Semicon West – The FDSOI Ecosystem

Semicon West – The FDSOI Ecosystem
by Scotten Jones on 07-21-2017 at 12:00 pm

At Semicon West last week I attended presentations by Soitec and CEA Leti, and had breakfast with CEA Leti CEO Marie Semeria, key members of the Fully Depleted Silicon On Insulator (FDSOI) ecosystem. I have also seen some comments in the SemiWiki forum lately that make me believe there is some confusion on the roles of different companies… Read More


Standard Node Trend

Standard Node Trend
by Scotten Jones on 07-15-2017 at 4:00 pm

I have previously published analysis’ converting leading edge logic processes to “standard nodes” and comparing standard nodes by company and time. Recently updated details on the 7nm process node have become available and in this article, I will revisit the standard node calculations and trends.… Read More


Exclusive – GLOBALFOUNDRIES discloses 7nm process detail

Exclusive – GLOBALFOUNDRIES discloses 7nm process detail
by Scotten Jones on 07-08-2017 at 7:00 am

In a SemiWiki EXCLUSIVE – GLOBALFOUNDRIES has now disclosed the key metrics for their 7nm process. As I previously discussed in my 14nm, 16nm, 10nm and 7nm – What we know now blog GLOBALFOUNDRIES licensed their 14nm process from Samsung and decided to skip 10nm because they thought it would be a short-lived node. At … Read More


LETI Days 2017: FD-SOI, Sensors and Power to Sustain Auto and IoT

LETI Days 2017: FD-SOI, Sensors and Power to Sustain Auto and IoT
by Eric Esteve on 07-07-2017 at 7:00 am

I have attended last week to the LETI Days in Grenoble, lasting two days to mark the 50[SUP]th[/SUP] anniversary of the CEA subsidiary. Attending to the LETI Days is always a rich experience: LETI is a research center counting about 3000 research engineers, but LETI is also a start-up nursery. The presentations are ranging from Read More


Bosch to Build $1.1 Billion Fab for Automotive and IoT!

Bosch to Build $1.1 Billion Fab for Automotive and IoT!
by Daniel Nenni on 07-02-2017 at 7:00 am

There has been quite a bit of coverage on this already but Bosch building a fab in Dresden is a big deal so let me share my experience, observation, and opinion as us bloggers do. The $1.1B question of course is: Why didn’t Bosch invest in GlobalFoundries FD-SOI fabs in Dresden instead? Automotive and IoT is perfect for FD-SOI,… Read More


FD-SOI in Japan?

FD-SOI in Japan?
by Adele Hars on 05-27-2017 at 7:00 pm

If you want to get your finger on the Japan FD-SOI pulse, registration is still open for a free, two-day workshop in Tokyo this week organized by the SOI Consortium. This is the 3rd Annual SOI Tokyo Workshop, and there’s a really interesting line-up of speakers.

In case you’re wondering, Japan is doing FD-SOI. In fact… Read More


14nm 16nm 10nm and 7nm – What we know now

14nm 16nm 10nm and 7nm – What we know now
by Scotten Jones on 04-07-2017 at 7:00 am

Last week Intel held a manufacturing day where they revealed a lot of information about their 10nm process for the first time and information on competitor processes continues to slowly come out as well. I thought it would be useful to summarize what we know now, especially since some of what Intel announced was different than what… Read More


Shootout at 22nm!

Shootout at 22nm!
by Scotten Jones on 04-03-2017 at 4:00 pm

For an industry that drives improvement at an exponential rate it is funny how often something old is new again. Intel went into high volume production on 22nm in 2011, and TSMC and Samsung have both had 20nm technologies in production for several years. And yet, recently we have seen renewed interest in 22nm. GLOBALFOUNDRIES has… Read More


Intel Manufacturing Day: Nodes must die, but Moore’s Law lives!

Intel Manufacturing Day: Nodes must die, but Moore’s Law lives!
by Scotten Jones on 03-29-2017 at 4:00 pm

Yesterday I attended Intel’s manufacturing day. This was the first manufacturing day Intel has held in three years and according to Intel their most in depth ever.

Nodes must die
I have written several articles comparing process technologies across the leading-edge logic producers – GLOBALFOUNDRIES, Intel, Samsung… Read More


SPIE 2017: EUV Readiness for High Volume Manufacturing

SPIE 2017: EUV Readiness for High Volume Manufacturing
by Scotten Jones on 03-03-2017 at 12:00 pm

The SPIE Advanced Lithography Conference is the world’s leading conference addressing photolithography. This year on the opening day of the conference, Samsung and Intel presented papers summarizing the readiness of EUV for high volume manufacturing (HVM). In this article, I will begin by summarizing the EUV plans … Read More