Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering and production… Read More
Teradyne Targets Edge AI Test Costs With UltraFLEXplus S SeriesTeradyne has introduced the UltraFLEXplus S series, extending…Read More
Why America’s Semiconductor Manufacturing Capacity MattersAmerica’s semiconductor future will be shaped by its…Read More
Arteris FlexGen Opens Up Multi-Die Traffic Management for Non-Coherent NetworksLast year I wrote about Arteris’ introduction of…Read More
The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the ChipApplied Materials President and CEO Gary Dickerson with…Read MoreVSORA’s Sandra Rivera on the Inference Era: Demand Is Real, But Not Everyone Survives
Sandra Rivera, Chair of VSORA, joined Bloomberg’s The Close in July for an interview on the current state of AI. What follows is a summary of that conversation.
When a Silicon Valley veteran who once ran Intel’s Data Center and AI Group, and now chairs a French inference-chip challenger, sits down with a tech journalist from Bloomberg,… Read More
Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs
Intel’s strategic argument about enterprise AI is that the value of a model depends on the system that surrounds it. In an article by executives Bill Pearson and Anil Nanduri, the company positions open software as the connective tissue linking CPUs, GPUs, data, and business applications. The message is straightforward: accelerator… Read More
CTO Interview with Dr. Zakir Syed of ClockEdge
Dr. Zakir Syed is Co-founder and Chief Technology Officer of ClockEdge, where he has played a central role in developing specialized simulation technology for advanced semiconductor clock networks. He brings more than 30 years of experience in electronic design automation and semiconductor verification. He joined Simplex… Read More
Chips&Media targets AI memory bottlenecks with new compression IP
Chips&Media has announced a data compression technology aimed at one of the constraints in artificial intelligence hardware: moving data fast enough to keep processors busy. The South Korean semiconductor intellectual property supplier says its new Feature Map Compression IP marks an expansion beyond video applications… Read More
Overcoming the Edge AI Power Wall with Low-Voltage Foundation IP
As artificial intelligence (AI) workloads migrate to endpoint hardware, edge AI devices face immense pressure to deliver real-time inference within highly restrictive power and thermal envelopes. Traditional silicon scaling no longer yields the power-density returns it once did. To compensate, engineering teams are turning… Read More
Keysight Advances its Design Software with Agentic AI
Keysight Technologies is opening a new route for artificial intelligence into radio frequency engineering. Announced on October 6, 2026, its latest software capabilities let engineers connect their own AI agents and large language models to Advanced Design System (ADS) 2027. Agents can help generate and optimize circuits,… Read More
DAC 2027 Opens Call for Contributions as AI Reshapes Chip Design
The Design Automation Conference is the premier semiconductor ecosystem conference. I have attended 43 DACs including the most recent one in Long Beach. My first DAC was in Albuquerque NM. It was a month after my University so i was still in college mode. DAC was quite the celebration back then so I fit right in
I remember conferences… Read More
ChipAgents and NVIDIA Put Autonomous Chip Design to the Test
ChipAgents has introduced Build-A-Chip-Bench, a benchmark developed with NVIDIA to evaluate whether AI agents can complete digital chip design tasks from specification through physical implementation. The initiative measures progress beyond generating hardware code, asking whether autonomous systems can deliver verified… Read More
Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036
EUV has long been an interesting story. We have written 200+ articles on EUV and they just keep on coming. Thankfully the premier lithography conference is right here in Silicon Valley. SPIE began in 1955 as the Society of Photographic Instrumentation Engineers, bringing together engineers using scientific cameras and high-speed… Read More


ChipAgent Raises $134Million and Why it Matters