The global semiconductor industry stands at a defining moment in its history. Having surpassed $600 billion in annual revenue, the path to a $1 trillion market is no longer a distant dream but an achievable milestone within the next decade. The annual 2025 Semi Industry Forum, organized by Silicon Catalyst, brings together the… Read More





Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools
The U.S. House Select Committee on the Strategic Competition Between the United States and the Chinese Communist Party released a bombshell report titled “Selling the Forges of the Future” on October 7, 2025, detailing how the People’s Republic of China is stockpiling semiconductor manufacturing equipment… Read More
SEMICON West AZ- Congress & China- Memory Madness- AI Semiconductor Tsunami
– First SEMICON in Arizona was great- should make it permanent
– Congress finally wakes up to China issues long after cows are gone
– Memory cycle in support of AI could be huge but scary at same time
– AI demand seems bottomless- but may distort chip industry dynamics
Phoenix SEMICON was wonderful!
The crowds… Read More
Podcast EP310: On Overview of the Upcoming DVCon Europe Conference and Exhibition with Dr. Mark Burton
Daniel is joined by Dr. Mark Burton, the General Chair for this year’s DVCon Europe. DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits.
Mark shares his long history of involvement in DVCon with Dan. He … Read More
Exploring TSMC’s OIP Ecosystem Benefits
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
Demand Meets Design: RISC-V and the Next Wave of AI Hardware
Artificial intelligence (AI) is transforming every layer of computing, from hyperscale data centers training trillion-parameter models to battery-powered edge devices performing real-time inference. Hardware requirements are escalating on every front: compute density is increasing, power budgets are tightening, … Read More
The RISC-V Revolution: Insights from the 2025 Summits and Andes Technology’s Pivotal Role
RISC-V has emerged as a cornerstone of modern computing, offering an open-source alternative to proprietary designs like ARM and x86. Free from licensing fees and highly extensible, RISC-V powers everything from IoT devices to AI accelerators, with over 13 billion cores shipped globally. Annual RISC-V Summits, organized… Read More
GlobalFoundries, MIPS, and the Chiplet Race for AI Datacenters
GlobalFoundries’ (GF) acquisition of MIPS in 2025 wasn’t a nostalgic move to revive a legacy CPU brand. It was a calculated step into one of the most lucrative frontiers in semiconductors: AI, high-performance computing (HPC), and datacenters. As Nvidia, AMD, Intel, and hyperscalers embrace chiplet architectures, GF is betting… Read More
Moores Lab(AI): Agentic AI and the New Era of Semiconductor Design
For decades, chip design has been a delicate balance of creativity and drudgery. Architects craft detailed specifications, engineers read those documents line by line, and teams write and debug thousands of lines of Verilog and UVM code. Verification alone can consume up to 35 percent of a project’s cost and add many months to … Read More
Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®
In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon Liquid… Read More
Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools