Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More
ANSYS and TSMC will be co-presenting at ARM TechCon on Multiphysics Reliability Signoff for Next Generation Automotive Electronics Systems. The event is on Thursday October 26th, 10:30am-11:20am in Grand Ballroom B.
You can get a free Expo pass which will give you access to this event HERE and see the session page for the event … Read More
In automotive applications, advanced FinFET processes are great for high levels of integration and low power. But they also present some new challenges in reliability signoff. Ansys will be hosting a webinar to highlight the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge… Read More
Simulation is a broad technique spanning certainly digital logic and circuit simulation but also methods beyond these which are particularly relevant to ADAS design. In fact, much of the design of full ADAS systems begins and ends with these types of modeling. This is in part due to the need fully validate integrity and reliability… Read More
Do not lose sleep worrying that your integrated circuits might fail during EOS/ESD events. Join us for the 38th annual EOS/ESD Symposium in Anaheim, CA in September. Experts on the field will address the latest research on EOS and ESD in the rapidly changing world of electronics.
As electronics continue to become commonplace in… Read More
In the largest and fastest growing categories in electronics – mobile, IoT and automotive – analog is playing an increasingly important role. It’s important in delivering high integrity power and critical signals to the design though LDO regulators and PLLs, in managing high speed interfaces like DDR and SERDES, in interfacing… Read More
The ‘Dual diode’ approach is one of the most used on-chip and off-chip concept for ESD protection of IO interfaces. It is simple to implement, smaller than any other IO/ESD concept, has a low parasitic capacitance and low leakage.… Read More
Last year, about 40% of new smartphones included Near Field Communication (NFC). Analysts predict that by 2017 there will be 1 billion NFC enabled phones. Clearly, the use of NFC is ramping up because it can simplify aspects as diverse as communication, secure payments, user authentication, and retail loyalty programs for instance.… Read More
Sofics recently had the opportunity to characterize FinFET technology through cooperation with one of its customers. We analyzed the technology related to ESD and identified several challenges.… Read More
Often when a company starts out it takes a while for it to find the sweet spot in the marketplace. Very often it is feedback from existing customers and business success that can help point the way for small companies as they grow. This is just as true in EDA as it is in retailing or consumer products. For instance, Mentor Graphics, though… Read More
