Reliability sign-off has several aspects – One Solution

Reliability sign-off has several aspects – One Solution
by Pawan Fangaria on 09-01-2013 at 5:00 pm

Here, I am talking about reliability of chip design in the context of electrical effects, not external factors like cosmic rays. So, the electrical factors that could affect reliability of chips could be excessive power dissipation, noise, EM (Electromigration), ESD (Electrostatic Discharge), substrate noise coupling and… Read More


Power and Reliability Sign-off – A must, but how?

Power and Reliability Sign-off – A must, but how?
by Pawan Fangaria on 07-29-2013 at 11:00 am

At the onset of SoCs with multiple functionalities being packed together at the helm of technologies to improve upon performance and area; power, which was earlier neglected, has become critical and needs special attention in designing SoCs. And there comes reliability considerations as well due to multiple electrical and … Read More


Robust Reliability Verification: Beyond Traditional Tools and Techniques

Robust Reliability Verification: Beyond Traditional Tools and Techniques
by SStalnaker on 05-31-2013 at 7:10 pm

Robust Reliability Verification: Beyond Traditional Tools
by Matthew Hogan, Mentor Graphics

At all process nodes, countless hours are diligently expended to ensure that our integrated circuit (IC) designs will function in the way we intended, can be manufactured with satisfactory yields, and are delivered in a timely fashion… Read More


Layout-based ESD Check Methodology with Fast, Full-chip Static and Macro-level Dynamic

Layout-based ESD Check Methodology with Fast, Full-chip Static and Macro-level Dynamic
by Daniel Payne on 05-22-2013 at 10:25 am

Nvidia designs some of the most powerful graphics chips and systems in the world, so I’m always eager to learn more about their IC design methodology. This week I’ve had the chance to talk with Ting Ku, Director of Engineering at Nvidia about his DAC talkin the Apache booth in exactly two weeks from today. RegistrationRead More


ESD – Key issue for IC reliability, how to prevent?

ESD – Key issue for IC reliability, how to prevent?
by Pawan Fangaria on 04-23-2013 at 8:30 pm

It’s a common electrical rule that when large amount of charge gets accumulated, it tries to break any of its surrounding isolation. Although it wouldn’t have been prominent in 1980s or 90s, protection for ICs from such damaging effects is a must, specifically in large mixed-signal designs of today, working at different voltages… Read More


First Time, Every Time

First Time, Every Time
by SStalnaker on 01-21-2013 at 7:10 pm

While this iconic advertising phrase was first used to describe the ink reliability of a ballpoint pen, it perfectly summarizes the average consumer’s attitude toward automobile reliability as well. We don’t really care how it’s done, as long as everything in our car works first time, every time. Even when that includes heated… Read More


ESD Check Methodology

ESD Check Methodology
by Paul McLellan on 01-11-2013 at 5:12 pm

In Pune at the start of the month, Norman Chang, Ting-Sheng Ku, Jai Pollayil of Apache/Ansys and NVIDIA presented and ESD check methodologywith Fast Full-chip Static and Macro-level Dynamic Solutions . ESD stands for Elecro-Static Discharge and is basically injecting very high static voltages (think how your hand gets charged… Read More


Automating Complex Circuit Checking Tasks

Automating Complex Circuit Checking Tasks
by SStalnaker on 09-20-2012 at 7:24 pm

By Hend Wagieh, Mentor Graphics

At advanced IC technology nodes, circuit designers are now encountering problems such as reduced voltage supply headroom, increased wiring parasitic resistance (Rp) and capacitance (Cp), more restrictive electromigration (EM) rules, latch-up, and electrostatic discharge (ESD) damage,… Read More


PathFinder webinar: Full-chip ESD Integrity and Macro-level Dynamic ESD

PathFinder webinar: Full-chip ESD Integrity and Macro-level Dynamic ESD
by Paul McLellan on 08-01-2011 at 10:00 am

The PathFinder webinar will be at 11am Pacific time on Thursday 4th August. It will be conducted by Karthik Srinivasan, Senior Applications Engineer at Apache Design Solutions. Mr. Srinivasan has over four years of experience in the EDA industry, focusing on die, system, and cross-domain analysis. His professional interests… Read More


Low Power Webinar Series

Low Power Webinar Series
by Paul McLellan on 07-08-2011 at 4:57 pm

At DAC 2011 in San Diego, Apache gave many product presentations. Of course not everyone could make DAC or could make all the presentations in which they were interested. So from mid-July until mid-August these presentations will be given as webinars. Details, and links for registration, are here on the Apache website.

The seminars… Read More