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Perforce and Siemens at #62DAC

Perforce and Siemens at #62DAC
by Daniel Payne on 08-28-2025 at 10:00 am

perforce siemens min

Wednesday was the last day at #62DAC for me and I attended an Exhibitor Session entitled, Engineering the Semiconductor Digital Thread, which featured Vishal Moondhra, VP Solutions Engineering of Perforce IPLM and Michael Munsey, VP Semiconductor Industry at Siemens Digital Industries. Instead of just talking from slides,… Read More


Synopsys Enables AI Advances with UALink

Synopsys Enables AI Advances with UALink
by Mike Gianfagna on 08-28-2025 at 6:00 am

Synopsys Enables AI Advances with UALink

The evolution of hyperscale data center infrastructure to support the processing of trillions of parameters for large language models has created some rather substantial design challenges. These massive processing facilities must scale to hundreds of thousands of accelerators with highly efficient and fast connections.… Read More


Revolutionizing Chip Packaging: The Impact of Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)

Revolutionizing Chip Packaging: The Impact of Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
by Daniel Nenni on 08-27-2025 at 10:00 am

Intel Foundry Packaging Evolution 2025

In an era dominated by artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), the demand for semiconductors that deliver high data throughput, low latency, and energy efficiency has never been greater. Traditional chip designs often struggle to keep pace with these requirements, leading… Read More


Cocotb for Verification. Innovation in Verification

Cocotb for Verification. Innovation in Verification
by Bernard Murphy on 08-27-2025 at 6:00 am

Innovation New

This time let’s see if we can stir up some lively debate. Cocotb isn’t new but it is an interesting alternative to mainstream testing methodologies. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series … Read More


Can RISC-V Help Recast the DPU Race?

Can RISC-V Help Recast the DPU Race?
by Jonah McLeod on 08-26-2025 at 10:00 am

Can RISC V Help Qualcomm

ARM’s Quiet Coup in DPUs

The datacenter is usually framed as a contest between CPUs (x86, ARM, RISC-V) and GPUs (NVIDIA, AMD, custom ASICs). But beneath those high-profile battles, another silent revolution has played out: ARM quietly displaced Intel and AMD in the Data Processing Unit (DPU) market.

DPUs — also called SmartNICs… Read More


Breaking out of the ivory tower: 3D IC thermal analysis for all

Breaking out of the ivory tower: 3D IC thermal analysis for all
by Admin on 08-26-2025 at 6:00 am

figure 1

Todd Burkholder and Andras Vass-Varnai, Siemens EDA

As semiconductor devices become smaller, more powerful and more densely integrated, thermal management has shifted from an afterthought to a central challenge in modern IC design. In contemporary 3D IC architectures—where multiple chiplets are stacked and closely arrayed—power… Read More


Intel’s Pearl Harbor Moment

Intel’s Pearl Harbor Moment
by Daniel Nenni on 08-25-2025 at 10:00 am

Pearl Harbor Memorial Hawaii

There is a lot of talk about where Intel went wrong, the latest is missing AI, but people seem to forget one of the more defining blunders in the history of Intel. In April of 2012 Kirk Skaugen, the new general manager of Intel’s client PC group, moderated a Q&A with Mark Bohr, a 33+ year Intel fellow, and Brad Heaney, the Ivy Bridge… Read More


A Big Step Forward to Limit AI Power Demand

A Big Step Forward to Limit AI Power Demand
by Bernard Murphy on 08-25-2025 at 6:00 am

Power estimation

By now everyone knows that AI has become the all-consuming driver in tech and that NVIDIA GPU-based platforms are the dominant enabler of this revolution. Datacenters worldwide are stuffed with such GPUs, serving AI workloads from automatically drafting emails and summarizing meetings to auto-creating software and controlling… Read More


Free and Open Chip Design Tools: Opportunities, Challenges, and Outlook

Free and Open Chip Design Tools: Opportunities, Challenges, and Outlook
by Admin on 08-24-2025 at 10:00 am

OPen EDA Ecosystem 2025 SemiWiki

Designing semiconductor chips has traditionally been costly and controlled by a few major Electronic Design Automation (EDA) vendors—Cadence, Synopsys, and Siemens EDA who dominate with proprietary tools protected by NDAs and restrictive licenses. Fabrication also requires expensive, often export-controlled equipment.… Read More


Chiplets: providing commercially valuable patent protection for modular products

Chiplets: providing commercially valuable patent protection for modular products
by Robbie Berryman on 08-24-2025 at 6:00 am

Screenshot 2025 07 27 at 08 32 09

Many products are assembled from components manufactured and distributed separately, and it is important to consider how such products are manufactured when seeking to provide commercially valuable patent protection. This article provides an example in the field of computer chip manufacture.

Chiplets

A system-on-a-chip

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