When a small team at Intel began work on its second-generation 8-bit microcontroller in the summer of 1978, they took lessons from their first effort, the 8048, hoping to create something more flexible and enduring. Approaching five decades later, their creation, the 8051, is still going strong, although the current offerings… Read More
The Yield Partnership: Intel and PDF Solutions Tackle Advanced NodesOne of the most difficult things to do…Read More
Webinar: Faster Design Spec to Implementation using IP-XACTAs SoC design flows grow increasingly complex, IP-XACT…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateI recently posted an overview of an upcoming…Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets EraThe semiconductor industry is entering a new era…Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions Market Leaders Including Cisco,…Read MoreCEO Interview with Tom (TJ) Jackson of Softchip
Tom Jackson is a serial entrepreneur who founded multiple successful technology ventures with expertise in turning around struggling companies. Experienced in developing strategic partnerships across the technology sector. Skilled at translating complex technical innovations into compelling, value propositions for… Read More
CEO Interview with Yossi Meyouhas of Xsight Labs
Yossi Meyouhas is the CEO of Xsight Labs. Yossi joined Xsight Labs in May 2021 as Chief Operating Officer. Prior to Xsight Labs, Yossi was SVP R&D in Valens Semiconductors (2017-2021), and before that served in multiple senior positions in Marvell Technology Group, the last being SVP Engineering and General Manager of Marvell
Podcast EP352: The Path to High Impact Parallel AI Agents with ChipAgents CEO and Founder William Wang
Daniel is joined by William Wang the CEO and Founder of ChipAgents.ai, the category-leading agentic AI platform for advancing agent-based AI approaches for semiconductor workflows. He is also the Mellichamp Endowed Chair Professor of AI and Designs at UC Santa Barbara, and a global leader in fundamental AI research. He founded… Read More
Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?
Intel’s 18A process technology has become one of the most scrutinized semiconductor manufacturing nodes in the industry. It represents Intel’s introduction of two major innovations: RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery (BSPD). These technologies are intended to improve transistor… Read More
WEBINAR: Why Google Cloud NetApp Volumes Matter for Modern EDA Workloads
In this webinar, Google Cloud and NetApp explore how semiconductor companies can address the growing infrastructure demands of modern Electronic Design Automation (EDA) workflows. As process technologies continue to advance and chip designs become increasingly complex, engineering teams require scalable, high-performance… Read More
How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late
Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.
llmda.ai… Read More
COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era
COMPUTEX 2026 officially concluded under the theme “AI Together,” bringing the global semiconductor and computing ecosystem together to showcase the latest advances in artificial intelligence, HPC, and intelligent systems. While AI accelerators and advanced computing platforms dominated the exhibition floor, one collaboration… Read More
The Wedding of the Year: Why AI Infrastructure Financing Is Becoming a Semiconductor Story
Every family has that one wedding where, halfway through the toasts, someone leans over and whispers “wait, who’s paying for all this?” This is that wedding. OpenAI and Broadcom are the happy couple. Apollo Global Management walked the bride down the aisle. Nvidia may have just stood up to offer a toast, a very… Read More
The Modulator Is Not the Product: Why AI Photonics Needs an Electro-Optical Realization Corridor
Co-packaged optics, silicon photonics, optical I/O, and photonic engines are becoming central topics in the future of AI infrastructure.
The common story is simple:
Copper is reaching limits.
Light can move data farther and more efficiently.
Therefore, AI systems will move from electrical interconnects toward optical interconnects.… Read More


Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?