TSMC's 2024 Sustainability Report: Pioneering a Greener Semiconductor FutureTSMC, the world's most trusted semiconductor foundry, released…Read More
Intel's Commitment to Corporate Responsibility: Driving Innovation and SustainabilityIntroduction by Lip-BU Tan: I’m an engineer at…Read More
Cadence's Strategic Leap: Acquiring Hexagon's Design & Engineering BusinessIn a bold move that underscores the accelerating…Read More
TSMC 2025 Update: Riding the AI Wave Amid Global ExpansionWelcome to the second half of a very…Read More
Alchip’s 3DIC Test Chip: A Leap Forward for AI and HPC InnovationToday Alchip Technologies, a Taipei-based leader in high-performance…Read More
There is a nice serendipity in discovering that two companies I cover are working together. Good for them naturally but makes my job easier because I already have a good idea about the benefits of the partnership. Synopsys and ANSYS announced a collaboration at DAC 2017 for accelerating design optimization for HPS, mobile and automotive.… Read More
We all know IP is critical for advanced ASIC design. Well-designed and carefully tested IP blocks and subsystems are the lifeblood of any advanced chip project. Those IP suppliers who can measure up to the need, especially at advanced process nodes, will do well, absolutely.
It is interesting to note that eSilicon now has a very … Read More
When I first started working in the semiconductor industry back in 1982, I realized that there was a race going on between the complexity of the system being designed and the capabilities of the technology in the tools and systems used to design them. The technology used to design the next generation of hardware was always lagging… Read More
The first clue was cloud vendors (Amazon, Google, IBM, etc…) at 55DAC for the first time ever with lots of cloud content including a Design on Cloud Pavilion. The second clue was the pre-briefing from Cadence last week. There has also been a lot of cloud chatter in the semiconductor ecosystem so yes, I saw this coming and EDA will get… Read More
There has been a lot of new information available about the leading-edge logic processes lately. Papers from IEDM in December 2017, VLSIT this month, the TSMC and Samsung Foundry forums, etc. have all filled in a lot of information. In this article I will summarize what is currently known.… Read More
It appears the current cycle has rolled over? The reason is memory & could be worsened by trade Figuring out length, depth and impact of the downturn? We had said that AMAT “called” the top of the cycle on their last conference call even though they may not think so. Semiconductor cycles always ends the same way. The… Read More
It’s hard to believe that this is the 55th DAC and even harder to believe that this will be my 35th. So much has changed in 35 years, with DAC back in San Francisco I expect a VERY big crowd and even bigger announcements, absolutely.
Not only is this an epic time for semiconductors, I would say that EDA is exciting again and the Mentor… Read More
In the early 1970s I was working on a PhD thesis based upon GaAs light emitting diodes, or LEDs. Many of my predecessors in the Materials Science and Engineering Department at Stanford had worked on other aspects of III-V compounds and some of them went… Read More
Functional and physical verification are easily the two long poles in most IC product developments. During a design implementation cycle, design teams tend to push physical verification (PV) step towards the end as it is a time consuming process and requires significant manual interventions.
PV Challenges
In the traditional… Read More
I’ve been visiting DAC for decades now, at first as an EDA vendor and since 2004 as a freelance EDA consultant. There’s always a buzz about what’s new, semiconductor industry trends, who is getting acquired and the latest commercial EDA and IP offerings. There’s so much vying for my attention at DAC each… Read More
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Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet