Every family has that one wedding where, halfway through the toasts, someone leans over and whispers “wait, who’s paying for all this?” This is that wedding. OpenAI and Broadcom are the happy couple. Apollo Global Management walked the bride down the aisle. Nvidia may have just stood up to offer a toast, a very… Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions Market Leaders Including Cisco,…Read More
RISC-V and AI: The Architecture Shift Is NowThe semiconductor industry has experienced several defining transitions…Read More
PowerArtist RTL Power Estimation Folds into KeysightBack in the late 1990s, Sente launched a…Read More
Intel Foundry Expands the 18A Platform with 18A-P and Demonstrates Long-Term Technology Leadership at VLSI 2026At the 2026 VLSI Symposium, Intel Foundry provided…Read More
GPU-native mask rule checking eliminates the curvilinear mask rule check bottleneckAs semiconductor manufacturing pushes toward advanced nodes with…Read MoreThe Modulator Is Not the Product: Why AI Photonics Needs an Electro-Optical Realization Corridor
Co-packaged optics, silicon photonics, optical I/O, and photonic engines are becoming central topics in the future of AI infrastructure.
The common story is simple:
Copper is reaching limits.
Light can move data farther and more efficiently.
Therefore, AI systems will move from electrical interconnects toward optical interconnects.… Read More
All-Embracing Multiphysics Analysis for Chiplet-Based Systems
What systems can accomplish by combining semiconductors, AI, and software seems at times boundless. Chiplet-based semiconductors deliver this promise, allowing a myriad of complex digital, memory, analog and photonic functions to be condensed into a single semiconductor package for higher performance, lower power consumption… Read More
Semidynamics Brings Its Full Inference Stack to ISC HPC 2026 — And Why It Matters
AI inference is quickly becoming the real battleground for next-generation computing. Training still gets the headlines, but inference is where AI becomes a business, a service, and an infrastructure problem. Every chatbot response, agentic workflow, code assistant, scientific model, and enterprise copilot depends on … Read More
Chips&Media Signs Next-Gen ‘AV2’ Video IP Licensing Deal with North American Big Tech, Strengthening Global Standards Leadership
Chips&Media, a leading provider of video intellectual property (IP) solutions, has announced a strategic licensing agreement with a major North American technology company for its next-generation AV2 video codec IP. The agreement marks a significant milestone for the company as demand accelerates for advanced video… Read More
How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26
I recently covered what Samtec was doing at DesignCon 26. Samtec has a tendency to dominate any show it attends in multiple dimensions. The prior post focused on the company’s contributions to the technical agenda and the high-profile experts in attendance. While all that is interesting and valuable, attending a large show like… Read More
Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs
A deposition chamber drops out of production at 2 a.m. Forty minutes later it is back, the dashboard flips from red to green, and two people want opposite things. The operations-center operator has a step starving downstream and wants the tool dispatched now. The module’s shift group leader wants test wafers run and confirmed… Read More
AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk
As semiconductor complexity accelerates across AI, automotive, and edge computing markets, SoC architecture has become a critical determinant of commercial success. Modern silicon programs must simultaneously achieve aggressive performance-per-watt targets, support evolving workloads, and maintain manageable development… Read More
AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption
Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge computing, and aerospace/defense.… Read More
CEO Interview with Mark Goranson of EMASS
Mark Goranson is the Chief Executive Officer EMASS, a wholly owned subsidiary of Nanoveu, for which they serve as the semiconductor technology division. With more than 45 years in the global semiconductor industry, he has held senior leadership roles at companies including Intel, Freescale Semiconductor, and ON Semiconductor.… Read More


Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs