budget.

Speed of deployment is also expected when adopting an AI assistant for an EDA tool. Indeed, faster deployment means faster results. New tool-based flows and AI-assisted applications should be ready in minutes, not weeks, so that teams can respond quickly to design challenges without lengthy integration efforts.

Also, rather than blindly sending data to an LLM, the tool should manage token consumption carefully, balancing output quality against cost to deliver accurate and reliable results without unnecessary overhead.

Expected Benefits

Major benefit is a step-change in usability. Junior engineers and occasional users should be able to complete complex EDA tasks from day one, without spending months mastering commands and APIs. This means generating scripts on demand in the language of their choice, and running tools interactively or in background with minimal prior knowledge. When less experienced users can safely execute tasks that previously required a specialist, the entire design team moves faster and delivers more.

Also, a well-built AI-powered EDA tool also improves interoperability with the rest of the design environment, streamlining file preparation and automating compliance checks. It keeps pace with the fast-moving AI landscape without disrupting existing workflows.

Finally, support for multiple human languages removes barriers for global design teams across different regions and cultures.

Meet Defacto’s AI Assistant

Defacto’s AI Assistant, a production-ready tool, was built to deliver every requirements mentioned. It is already in use by early adopters who are reporting significant acceleration in their design tasks, with less reliance on tool experts and greater confidence in their results.

Several design tasks such as (i) structural checks between RTL and design collaterals, or (ii) reusing +90% from previous design projects or (iii) building complex Subsystems including their related RTL, IP-XACT and design collaterals are made now much more simple with the Defacto’s AI Assistant.

Join this webinar to see what effective AI integration looks like in practice, and to discover how Defacto’s AI Assistant can start making your design work faster, safer, and more autonomous  right away.

Abstract:

As SoC design complexity grows and design windows shrink, EDA tools must evolve beyond traditional workflows. AI is the catalyst!

This webinar explores what the next generation of EDA tools and design platforms should look like when built with AI in the middle. We’ll define the key criteria that make an AI-powered EDA environment truly effective and also examine how AI is fundamentally transforming the SoC designer experience.

We’ll demonstrate how Defacto’s AI Assistant and MCP Server architecture delivers these criteria today, providing a secured, scalable, and LLM-agnostic foundation that keeps pace with the rapid evolution of AI technologies to help facing SoC design challenges and enabling a better management of aggressive PPAs and design cost. Join us to see what how Defacto’s AI-Powered EDA tools is boosting SoC Design!

Join us to see what how Defacto’s AI-Powered EDA tools is boosting SoC Design!

When:  Monday, July 13th at 10AM – 11AM PDT

Registration link: https://register.gotowebinar.com/register/8314915304432085845

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Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too Late

Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too Late
by Mike Gianfagna on 07-02-2026 at 10:00 am

Webinar Caspia Shows You How to Fix Security Flaws Before It’s Too Late FINAL V2

Chip-level vulnerability is becoming an existential threat for virtually all systems. The time to ensure your chip designs are resistant to these attacks is now. Caspia presented a webinar recently that provides important information on how to build attack-resistant chips. If you missed it, don’t worry. A replay link is coming. First, let’s examine how Caspia shows you how to fix security flaws before it’s too late.

The Presenters

This webinar was presented in collaboration with SemiWiki and Caspia Technologies. Presenting for Caspia were:

Beau Bakken

Beau Bakken, who provided an overview of the new AI-driven features of the latest release of CODAx, Caspia’s RTL static security enhancement tool.  Beau is VP of Products at Caspia. He works on the definition of new products and the associated go-to-market strategies. Beau has been with Caspia for over five years. Before that, he spent time at the National Science Foundation.

Dr Zahin Ibnat

Dr. Zahin Ibnat then presented actual results that CODAx found in a popular root-of-trust design. She explained the nature of the security flaws and ran a live hands-on demo of CODAx. Zahin is an R&D Application Engineer at Caspia. She works with customers to ensure effective deployment of Caspia’s solutions.

