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UCIe 3.0: Doubling Bandwidth and Deepening Manageability for the Chiplet Era

UCIe 3.0: Doubling Bandwidth and Deepening Manageability for the Chiplet Era
by Daniel Nenni on 08-05-2025 at 10:00 am

Chiplet SemiWiki UCIe

The Universal Chiplet Interconnect Express (UCIe) 3.0 specification marks a decisive step in the industry’s shift from monolithic SoCs to modular, multi-die systems. Released on August 5, 2025, the new standard doubles peak link speed from 32 GT/s in UCIe 2.0 to 48 and 64 GT/s while adding a suite of manageability and efficiency

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DAC TechTalk – A Siemens and NVIDIA Perspective on Unlocking the Power of AI in EDA

DAC TechTalk – A Siemens and NVIDIA Perspective on Unlocking the Power of AI in EDA
by Mike Gianfagna on 08-05-2025 at 6:00 am

Screenshot

AI was everywhere at DAC. Presentations, panel discussions, research papers and poster sessions all had a strong dose of AI. At the DAC Pavillion on Monday two heavy weights in the industry, Siemens and NVIDIA took the stage to discuss AI for design, both present and future.  What made this event stand out for me was the substantial… Read More


Digital Implementation and AI at #62DAC

Digital Implementation and AI at #62DAC
by Daniel Payne on 08-04-2025 at 10:00 am

aprisa at #62dac

My first panel discussion at DAC 2025 was all about using AI for digital implementation, as Siemens has a digital implementation tool called Aprisa  which has been augmented with AI to produce better results, faster. Panelists were from Samsung, Broadcom, MaxLinear, AWS and Siemens. In the past it could take an SoC design team… Read More


Synopsys Webinar – Enabling Multi-Die Design with Intel

Synopsys Webinar – Enabling Multi-Die Design with Intel
by Mike Gianfagna on 08-04-2025 at 6:00 am

Synopsys Webinar – Enabling Multi Die Design with Intel

As we all know, the age of multi-die design has arrived. And along with it many new design challenges. There is a lot of material discussing the obstacles to achieve more mainstream access to this design architecture, and some good strategies to conquer those obstacles. Synopsys recently published a webinar that took this discussion… Read More


CoPoS is a Bigger Canvas for Chiplets and HBM

CoPoS is a Bigger Canvas for Chiplets and HBM
by Admin on 08-03-2025 at 10:00 am

Chip on Panel on Substrate, often shortened to CoPoS, extends the familiar idea of chip on carrier packaging by moving the redistribution and interposer style structures from circular wafers to large rectangular panels. The finished panel assembly is then mounted on an organic or glass package substrate. This shift from round

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Is a Semiconductor Equipment Pause Coming?

Is a Semiconductor Equipment Pause Coming?
by Robert Maire on 08-03-2025 at 10:00 am

John Maire SemiWiki

– Lam put up good numbers but H2 outlook was flat with unknown 2026
– China remains high & exposed at 35% of biz while US is a measly 6%
– Unclear if this is peak, pause, digestion, technology or normal cycle
– Coupled with ASML soft outlook & stock run ups means profit taking

Nice quarter but expected
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CEO Interview with Dr. Avi Madisetti of Mixed-Signal Devices

CEO Interview with Dr. Avi Madisetti of Mixed-Signal Devices
by Daniel Nenni on 08-03-2025 at 6:00 am

Avi Madisetti Headshot

Avi Madisetti is the CEO and Founder of Mixed-Signal Devices, a fabless semiconductor company delivering multi-gigahertz timing solutions. A veteran of Broadcom and Rockwell Semiconductor, Avi helped pioneer DSP-based Ethernet and SerDes architectures that have shipped in the billions. He later co-founded Mobius Semiconductor,… Read More


AI’s Transformative Role in Semiconductor Design and Sustainability

AI’s Transformative Role in Semiconductor Design and Sustainability
by Admin on 08-02-2025 at 6:00 pm

On July 18, 2025, Serge Nicoleau from STMicroelectronics delivered a compelling presentation at DACtv, as seen in the YouTube video exploring how artificial intelligence (AI) is revolutionizing semiconductor design, edge computing, and sustainability. Addressing a diverse audience, Serge highlighted AI’s pervasive … Read More


Google Cloud: Optimizing EDA for the Semiconductor Future

Google Cloud: Optimizing EDA for the Semiconductor Future
by Admin on 08-02-2025 at 5:00 pm

On July 9, 2025, a DACtv session featured a Google product manager discussing the strategic importance of electronic design automation (EDA) and how Google Cloud is optimizing it for the semiconductor industry, as presented in the YouTube video. The talk highlighted Google Cloud’s role in addressing the escalating complexity… Read More


Synopsys FlexEDA: Revolutionizing Chip Design with Cloud and Pay-Per-Use

Synopsys FlexEDA: Revolutionizing Chip Design with Cloud and Pay-Per-Use
by Admin on 08-02-2025 at 4:00 pm

On July 9, 2025, Vikram Bhatia, head of product management for Synopsys’ cloud platform, and Sashi Obilisetty, his R&D engineering counterpart, presented a DACtv session on Synopsys FlexEDA, as seen in the YouTube video. Drawing from three and a half years of data, the session showcased how this cloud-based, pay-per-use… Read More