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I Have Seen the Future with ChipAgents Autonomous Root Cause Analysis

I Have Seen the Future with ChipAgents Autonomous Root Cause Analysis
by Mike Gianfagna on 11-18-2025 at 10:00 am

I Have Seen the Future with ChipAgents Autonomous Root Cause Analysis

I have seen a lot of EDA tool demos in my time. More than I want to admit. The perceived quality of the demo usually came down to a combination of the speed of the tool, quality of results and the ease of navigating through the graphical user interface. For the last item, how easy the interface was on the eyes, how clear were the relationships… Read More


Arm FCSA and the Journey to Standardizing Open Chiplet-Based Design

Arm FCSA and the Journey to Standardizing Open Chiplet-Based Design
by Bernard Murphy on 11-18-2025 at 6:00 am

AI driven car

I have written before about an inter-chiplet communication challenge to realizing the dream of multi-die designs built around open-market chiplets. Still a worthy dream but it’s going to take a journey to get there. Arm recently donated their Foundation Chiplet System Architecture (FCSA) to the Open Compute Project (OCP) as… Read More


Boosting SoC Design Productivity with IP-XACT

Boosting SoC Design Productivity with IP-XACT
by Daniel Payne on 11-17-2025 at 10:00 am

IP XACT min

IP-XACT, defined by IEEE 1685, is a standard that pulls together IP packaging, integration, and reuse. For anyone building modern SoCs (Systems on Chip), IP-XACT isn’t just another XML schema: it is a productivity multiplier and a risk-reduction tool that brings order to your electronic system design.

What is IP-XACT?

IP-XACT… Read More


Revolution EDA: A New EDA Mindset for a New Era

Revolution EDA: A New EDA Mindset for a New Era
by Admin on 11-17-2025 at 6:00 am

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Murat Eskiyerli, PhD, is the founder of Revolution EDA  

Modern software development environments have evolved dramatically. A developer can download Visual Studio Code, install a few plugins, and be productive within minutes. The cost? Perhaps a few hundred dollars per month for cloud development resources. Compare that toRead More


CEO Interview with Roy Barnes of TPC

CEO Interview with Roy Barnes of TPC
by Daniel Nenni on 11-16-2025 at 10:00 am

Roy Barnes Headshot

Roy Barnes is the group president of The Partner Companies (TPC), a specialty manufacturer, overseeing TPC’s photochemical etching companies: Elcon, E-Fab, Fotofab, Microphoto and PEI.

Roy is an experienced leader known for building strong teams, driving change and inspiring people to succeed. Throughout his career, he … Read More


CEO Interview with Mr. Shoichi Teshiba of Macnica ATD

CEO Interview with Mr. Shoichi Teshiba of Macnica ATD
by Daniel Nenni on 11-16-2025 at 6:00 am

Shoichi Teshiba

With over 30 years of experience in sales and marketing of semiconductors and electronic components, Mr. Shoichi Teshiba has worked across a broad range of industries including storage, servers, networking, consumer electronics, industrial equipment, and automotive. Combining deep insight into both domestic and global… Read More


Podcast EP317: A Broad Overview of Design Data Management with Keysight’s Pedro Pires

Podcast EP317: A Broad Overview of Design Data Management with Keysight’s Pedro Pires
by Daniel Nenni on 11-14-2025 at 10:00 am

Daniel is joined by Pedro Pires, a product and technology leader with a strong background in IP and data management within the EDA industry. Currently a product manager at Keysight Technologies, he drives the roadmap for the AI-driven data management solutions. Pedro’s career spans roles in software engineering and data science… Read More


Silicon Catalyst on the Road to $1 Trillion Industry

Silicon Catalyst on the Road to $1 Trillion Industry
by Daniel Nenni on 11-14-2025 at 6:00 am

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There were quite a few announcements at the Silicon Catalyst event at the Computer History Museum last week. The event itself was eventful with semiconductor legends in the audience and on the stage. First let’s talk about the announcements Silicon Catalyst made then we will talk about the event itself.

In addition to expanding… Read More


WEBINAR: Revolutionizing Electrical Verification in IC Design

WEBINAR: Revolutionizing Electrical Verification in IC Design
by Daniel Nenni on 11-13-2025 at 10:00 am

Electrical Verification – The invisible bottleneck in IC design 2

In the complex world of IC design, electrical verification has emerged as a critical yet often overlooked bottleneck. Aniah’s upcoming webinar on December 4, 2025, titled “Electrical Verification: The Invisible Bottleneck in IC Design,” sheds light on this issue, introducing their groundbreaking OneCheck® solution. … Read More


Hierarchically defining bump and pin regions overcomes 3D IC complexity

Hierarchically defining bump and pin regions overcomes 3D IC complexity
by Admin on 11-13-2025 at 8:00 am

connectivity in a hierarchical IC package floorplan

By Todd Burkholder and Per Viklund, Siemens EDA

The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More