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The Invisible Bottleneck Is Costing You Time You Can’t Get Back

The Invisible Bottleneck Is Costing You Time You Can’t Get Back
by Admin on 09-17-2026 at 8:00 am

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By Joel Jorgensen, FlowAccel.

The 2026 Siemens EDA and Wilson Research Group study just came out. Verification now eats close to half the schedule on every IC and FPGA program. I don’t doubt that number. What I don’t know is how much of it is actually verification, and how much of it is something else showing up disguised… Read More


ASML Has High-NA and Chipmakers Can’t Say No

ASML Has High-NA and Chipmakers Can’t Say No
by Daniel Nenni on 09-17-2026 at 6:00 am

ASML Has High NA and Some Chipmakers Can’t Say No

ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More


Podcast EP366: How Cognichip is Changing Chip Design with Faraj Aalaei

Podcast EP366: How Cognichip is Changing Chip Design with Faraj Aalaei
by Daniel Nenni on 09-16-2026 at 10:00 am

Daniel is joined by the CEO of Cognichip, Faraj Aalaei, a successful visionary entrepreneur with over 40 years of distinguished experience in communications and networking technologies. As a leading entrepreneur in Silicon Valley, he was responsible for building and leading two semiconductor companies through IPOs as a founder… Read More


Arm targets the agentic AI era with new edge, cloud and robotics platforms

Arm targets the agentic AI era with new edge, cloud and robotics platforms
by Daniel Nenni on 09-16-2026 at 8:00 am

Arm targets the agentic AI era with new edge, cloud and robotics platforms

Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives and … Read More


Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI

Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI
by Lauro Rizzatti on 09-16-2026 at 6:00 am

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Instead of tweaking existing designs, VSORA built an AI chip from scratch to fix the real bottleneck: moving data fast enough to keep the math circuits busy.

There’s a version of the AI hardware story that everyone in the chip industry has heard a hundred times. A startup raises money on a clever chip design, promises to topple… Read More


A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography

A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography
by Admin on 09-15-2026 at 10:00 am

Photoresist Bake Influence on DUV Stochastics

Deep-ultraviolet (DUV) immersion lithography remains a critical patterning technology for advanced semiconductor manufacturing. Using a 193 nm ArF exposure system with water between the projection lens and wafer, immersion lithography increases numerical aperture and enables smaller features than dry exposure. However,… Read More


UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips

UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips
by Daniel Nenni on 09-15-2026 at 8:00 am

UWB Without the Integration Headache Ceva and LG Bring Precision to More Chips

Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More


PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity

PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
by Admin on 09-15-2026 at 6:00 am

PCIe 7 Switch IP with Time Division Multiplexing

By Tim Messegee, Senior Director of Solutions Marketing at Rambus

PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs… Read More


CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps

CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps
by Daniel Nenni on 09-14-2026 at 10:00 am

CAST TCPIP 100G PressFigure

CAST has introduced TCPIP-100G, a synthesizable intellectual-property core that implements a complete TCP/IP stack in hardware for ASICs and FPGAs. The core is designed to transmit and receive at up to 100 Gbps without depending on a host processor. That distinction is important: this is not simply a checksum engine or a network-interface… Read More


Semiconductor Engineering Has a State-Continuity Problem

Semiconductor Engineering Has a State-Continuity Problem
by Moh Kolb on 09-14-2026 at 8:00 am

Semi eng state conti Problem sept11 semiwiki

Product realization depends not only on reaching the next engineering state, but on preserving the relationships between states from intent through qualification, release, and lifecycle learning.

Semiconductor development is usually described as a sequence of activities: architecture, design, fabrication, packaging,… Read More