SiFive's AI’s Next Chapter: RISC-V and Custom SiliconIn the rapidly evolving world of artificial intelligence…Read More
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Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SCAs analog and mixed-signal designs become increasingly complex,…Read More
Here are the Top 10 highlights from the recent TSMC 2018 Technology Symposium, held in Santa Clara CA. A couple of years ago, TSMC acknowledged the unique requirements of 4 different market segments, which has since guided their process development strategy — Mobile, High-Performance Computing (HPC), Automotive, and… Read More
I got a tip sheet today for the upcoming 2018 Symposia on VLSI Technology & Circuits to be held June 19th through 21st in Honolulu, Hawaii. There is some interesting information on Samsung’s 10nm, 8nm and 7nm processes in the tip sheet:… Read More
On April 17, Mick Posner, Director of Product Marketing, IP Subsystems, Hardening & IP Kit solutions held a Webinar entitled ‘Getting more from your IP Vendor, IP Tuned to Your SoC’. This brought back memories of the challenges in days past of making the right choices in IP selection, integration and validation when prudence… Read More
I wrote recently about a yield problem which mobile vendors have been finding for devices built in advanced technologies. This was a performance issue (the devices worked fine at lower clock speeds), pointing to a discrepancy in some devices between predicted and observed timing. These were experienced design teams, using state… Read More
In the field of automotive electronics, the year 2011 was a long time ago. So, it is about time that the initial ISO 26262 specification that was adopted back then gets an update. The latest version will be known as ISO26262:2018 and will expand the scope of the original to cover more types of vehicles. It will add an entire section on… Read More
Having spent my entire thirty plus year career in semiconductors and design enablement I have seen quite a change in diversity. When I first started I remember thinking that height and weight was the only diversity here in Silicon Valley. My wife really noticed it when she attended her first Design Automation Conference in 1985 … Read More
At CDNLive Silicon Valley 2018, I talked with Yuval Shay, Director of Product Management of Cadence Custom IC & PCB Group to scope out some more details on the recent Virtuoso product refresh announced earlier in the morning by Cadence Sr. VP & GM of the same group, Tom Beckley.
Tom shared his view on enabling the fourth industrial… Read More
Normally press release events with ARM tend to be somewhat arms-length – a canned pitch followed by limited time for Q&A. Through a still unexplained calendar glitch I missed a scheduled call for a recent announcement. To make up I had the pleasure of a 1-on-1 with Hima Mukkamala, GM of IoT cloud services at ARM. Hima is a heavy … Read More
As Moore’s Law enables increased integration, the diversity of functionality in SoC designs has grown. Design teams are seeking to utilize outside technical expertise in key functional areas, and to accelerate their productivity by re-using existing designs that others have developed. The Intellectual Property (IP) industry… Read More
One of the more frequent questions I get, “What is next after FinFETs?” is finally getting answered. Thankfully I am surrounded by experts in the process technology field including Scotten Jones of IC Knowledge. I am also surrounded by design enablement experts so I really am the man in the middle which brings us to a discussion between… Read More
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A Century of Miracles: From the FET’s Inception to the Horizons Ahead