Semiconductor Intelligence estimates total semiconductor industry capital spending (CapEx) was $166 billion in 2025, up 7% from 2024. We estimate 2026 CapEx will be $200 billion, up 20% from 2025. TSMC was the largest spender in 2024 with $40.9 billion in CapEx, 25% of the total. TSMC projects 2026 CapEx will be between $52 billion… Read More
Scaling Multi-Die Connectivity: Automated Routing for High-Speed InterfacesThis article concludes the three-part series examining key…Read More
Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet SummitAt the recent Chiplet Summit, presentations, discussions and…Read More
Captain America: Can Elon Musk Save America's Chip Manufacturing Industry?Intel has posted three consecutive years of falling…Read MoreRISC-V Now! — Where Specification Meets Scale!
In forty plus years as a semiconductor professional I have never seen a semiconductor design ecosystem build as fast and as strong as RISC-V. As a result, RISC-V Now! has emerged as a pivotal gathering, a conference with a clear and ambitious mission: To transform the open, modular, and flexible RISC-V ISA from an exciting specification… Read More
Nuclear Power and Design Automation
A couple of folks have asked me to write on nuclear power. Nuclear offers additional sources for power generation, a pressing concern thanks to demand from giant data centers. Also, investment by Microsoft, Sam Altman and others signals their urgency to accelerate past slow moving utilities plans. I have some background in this… Read More
CEO Interview with Charlie Peppiatt of Gooch & Housego
Charlie Peppiatt has served as Chief Executive Officer of Gooch & Housego since September 2022. He joined the company from TT Electronics, where he was Executive Vice President following TT’s acquisition of Stadium Group plc. Prior to that, Charlie served as Chief Executive Officer of Stadium Group from 2013 until its acquisition… Read More
CEO Interview with Jussi-Pekka Penttinen of Vexlum Ltd
Jussi-Pekka Penttinen is the chief executive officer, chief technical officer, and cofounder of Vexlum Ltd, an advanced laser technology company. With more than 15 years of experience, he is a leading researcher in the field of Vertical External Cavity Surface Emitting Laser (VECSEL) and successfully commercialized the technology.… Read More
Sensors Converge: Where Intelligence Meets the Edge
The Sensors Converge Conference is one of the premier technical gatherings dedicated to the design, integration, and deployment of sensing technologies across industries. The event brings together engineers, system architects, researchers, and product developers to explore advancements in sensor hardware, edge computing,… Read More
CEO Interview with JP Pentinen of Vexlum
Jussi-Pekka Penttinen is the chief executive officer, chief technical officer, and cofounder of Vexlum Ltd, an advanced laser technology company. With more than 15 years of experience, he is a leading researcher in the field of Vertical External Cavity Surface Emitting Laser (VECSEL) and successfully commercialized the technology.… Read More
Podcast EP337: The Importance of Network Communications to Enable AI Workloads with Abhinav Kothiala
Daniel is joined by Abhinav Kothiala, a principal product manager for the Synopsys Ethernet IP portfolio. He has over 12 years of experience across engineering and product management, spanning SoC design, functional verification, and building wireless connectivity platforms and IoT products. He also holds two patents in… Read More
Musk’s Orbital Compute Vision: TERAFAB and the End of the Terrestrial Data Center
At the TERAFAB launch event in Austin on March 21, Elon Musk made a prediction that would have sounded like science fiction a decade ago—and may still: roughly 80 percent of AI compute will eventually move off-planet.
The argument is straightforward once you accept his premises. Earth-based data centers face three hard constraints—land,… Read More
Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era
As semiconductor technology advances into increasingly complex and expensive process nodes, the economic and technical risks associated with ASIC design have grown dramatically. At advanced nodes such as Intel 18A, the cost of a single design error can escalate into tens of millions of dollars, compounded by months of delay.… Read More



Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era