Reachability in Analog and AMS. Innovation in VerificationCan a combination of learning-based surrogate models plus…Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural PivotIn 2003, legendary computer architect Michael J. Flynn…Read More
Enabling RISC-V & AI Innovations with Andes AX45MPV Running Live on S2C Prodigy S8-100 Prototyping SystemQualifying an AI-class RISC-V SoC demands proving that…Read More
DAC News – A New Era of Electronic Design Begins with Siemens EDA AIAI is the centerpiece of DAC this year.…Read More
I wrote recently about a Siemens pre-announcement at DVCon on their directions in simulation+AI. On May 13th they officially announced a full spectrum of capabilities under the brand Questa One. Abhi Kolpekwar (VP/GM at Siemens EDA) more fully fleshed out the story for me. I asked why Siemens is late to this simulation+AI party.… Read More
Empyrean at DAC 2025: Full-Flow AMS/PMIC, SPICE Simulation, and AI-Accelerated Library Characterization
Empyrean returns to DAC 2025, showcasing our most advanced EDA solutions that power next-generation chip designs. This year, we spotlight three critical innovation areas:
Empyrean … Read More
For its 3rd DAC, Aniah comes to the show with a special treat for its customer : its new Analog Design Assistant, Amigo, makes analog and mixed-signal design engineers more productive every day. This product complements Aniah’s widely deployed, transistor-level verification solution, OneCheck.
Aniah is an EDA startup founded… Read More
I am tracking the shift to multi-die design, so it’s good to see Arteris extend their NoC expertise, connecting chiplets across an interposer. After all, network connectivity needs don’t stop at the boundaries of chiplets. A multi-die package is at a logical level just a scaled-up SoC for which you still need traffic routing and… Read More
See Agile Analog at DAC in the EE Times Chiplet Pavilion (Booth 2308, Level 2)
Learn how to enhance security and performance with our customizable analog IP
Agile Analog is delighted to announce that we will be back exhibiting at the Design Automation Conference (DAC). Come join us in the EE Times Chiplet Pavilion (booth 2308) to … Read More
Design Perfection from Concept to Tape-out Booth #1617 at DAC25 – June 23-25, 2025
Join us to learn how Altair’s world-class solutions are powering perfect semiconductor design.
The semiconductor industry operates at an accelerated pace, in which every second saved is a competitive advantage. You must rely on solutions
Tuple Technologies delivers Tropos, a platform automating IT infrastructure across Cloud, Hybrid or On-prem and DevSecOps for semiconductor IC, FPGA, and system design, optimizing costs and cybersecurity.
Attendees who step into the Tuple Technologies booth during DAC (Booth #1237) will see demonstrations of its Tropos … Read More
Stop by the Perforce booth to learn about our new partnership with Siemens and get a demo of the latest enhancements in Perforce IPLM, P4, and VersIC. We’re eager to hear about your current challenges and how our semiconductor design and data management solutions can ease your design and development hurdles. Plus, you can try your… Read More
Please join us at the Design Automation Conference 2025 where we will highlight the company’s wide range of EDA products and semiconductor IP targeting, Power Devices, Automotive, Memory, Displays, HPC, 5G / 6G, and IoT applications.
When: June 23 – 25, 2025, Exhibit Hours: 10:00 AM PDT – 6:00 PM PDT
Where: Moscone Center West,… Read More
Silicon Creations provides world-class IP for precision and general-purpose timing (PLLs and oscillators), high-performance multi-protocol and protocol-specific SerDes, high-speed I/Os, and accurate PVT sensors. Applications include high performance computing for AI, smart phones, wearables, consumer devices, … Read More
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Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot