The RISC-V and Open-Source Functional Verification ChallengeMost of the RISC-V action at the end…Read More
Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers2.5D package design is rapidly finding its stride…Read More
Addressing Reliability and Safety of Power Modules for Electric VehiclesAs electric vehicles (EVs) gain widespread adoption, safety,…Read More
Shaping Tomorrow’s Semiconductor Technology IEDM 2024Anyone who has read my articles about IEDM…Read More
SI and PI Update from Cadence on Sigrity XSignal Integrity (SI) and Power Integrity (PI) issues…Read More
During the weekend, I read two articles that highlighted Apple’s LCD supply chain build out and started to think of how this would look if Apple were to do the same on the x86 side of the ledger. The two articles, one related to Hitachi and Sony building a new 4” LCD for iphones and a more extensive one on Sharp building a new LCD for the iPAD3… Read More
I’ve blogged about the Calibre family of IC design tools before:
Smart Fill replaced Dummy Fill Approach in a DFM Flow
DRC Wiki
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
Who Needs a 3D Field Solver for IC Design?
Prevention is Better… Read More
When AMD announced its cutbacks recently many people were left wondering why they were so deep given the strong financial performance in Q3 and the guidance for an up Q4. It couldn’t have been related to the Thailand floods that could have been at most a one-quarter squeeze expected in Q1. Now it is apparent from reports that AMD’s … Read More
Interesting story, for my wife’s 50th birthday we went to Las Vegas to see Sir Elton John in concert. My wife is an Elton fan and this may be her last chance to see him live so off we went. I saw Elton and Billy Joel in a dueling piano concert a while back and it was simply amazing! The underlying purpose of the trip however was to earn “Perfect… Read More
Network-on-Chip (NoC) is an emerging paradigm for communications within large VLSI systems implemented on a single silicon chip. Sgroi et al. call “the layered-stack approach to the design of the on-chip intercore communications the Network-on-Chip (NOC) methodology.” In a NoC system, modules such as processor… Read More
Flash analog-to-digital converters (ADCs) are commonly used in high-frequency applications such as satellite communications, sampling oscilloscopes, and radar detection. Flash ADC is preferred over other ADC architectures because it is extremely fast and quite simple. However, flash ADC typically requires twice as many… Read More
David Liu receeived the Kaufman award for 2001 at the Kaufman award dinner a few weeks ago.
Or to be more formal about it:Dr. C. L. David Liu, the William Mong honorary chair professor of Computer Science and former president of the National Tsing Hua University in Hsinchu, Taiwan, will be presented with this year’s Phil Kaufman Award… Read More
Every week I receive several webinar invitations, so the recent one from Cadence about Virtuoso Multi-Mode simulation caught my fancy because I had met with John Pierce at DAC and wanted to see what was new since then and see how they compared with Mentor and Synopsys tools.
John Pierce, Product Marketing Director
This webinar runs… Read More
When AMD sought to shed its costly manufacturing operations, Ibrahim Ajami saw an interesting opportunity, one that promised to bring semiconductor manufacturing to Abu Dhabi. Let’s start with the January 2010 interview with Ajami, the 35 year old Chief Executive Officer of Advanced Technology Investment Company (ATIC), … Read More
The IEEE has an Orange Country Chapter of the Components, Packaging and Manufacturing Technology Society who are organizing an all-day workshop, 3D Integrated Circuits: Technologies Enabling the Revolution. This looks to be an informative day with real-world examples in both design and test being presented by over a dozen … Read More
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