The Presentation

Beau began the webinar with a presentation that covered many key topics. He provided an overview of the growing threat landscape. The statistics he shared may shock you. What you don’t know can hurt you. AI agents such as Claude Mythos are autonomously discovering and exploiting vulnerabilities at machine speed. Are you ready for these assaults?

Beau then explored what’s needed to build the required security verification and repair into your design flow. Expertise and scalability are key requirements here. He described how Caspia’s static RTL checking tool, CODAx adds critical security checking and repair capabilities to any design flow. He showed how to expand your existing Lint processes to include extensive security checks with a tool that is built for non-security engineers. The figure below illustrates how CODAx fits into existing flows.

CODAx in the Design Flow

He then covered some of the very useful new features of the recent CODAx release. These include:

Asset Assist: that automatically identifies security-critical assets, eliminating manual security annotation for certain CODAx checks. This reduces reliance on security experts, enabling non-experts to run with minimal setup.

Report Assist: that summarizes complex violation reports, condensing detailed findings into clear, high-level insights. This facilitates prioritizing highest-risk issues by ranking violations based on impact and exploitability. The result is streamlined triage and remediation, providing a guided context to accelerate debugging and fixes.

The Demo

Dr. Zahin Ibnat provided a comprehensive hands-on security analysis demo. The popular Caliptra open-source root-of-trust design was the primary focus here. She began with a detailed overview of the design and how CODAx was applied to it. She described the security issues that were found. A summary of these security issues is shown in the figure below.

Overview of Caliptra Issues Found

She then went through the details of how CODAx was applied to the design and how the various security risks were identified. The flow is quite easy to follow. The expertise that CODAx adds to all design flows is very clear. Any engineer can apply expert-level security analysis with this flow. There are many examples of how CODAx simplifies the process. The figure below shows an example of the impact that the new Asset Assist feature delivers.

Impact of Asset Assist

Zahin showed many more security analysis scenarios to identify and fix weaknesses. She concluded with a deep dive on four example violations. By the end of this webinar, you will start to feel like a security expert.

To Learn More

Thanks to sophisticated AI, a growing security threat is coming. This webinar shows you how to be ready for it. If you’re involved in complex chip design, it is a must-see event. You can watch the webinar replay here. And that’s how Caspia shows you how to fix security flaws before it’s too late.

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Why Real-Time Intelligence is the Next Differentiator in Semiconductor Test

Why Real-Time Intelligence is the Next Differentiator in Semiconductor Test
by Mike Gianfagna on 07-02-2026 at 6:00 am

Why Real Time Intelligence is the Next Differentiator in Semiconductor Test

Even with advances in AI, automation, and advanced process technology, many semiconductor test operations still rely on reports generated hours after production has occurred. This creates a significant and growing problem. By the time engineers discover a yield excursion, parametric drift, tester issue, or an increase in re-test activity, thousands of devices may already have moved through production. The speed at which all this occurs creates a substantial blind spot. The challenge is no longer collecting data. Real competitive advantage comes from understanding what the data means and reacting to problems while production is still running. This is real-time intelligence.

yieldHUB is delivering this important capability with yieldHUB Live. I recently looked at some of the new things yieldHUB is doing here. This post isn’t about the specific capabilities yieldHUB offers. Instead, we’ll look at the trends in semiconductor manufacturing to understand why real-time intelligence is the next differentiator in semiconductor test

What Changed?

In a word, velocity. The test floor for most semiconductor manufacturing operations now processes a huge volume of larger and more sophisticated parts. Because of the extreme complexity involved, issues can grow and compound very quickly. And the global supply chain makes the problem worse. The sooner test issues are spotted, the faster they can be corrected. Despite these observations, the test floor often continues to operate as a black box.

The process is essentially this: lots enter production, devices are tested, and results arrive later. What happens during production is often difficult to see in real time. This is due to the historical setup of these operations to capture data and process it later.

