One of the most frequently discussed concerns regarding FDSOI adoption is the higher starting wafer cost compared to bulk technology. This discussion was also brought up after my earlier post,… Read More
Revolutionizing Simulation Turnaround: How Siemens’ SmartCompile Transforms SoC VerificationIn the race to deliver ever-larger SoCs under…Read More
Arteris Simplifies Design Reuse with Magillem PackagingMany know Arteris as the “network-on-chip”, or NoC,…Read More
Profile of an IoT Processor for Industrial, Consumer Markets
The intersection of data with intelligent machines is creating new possibilities in industrial automation, and this new frontier is now being increasingly known as the Industrial Internet of Things (IIoT). However, if there is a single major stumbling block that is hindering the IoT take-off at the larger industrial scale, … Read More
SEMI Releases Industry’s First “Global 200mm Fab Outlook to 2018” and Announces Webinar
SEMI, the global industry association advancing the interests of the worldwide electronics supply chain, today (October 19) published a new report, “Global 200mm Fab Outlook to 2018.” According to the report, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and… Read More
About That Landauer Limit…
You may have heard of the Landauer principle or the Landauer limit. This defines a lower bound on switching power dissipation in any form of digital circuit. Rolf Landauer first presented this principle in 1961, while working at IBM. It’s not limited by how the circuit is built – you can use FinFETS or spintronics or even dilithium… Read More
How LETI IP will speed-up GlobalFoundries 22FDX™ ASIC Development
GlobalFoundries has positioned FDSOI proposal -22FDX- to provide better performance and power dissipation than competitive FDSOI offers on 28nm node. The FDSOI licensing agreement between LETI and GlobalFoundries is only a couple of months old (July 2015), but the real work has started in Dresden as several engineers from … Read More
Samsung’s Luck with Gear S2
The wave of new and improved smartwatches started this year. Apple launched its first smartwatch in April. Several other players including Motorola, LG, ASUS, and Huawei have launched their new smartwatches this year. Sony launched its latest ‘SmartWatch 3’ in October last year. Rising consumer electronics brands like Xiaomi… Read More
ARM Server Chips: What Qualcomm Wants?
Qualcomm has made the long-awaited foray into the ARM-based server chipsets and the trade media is presenting its 24-core SoC prototype as a challenger to Intel’s hegemony in the cloud server market. Is it so?… Read More
Extendible Processor Architectures for IoT Applications
The Internet of Things has become a ubiquitous term, to refer to a broad (and somewhat ill-defined) set of electronic products and potential applications – e.g., wearables, household appliances and controllers, medical applications, retail applications (signage, RFID), industrial automation, machine-to-machine communication,… Read More
IoT chipsets and enterprise emulation tools
When most people talk about the IoT, it is usually all about wearables-this and low-power-that – because everyone is chasing the next huge consumer post-mobile device market. Mobile devices have provided the model. The smartphone is the on-ramp to the IoT for most consumers, with Bluetooth, Wi-Fi, and LTE, and maybe a dozen or … Read More
Is the IP market expected to decline by 2020?
To answer this question, I will share the results about Interface IP, more precisely the Top 5. The Top 5 protocols, USB, PCIe, Ethernet, DDRn and MIPI, are part of the interface IP market and each of them has been characterized by very strong growth rate. If you compute actual numbers for 2010 to 2014, it results to a Cumulated Annual… Read More
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