At SAFE Forum 2026, Synopsys announced significant advancements in its collaboration with Samsung Foundry, expanding AI-powered design, verification, test, and IP solutions for Samsung’s most advanced process technologies. The announcement underscores the growing importance of electronic design automation (EDA), … Read More
Learn How llmda Uses Agentic AI to Generate Hardware Docs & Keep Them ConsistentAccurate, complete, and consistent technical documentation is a…Read More
TSMC Pioneers a New Era in AI-Powered Trade Secret Management, Achieving Intelligent Innovation Launching a "Creativity Integration…Read More
Breaking the Clock Lane Barrier: MIPI C-PHY/D-PHY Combo IP on TSMC N2PThe transition to advanced process nodes is reshaping…Read More
John Barr: The EDA Veteran and Award-Winning Needham Funds Portfolio ManagerJohn Barr, Portfolio Manager of the top-ranked Needham…Read MoreBroadcom Told the Truth. The Market Hasn’t Heard the Rest of It Yet.
Hock Tan and his CFO Kirsten Spears logged into the June 3 earnings call with numbers that should have satisfied anyone. AI semiconductor revenue hit $10.8 billion in Q2, up 143% year over year, above Broadcom’s own forecast. Full-year AI guidance went to $56 billion. The $100 billion fiscal 2027 target was reaffirmed. By any prior… Read More
Weebit Nano ReRAM Reaches Commercial Tape-Out Milestone
Weebit Nano has achieved a critical milestone in the commercialization of Resistive Random Access Memory (ReRAM) technology with the successful tape-out of two customer products integrating its embedded non-volatile memory IP. One of the products has already returned first silicon and demonstrated functional operation,… Read More
CEO Interview with Chuck Gershman of Owl Autonomous Imaging
Chuck Gershman is the CEO and co-founder of Owl Autonomous Imaging. He has spent more than 30 years in semiconductors, AI imaging, computer vision, and autonomous sensing technologies across executive management, engineering, marketing, business development, and operations.
Chuck is a Drexel University College of Engineering… Read More
CEO Interview with Mike Horton of HYFIX Spatial Intelligence
Mike Horton is a co-founder of HYFIX Spatial Intelligence, which builds GNSS hardware for decentralized positioning and timing networks, and GEODNET, the world’s largest decentralized GNSS reference network, and HYFIX Spatial Intelligence, which builds GNSS hardware for decentralized positioning and timing networks.… Read More
Podcast EP349: llmda.a’s Unique AI Fabric for Embedded Systems Development with Nagesh Gupta
Daniel is joined by Nagesh Gupta, CEO of llmda.ai. Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor. He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory interface generators… Read More
CEO Interview with Daniel Schall of Black Semiconductor
Dr. Daniel Schall is CEO and Co-Founder of Black Semiconductor. He holds a PhD in graphene optoelectronics from RWTH Aachen University. His work has shaped integrated photonics for over a decade, driving innovation in chip-to-chip communication. As co-founder of Black Semiconductor, his focus is on rethinking current solutions… Read More
Engineering Documentation is a Critical Source of Truth – Do You Know if it’s Accurate?
Embedded systems programs rarely fail because of a lack of execution capability. They fail because critical engineering documentation drifts out of alignment over time and distance. Simply put, the team is correctly following the wrong instructions. This includes requirements, architecture, implementation, verification,… Read More
Alchip Accelerates on AI ASIC Demand
Alchip Technologies reported improved financial results for the first quarter, reflecting continued momentum in advanced artificial intelligence (AI), high-performance computing (HPC), and custom ASIC demand. The company cited stronger customer engagement in leading-edge semiconductor designs and accelerating tape-out… Read More
Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More



Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools