Time:
August 31, 2021
11:30 AM EDT / 4:30 PM BST / 9 PM IST
Venue:
Online
As semiconductors move into the wafer-scale chip and chiplet era, there is increased focus on the power thermal and reliability area. One of the key aspects of reliability is ESD. While this phenomenon is understood at a higher-level, comprehending… Read More
In the past ESD sign-off has been accomplished by a combination of techniques. Often ESD experts are asked to look at a design and assess its ESD robustness based on experience gained from prior chips. Alternatively, designers are told to work with a set of rules given to them, again based on previous experience about what usually… Read More
Every chip needs ESD protection, especially RF, analog and nm designs. Because each type of design has specific needs relating to IOs, pad rings, operating voltage, process, etc. it is important that the ESD protection network is carefully tailored to the design. Also because of interactions between the design and its ESD protection… Read More
Verifying the Electrostatic Discharge (ESD) protection network on an IC can be challenging, and if it is not done correctly it can lead to failures on the tester, reduced product reliability or shortened field life. In this webinar you will learn how Magwel’s ESDi thoroughly analyzes all pad combinations in a design for comprehensive… Read More
Walking across a carpet can generate up to 35,000 volts of static charge, which is tens of thousands of times higher than the operating voltages of most integrated circuits. When charge build up from static electricity is exposed to the pins of an IC, the electrostatic discharge (ESD) protection network on the chip is intended to… Read More
With many design teams still searching for an effective means of identifying Charged Device Model (CDM) issues early in the design process, it comes as no surprise that events on this topic generate a lot of interest and are well attended. In July Magwel’s CEO Dr. Dundar Dumlugol had the honor of being invited by Professor Ming-Dou… Read More
Failures during manufacturing and assembly or in the field caused by charged device model (CDM) type ESD events are a serious concern for IC design teams. CDM failures are generally caused by charge build-up on device packages, which capacitively charge large internet nets, such as GND or VSS. Once a device pin contacts a current… Read More
In RF designs Low Noise Amplifiers (LNA) play a critical role in system operation. They simultaneously need to be extremely sensitive and noise free, yet also must be able to withstand strong signal input without distortion. LNA designers often struggle to meet device performance specifications. Their task is further complicated… Read More
During my trip through Asia last week I attended the Taiwan ESD Workshop. Hsinchu is densely populated with some of the smartest semiconductor people in the world so it is well worth the trip, absolutely. As it turns out ESD is one of the top concerns in semiconductor design and manufacture. The current rule based and simulation … Read More
Lurking inside of every Mosfet is a parasitic bipolar junction transistor (BJT). Of course, in normal circuit operation the BJT does not play a role in the device operation. Accordingly, SPICE models for Mosfets do not behave well when the BJT is triggered. However, these models work just fine for most purposes. The one important… Read More
