Selling the Forges of the Future: U.S. Report Exposes China's Reliance on Western Chip ToolsThe U.S. House Select Committee on the Strategic…Read More
SEMICON West AZ- Congress & China- Memory Madness- AI Semiconductor Tsunami- First SEMICON in Arizona was great- should…Read More
Demand Meets Design: RISC-V and the Next Wave of AI HardwareArtificial intelligence (AI) is transforming every layer of…Read More
The RISC-V Revolution: Insights from the 2025 Summits and Andes Technology's Pivotal RoleRISC-V has emerged as a cornerstone of modern…Read More
Introduction by Lip-BU Tan:
I’m an engineer at heart. Nothing motivates me more than solving hard problems. Our teams across Intel are driven by this same mindset—inspired by the power of technology to enable new solutions to our customers’ toughest challenges.
I fundamentally believe this will be a catalyst for innovation throughout… Read More
This press release from CAST announces a significant collaboration with RANiX Inc., highlighting the integration of CAST’s TSN Switch IP core into RANiX’s new Integrated Micro Flat Antenna System (IMFAS) SoC. This development underscores the growing adoption of Time-Sensitive Networking (TSN) in the automotive… Read More
Dan is joined by Josue Navarro, product marketing engineer for Microchip’s dsPIC business unit. He began his career as a process engineer at Intel and has since transitioned into product marketing with Microchip Technology where he supports customers developing system designs utilizing Microchip’s Digital Signal … Read More
In a bold move that underscores the accelerating convergence of electronic design automation (EDA) and mechanical engineering, Cadence Design Systems announced its agreement to acquire Hexagon AB’s Design & Engineering (D&E) business for approximately €2.7 billion, equivalent to about $3.16 billion. This… Read More
Welcome to the second half of a very exciting year in semiconductors. While Intel and Samsung Foundry have made quite a few headlines, TSMC continues to execute flawlessly at 3nm and 2nm. With the TSMC OIP Ecosystem Forums starting later this month let’s take a look at how we got to where we are today.
Today Alchip Technologies, a Taipei-based leader in high-performance and AI computing ASICs, announced a significant milestone with the successful tape-out of its 3D IC test chip. This achievement not only validates Alchip’s advanced 3D IC ecosystem but also positions the company as a frontrunner in the rapidly evolving field… Read More
This webinar, in partnership with Easy-Logic Technology, is to address the complexities and challenges associated with functional ECO (Engineering Change Order) in ASIC design, with a particular focus on mixed-signal designs.
The webinar begins by highlighting the critical role of mixed-signal chips in modern applications,… Read More
By Thang Tran
For more than half a century, the foundations of computing have stood on a single architecture: the Von Neumann or Harvard model. Nearly all modern chips—CPUs, GPUs, and even many specialized accelerators—rely on some variant of this design. Over time, the industry has layered on complexity and specialization to… Read More
At the recent Hot Chips conference, Intel® unveiled Clearwater Forest, its next-generation Xeon® 6 processor with efficiency cores (E-cores). The unveiling was made by Don Soltis, Xeon Processor Architect and Intel Fellow with over four decades of processor design experience and a long-standing contributor to the Xeon roadmap.… Read More
Dosing for EUV lithography walks a fine line between productivity and defectivity. Fabs can choose higher-dose exposures to suppress photon shot noise [1]. However, higher doses require EUV machines to scan the wafer at slower speeds, degrading throughput [2].
On the other hand, there is the threat of resist thickness loss that… Read More
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