There is a better way. Today’s test operations need continuous visibility into things like:

  • Tester performance
  • Yield trends
  • Parametric behavior
  • Re-test activity
  • Utilization and downtime

If we can transform the test floor from a black box into a transparent operational environment, we can achieve real-time intelligence. The benefits can be substantial. Let’s take a closer look.

A Better Way

Traditional workflows are reactive. The typical process involves:

  • Production runs
  • Reports are generated
  • Engineers investigate what happened

But what if real-time monitoring was possible? The result is a more proactive manufacturing environment that allows:

  • Detection of yield excursions while lots are still on test
  • Identification of tester issues before they impact additional production
  • Monitoring parametric drift as it develops

All this allows immediate action instead of waiting for reports.  The conversation shifts from What happened? to What should we do now?

Small operational improvements can create a substantial financial impact. In high-volume semiconductor manufacturing, even a small improvement in tester utilization can generate significant financial returns.

Real-time Intelligence helps manufacturers:

  • Reduce unnecessary re-test
  • Improve overall equipment efficiency (OEE)
  • Increase tester utilization
  • Minimize downtime
  • Recover hidden capacity
  • Increase throughput without purchasing additional equipment

Often, the fastest capacity gain comes from optimizing existing assets rather than buying new ones. yieldHUB has demonstrated that achieving real-time intelligence should not require new testers. The company achieves this goal with capabilities such as:

  • The ability to work with legacy and modern testers
  • Require no hardware modifications for implementation
  • Require no test program changes
  • Do not increase test time

Manufacturing execution systems (MES) have been a critical component for semiconductor operations. While this is still true, it’s important to understand that MES tracks transactions, real-time systems drive action. Recording activity is different from understanding what is happening right now.

A real-time manufacturing intelligence layer adds:

  • Continuous production visibility
  • Live yield monitoring
  • Parametric monitoring
  • Operational alerts
  • Cross-site visibility
  • Immediate decision support

The value comes from turning manufacturing data into operational action. Real-time data answers What is happening right now? Historical data answers Why is it happening?  When real-time visibility is combined with years of manufacturing history, engineers can:

  • Compare current behavior against historical baselines
  • Accelerate root cause analysis
  • Improve confidence in decision making
  • Understand trends across products, sites, testers, and programs

Visibility without context creates alerts. Visibility with context creates understanding.

The Global Perspective

Today’s semiconductor supply chain spans multiple sites, companies, and geographies. Fabless companies and IDMs increasingly need:

  • Real-time visibility into OSAT performance
  • Faster detection of yield and parametric drift
  • Reduced dependence on manual reports
  • Site-to-site comparisons
  • Data-driven collaboration with manufacturing partners

Real-time intelligence strengthens relationships across this semiconductor ecosystem. Real-time data also creates the foundation for AI and digital twins. AI and advanced analytics require high-quality operational data. Real-time production monitoring can create structured manufacturing datasets that support:

  • AI-driven optimization
  • Predictive analytics
  • Digital twins
  • Advanced operational modeling

It is important to understand that before AI can optimize semiconductor manufacturing, manufacturers must first see what is happening in real time.

To Learn More

In this post, we’ve looked at the impact of real-time intelligence. The manufacturers that gain competitive advantage over the next decade will not necessarily be those with the most data.

Rather they will be the organizations that can:

  • Detect issues earlier
  • Make decisions faster
  • Improve utilization continuously
  • Act while production is still running

In speaking with the folks at yieldHUB, they shared some comments they have received:

“Where this really hits home is in the coming expansion of the industry with new plants and equipment being built out, real-time data should be considered standard operating procedure.”

“Real-time monitors (KPI) help us to be more predictive and reliable in our success.”

“Seamless real-time is really here.”

If the comments made here resonate with you, you can learn more about real-time intelligence and yieldHUB live here. And that’s why real-time intelligence is the next differentiator in semiconductor test.

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yieldHUB Expands Its Impact with New Technology and a New Website

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