Banner 1 800X100 (1) (1)

How Fast Can a Performance Model Actually Be Built?

How Fast Can a Performance Model Actually Be Built?
by Admin on 07-26-2026 at 4:00 pm

SimplEx MicroCircuitSutra Performance Model 2026 07 20 Fig

By Thang Tran, CEO of Simplex Micro and Umesh Sisodia, CEO of CircuitSutra

Performance models have a reputation problem. They’re often treated as a long-lead, high-effort undertaking — something a design team commits to early and then waits on for months before it’s useful. The development of SimplEx Micro’s… Read More


Five Myths about the Current Memory Boom

Five Myths about the Current Memory Boom
by Daniel Nenni on 07-26-2026 at 4:00 pm

Five Myths about the Current Memory Boom

The current semiconductor memory boom is mainly an AI-driven capacity-allocation problem, not simply a lack of factories.

AI accelerators require enormous quantities of high-bandwidth memory, or HBM. HBM is used alongside GPUs and custom AI chips because it can move data much faster than ordinary server memory. As companies… Read More


CEO Interview with Ohad Agami of Hiveware

CEO Interview with Ohad Agami of Hiveware
by Daniel Nenni on 07-26-2026 at 2:00 pm

ohad3

Ohad Agami is the co-founder and CEO of Hiveware, a semiconductor verification company he started in Tel Aviv in 2023 with CTO Yaniv Pascal. He has a systems-focused engineering background with deep experience in semiconductor architectures and complex verification flows, built at the AI chip company Hailo and earlier in Israel’s… Read More


Podcast EP357: How Gonka is Changing the Way AI is Accessed with David Liberman

Podcast EP357: How Gonka is Changing the Way AI is Accessed with David Liberman
by Daniel Nenni on 07-24-2026 at 2:00 pm

Daniel is joined by David Liberman, a Los Angeles-based futurist, serial entrepreneur, investor, and former Director of Products at Snap, as well as the co-creator of the Gonka protocol. Gonka is a decentralized protocol that connects people who need computing power for AI with operators who provide GPU hardware. Its goal is … Read More


TSMC CoPoS Versus Intel EMIB Semiconductor Packaging

TSMC CoPoS Versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-24-2026 at 10:00 am

TSMC CoPos Versus Intel EMIB 2026

TSMC’s CoPoS, generally described as Chip-on-Panel-on-Substrate, and Intel’s EMIB, or Embedded Multi-die Interconnect Bridge, address the same strategic problem: integrating increasingly large, heterogeneous chiplet systems. However, they attack different physical constraints. CoPoS is an emerging panel-level … Read More


The Silicon Shield Has Never Been Stronger!

The Silicon Shield Has Never Been Stronger!
by Daniel Nenni on 07-24-2026 at 6:00 am

The Taiwan Silicon Shield

The “Silicon Shield” describes the idea that Taiwan’s central role in advanced semiconductor manufacturing raises the economic and strategic cost of military action against the island. The shield is not a literal defense system. It is a form of structural deterrence created by technological concentration: governments and… Read More


PCs & Smartphones Supply Constrained

PCs & Smartphones Supply Constrained
by Bill Jewell on 07-23-2026 at 4:00 pm

Semiconductor Intelligence July 2026 1

Global unit shipments of PCs and smartphones were both down versus a year ago in the 2nd quarter of 2026, according to IDC. PCs were down 4.9% and smartphones were down 6.7%. Both PCs and smartphones showed growth in 2024 and 2025. IDC is predicting an 11.3% decline in PCs and a 13.9% decline in smartphones in 2026.

What is causing the… Read More


Agentrys Designs a Real Chip with its Multi-Agent Workforce

Agentrys Designs a Real Chip with its Multi-Agent Workforce
by Mike Gianfagna on 07-23-2026 at 2:00 pm

Agentrys Designs a Real Chip with its Multi Agent Workforce

The face of EDA is changing. For forty years, this industry has focused on optimizing algorithms for design, verification and implementation of chips. That work has delivered some ground-breaking innovations. Logic synthesis is a good example. There are so many more. Thanks to the innovations commonly referred to as FrontierRead More


Must-See DAC Panel – Build vs Buy: Who Owns the Intelligence Behind Tomorrow’s Chips?

Must-See DAC Panel – Build vs Buy: Who Owns the Intelligence Behind Tomorrow’s Chips?
by Mike Gianfagna on 07-23-2026 at 10:00 am

Panel

This year, DAC will be buzzing about AI from every direction. The debate of build vs. buy will also be a popular topic. And the debate of who owns the intellectual property embodied in chip designs and how to control it will also get a significant amount of airtime. These are all interesting and compelling discussion points. It turns… Read More


BRONCO AI: WIN THE RACE TO TAPE-OUT | BOOTH 935

BRONCO AI: WIN THE RACE TO TAPE-OUT | BOOTH 935
by Daniel Nenni on 07-23-2026 at 8:00 am

Bronco Dac26 Semiwiki Banner

Bronco AI builds AI agents for chip design and verification. Our goal is to get teams from spec to RTL-freeze as fast as possible by surfacing the nastiest bugs sooner and fixing them faster.

Our agents work the way strong engineers do: they read the spec, form hypotheses, run experiments, and chase a problem until it is root-caused,… Read More