TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win OrdersTSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity…Read More
The Invisible Bottleneck Is Costing You Time You Can't Get BackBy Joel Jorgensen, FlowAccel. The 2026 Siemens EDA…Read More
Arm targets the agentic AI era with new edge, cloud and robotics platformsArm is expanding its computing platform for an…Read More
Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AIInstead of tweaking existing designs, VSORA built an…Read More
At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through … Read More
Daniel is joined by Aveek Sarkar, who heads TSMC’s Ecosystem and Alliance Management Division. Along with his team, he is responsible for driving semiconductor design enablement in collaboration with the partner ecosystem through TSMC’s Open Innovation Platform® (OIP). Prior to TSMC, Aveek worked on chip designs at Sun Microsystems… Read More
By Julie Rogers, Executive Director, Electronic System Design Alliance
2026 is “Bridging Design and Manufacturing with AI” during a day-long session Tuesday, October 13, from 10:30 a.m. to 4:30 p.m. at San Francisco’s Moscone Center, North Hall, Lower Level, Room 20.
The Design Session hosted and organized by the Electronic… Read More
One Year Later — September 2026
When this piece first ran a year ago, VSORA was the quiet outsider, a company with a bold architecture and no Silicon Valley address. One year on, the thesis has held up better than even its author expected. In January 2026, Sandra Rivera, former CEO of Altera and, before that, a two-decade Intel veteran… Read More
ASML is exploring how to produce more than 110 extreme ultraviolet lithography machines in 2028, reflecting the extraordinary investment flowing into artificial intelligence infrastructure. The Dutch semiconductor-equipment company expects to manufacture at least 80 EUV systems in 2027 and is considering another production… Read More
The recent AI Infra Summit was exceptionally jam-packed, filled to the brim with compelling talks, overlapping tracks, and emerging technologies. Amid the noise of the event, there were many excellent presentations detailing the physical realities of scaling hardware. But one presentation in particular caught my attention… Read More
America’s semiconductor workforce is entering a decisive growth period, but employment capacity is not yet keeping pace with investment. New fabrication plants, packaging facilities, and supplier expansions are creating demand for thousands of engineers, technicians, operators, and skilled tradespeople. Whether the… Read More
Weebit Nano’s FY26 ESG Report shows how sustainability, governance and operational resilience are becoming integrated into the company’s commercialisation of resistive random-access memory (ReRAM). This integration matters because Weebit’s value is not derived from manufacturing and selling finished chips directly.… Read More
Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing… Read More
Artificial intelligence is moving rapidly from an experimental aid to a foundational part of semiconductor engineering. In a recent industry talk, leaders from ChipAgents and Analog Devices described how agentic AI could help chipmakers manage soaring design complexity, accelerate product development, and improve the … Read More
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