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Semiconductor Expert Forum

Podcast EP289: An Overview of How Highwire Helps to Deliver Advanced Fabs with Less Cost, Time and Risk with David Tibbetts

Podcast EP289: An Overview of How Highwire Helps to Deliver Advanced Fabs with Less Cost, Time and Risk with David Tibbetts
by Daniel Nenni on 05-30-2025 at 6:00 am
Categories: Uncategorized

Dan is joined by David Tibbetts, Chief Safety Officer at Highwire. David is a Certified Safety Professional with 20+ years of occupational safety experience in both general industry and construction settings. He is currently supporting Highwire’s hiring partners utilizing the Highwire suite of software solutions … Read More

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Synopsys Addresses the Test Barrier for Heterogeneous Integration

Synopsys Addresses the Test Barrier for Heterogeneous Integration
by Mike Gianfagna on 05-29-2025 at 10:00 am
Categories: 3D IC, IP, Synopsys

Synopsys Addresses the Test Barrier for Heterogeneous Integration

The trend is clear, AI and HPC is moving to chiplet-based, or heterogenous design to achieve the highest levels of performance, while traditional monolithic system-on-chip (SoC) designs struggle to scale. What is also clear is the road to this new design style is not a smooth one. There are many challenges to overcome. Some are … Read More

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Anirudh Keynote at CadenceLIVE 2025 Reveals Millennium M2000

Anirudh Keynote at CadenceLIVE 2025 Reveals Millennium M2000
by Bernard Murphy on 05-29-2025 at 6:00 am
Categories: AI, Cadence, EDA, IP, Secure-IC, Security

Anirudh Keynote at CadenceLIVE 2025 Reveals Millennium M2000

Another content-rich kickoff covering a lot of bases under three main themes: the new Millennium AI supercomputer release, a moonshot towards full autonomy in chip design exploiting agentic AI, and a growing emphasis on digital twins. Cadence President and CEO Anirudh Devgan touched on what is new today, and also market directions… Read More

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Semiconductor Market Uncertainty

Semiconductor Market Uncertainty
by Bill Jewell on 05-28-2025 at 2:00 pm
Categories: Semiconductor Intelligence, Semiconductor Services

2025 Semiconductor Market Forecast

WSTS reported 1st quarter 2025 semiconductor market revenues of $167.7 billion, up 18.8% from a year earlier and down 2.8% from the prior quarter. The first quarter of 2025 was weak for most major semiconductor companies. Ten of the sixteen companies in the table below had declines in revenue versus 4Q 2024, ranging from -0.1% from… Read More

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Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies

Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies
by Kalar Rajendiran on 05-28-2025 at 10:00 am
Categories: 3D IC, Chiplet, EDA, Foundries, Intel Foundry, IP, Synopsys

Sassine Holding an 18A Test chip

Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More

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Optimizing an IR for Hardware Design. Innovation in Verification

Optimizing an IR for Hardware Design. Innovation in Verification
by Bernard Murphy on 05-28-2025 at 6:00 am
Categories: Cadence, EDA

Innovation New

Intermediate representations (IRs) between high level languages (C++, AI, etc.) and machine language are both commonplace (witness LLVM) and a continuing active area of research. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford,… Read More

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WEBINAR: PCIe 7.0? Understanding Why Now Is the Time to Transition

WEBINAR: PCIe 7.0? Understanding Why Now Is the Time to Transition
by Don Dingee on 05-27-2025 at 10:00 am
Categories: Events, IP, Synopsys

PCIe application interface options are the primary motivation for the PCIe 7.0 transition

PCIe is familiar to legions of PC users as a high-performance enabler for expansion slots, especially GPU-based graphics cards and M.2 SSDs. It connects higher-bandwidth networking adapters and niche applications like system expansion chassis in server environments. Each PCIe specification generation has provided a leap… Read More

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Andes Technology: Powering the Full Spectrum – from Embedded Control to AI and Beyond

Andes Technology: Powering the Full Spectrum – from Embedded Control to AI and Beyond
by Kalar Rajendiran on 05-27-2025 at 6:00 am
Categories: AI, Andes Technology, IP, RISC-V

Overview of Andes Product Categories

As the computing industry seeks more flexible, scalable, and open hardware architectures, RISC-V has emerged as a compelling alternative to proprietary instruction set architectures. At the forefront of this revolution stands Andes Technology, offering a comprehensive lineup of RISC-V processor solutions that go far beyond… Read More

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Voice as a Feature: A Silent Revolution in AI-Enabled SoCs

Voice as a Feature: A Silent Revolution in AI-Enabled SoCs
by Jonah McLeod on 05-26-2025 at 10:00 am
Categories: AI, Arm, RISC-V

Voice as a Feature

When Apple introduced Siri in 2011, it was the first serious attempt to make voice interaction a mainstream user interface. Embedded into the iPhone 4S, Siri brought voice into consumers’ lives not as a standalone product, but as a built-in feature—a hands-free way to interact with an existing device. Siri set the expectation… Read More

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From All-in-One IP to Cervell™: How Semidynamics Reimagined AI Compute with RISC-V

From All-in-One IP to Cervell™: How Semidynamics Reimagined AI Compute with RISC-V
by Kalar Rajendiran on 05-26-2025 at 6:00 am
Categories: AI, IP, RISC-V, Semidynamics

Started with a look at CPU

In an era where artificial intelligence workloads are growing in scale, complexity, and diversity, chipmakers are facing increasing pressure to deliver solutions that are not only fast, but also flexible and programmable. Semidynamics recently announced Cervell™, a fully programmable Neural Processing Unit (NPU) designed… Read More