Well a very belated Happy New Year dear reader. I must admit, it has been a very long winter and it has caused the Miller’s to rethink this vital question. “What in the world are we doing living in NY”. So we are moving, and hopefully this is my last ‘real’ winter as we headed down south. To perhaps alleviate some of the winter blues from … Read More
Doing a modern SoC design is all about assembling IP and adding a small amount of unique IC design for differentiation (plus, usually, lots of software). If you re designing in a mature process then there is not a lot of difficulty finding IP for almost anything. But if you are designing in a process that has not yet reached high-volume… Read More
Xilinx announced their quarterly results last week. They slightly missed their number due mainly to a decline in wireless sales. Of course Xilinx parts don’t go in the smartphones since the cost and power are too high, but they are very heavily used in basestation, backhaul etc especially in China. Xilinx’s business… Read More
I have seen a couple of posts comparing the density of the Apple A8 to the Intel Core M and concluding that the TSMC 20nm process is denser than the Intel 14nm process. In one of the threads one of the posters likened this to comparing apples to oranges, I agree except I think it is even worse than that, I think it is more like comparing apples… Read More
First I want recognize that IEDM once again provided all of the attendees with the proceedings as soon as we arrived at the conference, in fact the proceeding included every year of IEDM back to 1955. This is how a conference should be run! Anyone who read my blog about the SPIE Advanced Lithography Conference will know how frustrating… Read More
Most designers are not using FinFETs yet, however the increased transistor density and power advantages they offer are compelling. Smaller feature sizes have been a consistent driver in semiconductor technology. Eventually the market will move more and more to FinFET processes, increasingly leaving behind planar transistors.… Read More
This week is IEDM. Three of the presentations today were by TSMC, Intel and IBM going over some of the details of their 14/16nm processes. They don’t provide the slides at IEDM, just the single page papers so this may end up being a somewhat random collection of facts.
TSMC were up first. They talked about the improvements that… Read More
I came across a very interesting article/blog written over the weekend by Jean-Louis Gassée on Intel and mobile. It covers some similar ground to several of my blog posts on the topic but also has some new facts. And it has additional credibility since Jean-Louis was head of product development and worldwide marketing at Apple (pre-iPhone).… Read More
Last week was ASML’s investor day. I wasn’t there and they haven’t yet got the material posted on their website, so this is all second hand information. As you know, if you have read any of my comments on EUV, I have been dubious about whether EUV would ever work for production.
The three big problems seem to be:
The International Electron Devices Meeting (IEDM) is one of the premier conferences for the presentation of the latest semiconductor processes and process technologies. IEDM is held every year in December alternating between San Francisco and Washington DC. This year IEDM will be held at the San Francisco Hilton on December… Read More