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The Foundry Model Is Morphing — Again

The Foundry Model Is Morphing — Again
by Jonah McLeod on 01-29-2026 at 10:00 am

SIP Market

When Morris Chang left Texas Instruments in 1983 to found TSMC, he was not merely starting a new company—he was proposing a new industrial logic. Chang recognized that semiconductor manufacturing had become so capital-intensive that it could no longer survive as just one function inside a vertically integrated company.… Read More


2026 Outlook with Mathew Burns of Samtec

2026 Outlook with Mathew Burns of Samtec
by Daniel Nenni on 01-29-2026 at 8:00 am

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We have been working with Matt and Samantec for the past 5 years. Samtec is a billion dollar privately-held manufacturer with a wide range of electronic interconnect products that are critical in high-speed and high-reliability systems.

Matt has been with Samtec for more than 10 very important year developing go-to-market strategies… Read More


2025 Retrospective. Innovation in Verification

2025 Retrospective. Innovation in Verification
by Bernard Murphy on 01-29-2026 at 6:00 am

Innovation New

As usual in January we start with a look back at the papers we reviewed last year. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series on research ideas. As always, feedback welcome.

Looking back at 2025

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The Chronicle of TSMC CoWoS

The Chronicle of TSMC CoWoS
by Daniel Nenni on 01-28-2026 at 10:00 am

Chronical of CoWoS

As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More


2026 Outlook with Shelly Henry of MooresLabAI

2026 Outlook with Shelly Henry of MooresLabAI
by Daniel Nenni on 01-28-2026 at 8:00 am

Shelly Henry MooresLabAI

Tell us a little bit about yourself and your company.

I’m Shelly Henry, CEO and co-founder of MooresLabAI. After two decades of building chips for Xbox, HoloLens, and Azure, I reached a point where I knew the industry needed a reset. So I teamed up with fellow engineers, Shashank Chaurasia and Sirish Munipalli to create MooresLabAI—a… Read More


Synopsys’ Secure Storage Solution for OTP IP

Synopsys’ Secure Storage Solution for OTP IP
by Kalar Rajendiran on 01-28-2026 at 6:00 am

Synopsys Secure Storage Solution for OTP IP

For decades, One-Time Programmable (OTP) memory has been viewed as a foundational element of hardware security. Because OTP can be written only once and cannot be modified afterward, it has traditionally been trusted to store cryptographic keys, secure boot code, device identity, and configuration data. Permanence was often… Read More


Weebit Nano Reports on 2025 Targets

Weebit Nano Reports on 2025 Targets
by Daniel Nenni on 01-27-2026 at 10:00 am

Weebit Nano 2025 Success

In early January 2026, Weebit Nano Ltd. (ASX: WBT) released a comprehensive report detailing its performance against the 2025 commercial and technical targets the company had set at its 2024 Annual General Meeting. The announcement highlighted significant progress in both business development and technology qualification,… Read More


2026 Outlook with Steve Roddy of Quadric

2026 Outlook with Steve Roddy of Quadric
by Daniel Nenni on 01-27-2026 at 8:00 am

2026 Outlook SemiWiki Image

Tell us a little bit about yourself and your company.

I am the Chief Marketing Officer at Quadric, where I have spent the past four years helping scale the company’s market presence and customer engagement. Quadric is a pure-play IP licensing company that has been operating for more than seven years. We specialize in a truly unique,… Read More


Hierarchical Device Planning as an Enabler of System Technology Co-Optimization

Hierarchical Device Planning as an Enabler of System Technology Co-Optimization
by Kalar Rajendiran on 01-27-2026 at 6:00 am

Connectivity in a Hierarchical IC Package Floorplan

AI, hyperscale data centers, and data-intensive workloads are driving unprecedented demands for performance, bandwidth, and energy efficiency. As the economic returns of traditional transistor scaling diminish, advanced IC packaging and heterogeneous integration have become the primary levers for system-level scaling.… Read More


SiFive to Power Next-Gen RISC-V AI Data Centers with NVIDIA NVLink Fusion

SiFive to Power Next-Gen RISC-V AI Data Centers with NVIDIA NVLink Fusion
by Daniel Nenni on 01-26-2026 at 10:00 am

SiFive Data Center Nvidia NVLink Fusion

In a strategic move that could reshape the future of AI data center design, SiFive, a leading developer of RISC-V processor IP and compute subsystems, has announced plans to integrate NVIDIA’s NVLink Fusion interconnect technology into its high-performance data center platforms. This collaboration bridges the open-architecture… Read More