Dan is joined by Stephen Fairbanks, CEO of Certus Semiconductor. Stephen is an ESD pioneer with over 30 years of experience starting with his time at Intel, SRF Technologies, and now Certus Semiconductor.
Stephen describes the varied challenges of ESD andI/O library design presented by today’s technologies and design… Read More
The EOS/ESD Symposium is dedicated to the understanding of issues related to electrostatic discharge and electrical transients/overstress, and the application of this knowledge to the solution of problems in consumer, industrial, and automotive applications, including electronic… Read More
The semiconductor industry continues to drive innovation and constantly seeks methods to lower costs and improve performance. The advantages of custom I/O libraries versus free libraries can be seen as cost-savings or, more importantly, new markets, new customers, and new business
opportunities.
At DAC 2023, Certus Semiconductor… Read More
Trained as a semiconductor Analog and RF Circuit Designer, Stephen Fairbanks has been designing and developing process-specific I/O and ESD libraries for 24 years. His foundational training began while attending Brigham Young University designing highspeed 32 GSPS data acquisition systems and RF interfaces for a time-of-flight… Read More
Resistance checks between ESD diode cells and pads or power clamps, and current density analysis for such current flows are commonly used for ESD networks verification [1]. When such simulations use standard post-layout netlists generated by parasitic extraction tools, the calculated resistances may be dramatically higher… Read More
This webinar, the 4th in a 5-part series, explores the use of EMA3D tools in conjunction with other Ansys computational electromagnetic simulation tools for modeling and simulating EMI effects in entire electronic systems. Integrations between EMA3D products and other Ansys tools, solver technology details, and the ability
IC reliability is an issue that circuit design engineers and reliability engineers are concerned about, because physical effects like high Current Density (CD) in interconnect layers, or high point-to-point (P2P) resistance on device interconnect can impact reliability, timing or Electrostatic Discharge (ESD) robustness.… Read More
Time:
August 31, 2021
11:30 AM EDT / 4:30 PM BST / 9 PM IST
Venue:
Online
About this Webinar
As semiconductors move into the wafer-scale chip and chiplet era, there is increased focus on the power thermal and reliability area. One of the key aspects of reliability is ESD. While this phenomenon is understood at a higher-level, comprehending… Read More
In the past ESD sign-off has been accomplished by a combination of techniques. Often ESD experts are asked to look at a design and assess its ESD robustness based on experience gained from prior chips. Alternatively, designers are told to work with a set of rules given to them, again based on previous experience about what usually… Read More
Every chip needs ESD protection, especially RF, analog and nm designs. Because each type of design has specific needs relating to IOs, pad rings, operating voltage, process, etc. it is important that the ESD protection network is carefully tailored to the design. Also because of interactions between the design and its ESD protection… Read More
