SEMI, the global industry association advancing the interests of the worldwide electronics supply chain, today (October 19) published a new report, “Global 200mm Fab Outlook to 2018.” According to the report, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and expanding to 5.4 million wspm in 2018. In addition to the release of the report, SEMI is offering two complimentary webinars (November 2 at 5:00pm Pacific; November 3 at 8:00am Pacific) with highlights of the newly released 200mm report.
Based on the rapidly increasing number of internet-enabled mobile devices and the emergence of the IoT (Internet of Things), demand for sensors, MEMS, analog, power and related semiconductor devices is growing. While these devices are critical to enable the new era of computing, the applications do not require leading-edge manufacturing capability, and this demand is “breathing new life” into 200mm fabs.
Highlights of the results of the SEMI 200mm report include:
- 36 facilities are expected to add 300,000 to 400,000 200mm wspm from 2015 through 2018.
- Capacity investment is expected to total over US $3 billion during the 2015 to 2018 period.
- Eight new facilities/lines are expected to begin operation from 2015 through 2018.
- China and Southeast Asia are forecast to lead the expansion in 200mm fab capacity.
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Source: Global 200mm Fab Outlook, SEMI; October 2015
Complimentary webinars will be held on November 2at 5:00pm Pacific and November 3 at 8:00am Pacific. In the webinar ( www.semi.org/en/iot200mmwebinar), lead analyst Christian G. Dieseldorff will share highlights of the new Global 200mm Fab Outlook.
For more information, download the Global 200mm Fab Outlook sample report, contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers), or email firstname.lastname@example.org. For information on all SEMI Market research reports, visit www.semi.org/en/MarketInfo.