I am on a voyage of discovery through prompting and prompting technologies because these are the critical interfaces between what we want (or roughly imagine we want) from AI, and AI’s ability to deliver. I have seen suggestions that any deficiencies today are a detail that will soon be overcome. I’m not so sure. Yes, prompting technology… Read More





GaN Device Design and Optimization with TCAD
I’ve read articles about power electronics, RF systems and high-frequency applications using SiC and GaN transistors, especially in EVs and chargers, but hadn’t looked into the details of GaN devices. A recent Silvaco webinar proved to be just the format that I needed to learn more about GaN design and optimization. Udita Mittal,… Read More
How the Father of FinFETs Helped Save Moore’s Law
In the early 2000s, Moore’s Law—the observation that the number of transistors on a chip doubles roughly every two years—was facing an existential crisis. As semiconductor nodes shrank below 90nm, planar transistors suffered from debilitating issues: leakage currents soared, power efficiency plummeted, and scaling became… Read More
A Remote Touchscreen-like Control Experience for TVs and More
How do you control your smart TV? With a remote control of course, already quite capable since it allows voice commands to find a movie or TV show without needing all that fiddly button-based control and lookup. But there’s a range of things you can’t do that we take for granted on a tablet or phone screen. Point and click on an object,… Read More
Teradyne and TSMC: Pioneering the Future of Semiconductor Testing Through the 2025 OIP Partner of the Year Award
In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More
Sofics’ ESD Innovations Power AI and Radiation-Hardened Breakthroughs on TSMC Platforms
In the fast-evolving semiconductor landscape, electrostatic discharge (ESD) protection is pivotal for ensuring chip reliability amid shrinking nodes and extreme applications. Sofics, a Belgian IP provider specializing in ESD solutions for ICs, has cemented its leadership through strategic collaborations showcased … Read More
MIN PULSE WIDTH (MPW) TIMING CHECK The Silent Timing Trap Lurking in Every Sub-5nm Design
By Zameer Mohammed
This article claims to provide clear key insights of Min Pulse Width (MPW) timing signoff check, proactive closure strategies for faster time-to-market, and effective methods to prevent silicon failures.
Min Pulse Width (MPW) check for timing signoff has become an important design constraint at the sub-5nm… Read More
CEO Interview with Gary Spittle of Sonical
British-born, California-based entrepreneur, Gary Spittle, is the founder of Sonical – a disruptive, forward-thinking audio brand that is currently on the cusp of delivering something quite remarkable: think immersive, wireless, and completely lossless.
Gary holds a PhD. He investigated the use of binaural audio for improving… Read More
Podcast EP309: The State of RISC-V and the Upcoming RISC-V Summit with Andrea Gallo
Daniel is joined by Andrea Gallo, CEO of RISC-V International. Before joining RISC-V he worked in leadership roles at Linaro for over a decade and before Linaro he was a fellow at STMicroelectronics.
Dan explores the current state of the RISC-V movement with Andrea, who describes the focus and history of this evolving standard.… Read More
Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration
In a move that underscores the semiconductor industry’s push toward resilient supply chains and agile innovation, Thalia Design Automation and X-FAB Silicon Foundries have announced a strategic partnership aimed at safeguarding supply continuity and accelerating intellectual property (IP) migration. This collaboration,… Read More
Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools