ASML EUV Update at SPIE

ASML EUV Update at SPIE
by Scotten Jones on 06-24-2022 at 6:00 am

12051 4 SPIE2022 Smeets 0.33 NA EUV systems for High Volume Manufacturing Page 07

At the 2022 SPIE Advanced Lithography Conference, ASML presented an update on EUV. I recently had a chance to go over the presentations with Mike Lercel of ASML. The following is a summary of our discussions.

0.33 NA

The 0.33 NA EUV systems are the production workhorse systems for leading edge lithography today. 0.33 NA systems are… Read More


ASML Too Much Demand Plus Intel and High NA

ASML Too Much Demand Plus Intel and High NA
by Robert Maire on 01-23-2022 at 6:00 am

ASML High NA Intel

Too much demand- A “good” problem-Managing supply & capacity-Intel & Hi NA

ASML great Q4 results-Demand off charts-Supply constrained
-Dealing with chain issues, putting out fires, expediting
-Looking forward to next gen High NA in 2024/2025
-Intel’s order doesn’t give advantage,… Read More


SPIE 2020 – ASML EUV and Inspection Update

SPIE 2020 – ASML EUV and Inspection Update
by Scotten Jones on 04-20-2020 at 10:00 am

0.33 NA EUV systems for HVM Ron Schuurhuis Page 02

I couldn’t attend the SPIE Advanced Lithography Conference this year for personal reasons, but last week Mike Lercel of ASML was nice enough to walk me through the major ASML presentations from the conference.

Introduction
In late 2018, Samsung and TSMC introduced 7nm foundry logic processes with 5 to 7 EUV layers, throughout … Read More