PDF Solutions’ Exensio Was Built for Semiconductor Analytics. The New Exensio Aurora Architecture Is Built for Semiconductor Intelligence.The semiconductor industry doesn't have a shortage of…Read More
Beyond Moore: Co-Optimizing AI from Systems to Materials System Technology Co-optimization in…Read More
Focusing on the AI Big Picture with Moores Lab AI at DAC 2026DAC 2026 proved that agentic AI design flows…Read More
Key Takeaways from the webinar:
Multi-agent intelligent assistant systems of the future will be architected to automate and augment SoC design and security verification and redefining semiconductor innovation, reshaping design, verification and security for the next generation of trusted silicon.
The ESD Alliance is delighted… Read More
This late summer, Quadric is taking its vision for programmable, on-device AI to three of the industry’s most influential gatherings. From advanced processor design at HotChips to scalable deployment at the AI Infra Summit and physical AI at Embedded World North America, each stop offers a different opportunity to see how the… Read More
The semiconductor industry doesn’t have a shortage of data. It has a shortage of ways to turn that data into useful manufacturing insights quickly enough to matter.
That is the problem PDF Solutions’ Exensio solution has addressed for years. Built specifically for semiconductor manufacturing, Exensio brings … Read More
At the OCP APAC Summit in Taiwan, August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message was more consequential than… Read More
DAC 2026 proved that agentic AI design flows are here to stay. The news was conveyed both by familiar companies who we’ve seen at DAC many times before as well as new entrants to the show and the industry. Many of the solutions that were presented focused on a specific part of the design flow. Others took a broader view of the problem and… Read More
Daniel is joined by Ed Nelson, Strategy Director and Co-Founder of AI Infra Summit. He co-leads the production team and specializes in product strategy and management, keynote speaker acquisition and VIP network development. Ed started the summit in 2018 and has spent nearly ten years as part of the team building AI Infra Summit… Read More
AI was everywhere at DAC 2026, so I stopped by the booth of Rise Design Automation to chat with Ellie Burns to hear what’s new this year. Ellie shared that Rise DA has added a new AI-powered flow to go from specification to a High Level Synthesis (HLS) model, to a RTL model. The reason for using a HLS model is to gain much more simulation… Read More
I believe this year’s DAC will be viewed as the time and place where EDA experienced a major shift. That is, the shift from the value of tools and methodology to the value of agentic design flows powered by highly trained agents. The design community will clearly need the tools and methodologies that have occupied DAC for years. But… Read More
Daniel is joined by Anne-Marie Tierney, Divisional Manager at IDA Ireland. Anne-Marie has 24 years’ experience in the global investment environment with IDA Ireland, working across several key roles in Ireland and abroad, positioning Ireland for high impact investments, with a specific interest in semiconductors. Prior … Read More
Researchers at National Yang Ming Chiao Tung University and TSMC Corporate Research engineered a 0.42-nanometer aluminum-oxide interface that protects electron transport in monolayer MoS₂ transistors while enabling strong gate control.
Silicon transistors are approaching physical limits that make each new generation… Read More
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