New Cooling Strategies for Future ComputingPower densities on chips increased from 50-100 W/cm2…Read More
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We agree now that FD-SOI technology is Faster, Cooler, Simpler. But can it also be a cheaper technology? Let start with an overview of the current estimation of the development cost for complex SoC on advanced technology nodes. The following data are extracted from International Business Strategies, Inc 2013 report. The first… Read More
SEMI’s World Fab Forecast report, published in November, predicts that fab equipment spending will decline about -9 percent (US$32.5 billion) in 2013 (including new, used and in-house manufactured equipment). Setting aside the used 300mm equipment Globalfoundries acquired from Promos at the beginning of 2013 (NT$20-30 … Read More
Analog IC designers are gradually adopting what digital IC designers have been doing for years, metric driven verification. When you talk with analog designers about their methodology and approach, you hear terms like artisan being used which implies mostly a manually-oriented methodology. Thanks to automation from EDA companies,… Read More
As power has become one of the most important criteria in semiconductor design today, I was wondering whether there is a standard set for the power verification for an overall chip. We do have formats evolved like CPF and UPF and there are tools available to check power and signal integrity (SI), however I don’t see a standard objective… Read More
It was on 26th April 1985 (at 3pm to be precise) that the very first ARM silicon sprang in to life – it was a 25K transistor design implemented in 3um technology with just 2 layers of metal.
However back then the “A” in ARM stood for Acorn – ARM the company had yet to be formed. Acorn sold computers to schools and so cost… Read More
At Semicon Japan a few days ago, Subi Kengeri of GlobalFoundries delivered the keynote. While he covered a number of topics, using Tokyo’s recent win of the 2020 Olympics as a hook, one major theme was the increasing importance of processes other than the bleeding edge digital processes that get all the news.
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In an environment of SoCs with tough targets of multiple functionalities, smallest size, lowest power and fastest performance to achieve within a limited design cycle window in order to meet the rigid time-to-market requirements, any day spent without success becomes very frustrating for a designer. Especially during tape-out… Read More
Two conferences on 3D, one just over and one coming up next week. The one that was just over was hosted by Georgia Tech, the 3rd Annual Global Interposer Technology Workshop (GIT). I wasn’t there but my ex-colleague from VLSI Technology Herb Reiter was. Herb has become very much associated with all things 3D since he led the … Read More
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