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SEMICON West’s “Bridging design and Manufacturing with AI” Design Session Explores AI as Practical Lever Across Entire Lifecycle

SEMICON West’s “Bridging design and Manufacturing with AI” Design Session Explores AI as Practical Lever Across Entire Lifecycle
by Admin on 09-23-2026 at 10:00 am

Bridging sign and Manufacturing with AI

By Julie Rogers, Executive Director, Electronic System Design Alliance

2026 is “Bridging Design and Manufacturing with AI” during a day-long session Tuesday, October 13, from 10:30 a.m. to 4:30 p.m. at San Francisco’s Moscone Center, North Hall, Lower Level, Room 20.

The Design Session hosted and organized by the ElectronicRead More


Silicon Valley, à la Française – One Year On

Silicon Valley, à la Française – One Year On
by Lauro Rizzatti on 09-23-2026 at 8:00 am

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One Year Later — September 2026

When this piece first ran a year ago, VSORA was the quiet outsider, a company with a bold architecture and no Silicon Valley address. One year on, the thesis has held up better than even its author expected. In January 2026, Sandra Rivera, former CEO of Altera and, before that, a two-decade Intel veteran… Read More


Why ASML Is Racing to Build 110 EUV Machines

Why ASML Is Racing to Build 110 EUV Machines
by Daniel Nenni on 09-23-2026 at 6:00 am

Why ASML Is Racing to Build 110 EUV Machines

ASML is exploring how to produce more than 110 extreme ultraviolet lithography machines in 2028, reflecting the extraordinary investment flowing into artificial intelligence infrastructure. The Dutch semiconductor-equipment company expects to manufacture at least 80 EUV systems in 2027 and is considering another production… Read More


Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure

Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure
by Kalar Rajendiran on 09-22-2026 at 2:00 pm

Image for Article 1 SemiWiki Silicon to Systems

The recent AI Infra Summit was exceptionally jam-packed, filled to the brim with compelling talks, overlapping tracks, and emerging technologies. Amid the noise of the event, there were many excellent presentations detailing the physical realities of scaling hardware. But one presentation in particular caught my attention… Read More


The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report

The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report
by Daniel Nenni on 09-22-2026 at 10:00 am

The State of the U.S. Semiconductor Manufacturing Workforce 2026 Benchmark Report

America’s semiconductor workforce is entering a decisive growth period, but employment capacity is not yet keeping pace with investment. New fabrication plants, packaging facilities, and supplier expansions are creating demand for thousands of engineers, technicians, operators, and skilled tradespeople. Whether the… Read More


Weebit Nano’s FY26 ESG Performance: Technical Progress and Strategic Importance

Weebit Nano’s FY26 ESG Performance: Technical Progress and Strategic Importance
by Daniel Nenni on 09-22-2026 at 8:00 am

Weebit Nano’s FY26 ESG Performance Technical Progress and Strategic Importance

Weebit Nano’s FY26 ESG Report shows how sustainability, governance and operational resilience are becoming integrated into the company’s commercialisation of resistive random-access memory (ReRAM). This integration matters because Weebit’s value is not derived from manufacturing and selling finished chips directly.… Read More


Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L

Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L
by Daniel Nenni on 09-22-2026 at 6:00 am

TSMC CoWos Packaging Comparison

Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing… Read More


Agentic AI Is Reshaping Semiconductor Design

Agentic AI Is Reshaping Semiconductor Design
by Daniel Nenni on 09-21-2026 at 10:00 am

ChipAgents DAC2026

Artificial intelligence is moving rapidly from an experimental aid to a foundational part of semiconductor engineering. In a recent industry talk, leaders from ChipAgents and Analog Devices described how agentic AI could help chipmakers manage soaring design complexity, accelerate product development, and improve the … Read More


The Future of CPO May Be a Glass Integration Platform

The Future of CPO May Be a Glass Integration Platform
by Moh Kolb on 09-21-2026 at 8:00 am

CPO on a glass patfrom

Co-packaged optics is usually described as a proximity problem.

Move the optical engine closer to the switch ASIC or XPU. Shorten the electrical path. Reduce SerDes power. Increase bandwidth density.

That direction is real.

Optical functionality is moving progressively closer to compute.

But proximity does not eliminate … Read More


Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips

Analog Bits Targets the Power Challenge at the Heart of Next-Generation Chips
by Daniel Nenni on 09-21-2026 at 6:00 am

Analog Bits Targets the Power Challenge at the Heart of Next Generation Chips

Analog Bits is expanding its role in advanced semiconductor design with new intellectual property aimed at one of the industry’s most difficult problems: delivering, monitoring, and managing power inside increasingly complex chips.

The company announced that its IP will be included in an upcoming customer test-chip tapeout… Read More