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Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series

Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series
by Daniel Nenni on 10-22-2026 at 6:00 am

Precision Testing for Edge AI Chips

Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing. Its target… Read More


Teradyne Unveils Magnum E2 for the Next Wave of AI Memory

Teradyne Unveils Magnum E2 for the Next Wave of AI Memory
by Daniel Nenni on 10-13-2026 at 10:00 am

High speed memory testing for AI

Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering and production… Read More