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As artificial intelligence (AI) and machine learning (ML) models continue to evolve at a breathtaking pace, the demands on hardware for inference and real-time processing grow increasingly complex. Traditional hardware architectures for acceleration are proving inadequate to keep up with these rapid advancements in ML … Read More
Design & Reuse held its IP-SoC Silicon Valley 24 event on April 25th, 2024, at the Hyatt Regency Santa Clara. The agenda was packed with many relevant and compelling presentations from companies large and small. I attended one presentation on security that stood out for me. Secure-IC presented “AI-powered cybersecurity:… Read More
Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… Read More
We have talked about fault localization (root cause analysis) in several reviews. This early-release paper looks at applying LLM technology to the task. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research… Read More
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DAC is right around the corner and this could possibly be the last one in San Francisco for a while so do not miss it. The weather will be absolutely great and there are many things to do outside of the conference including sailing on the bay.
The Design Automation Conference (DAC) is a premier event that focuses on the design and automation… Read More
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Poised for recovery in 2024 and driving toward a historic $1 trillion in revenue, the global semiconductor industry has an incredibly promising future, backed by an unprecedented number of growth drivers, market opportunities, and technology advancements. Nevertheless, amid record greenfield capital investments and government-backed… Read More
Dan is joined by Chet Babla, indie Semiconductor’s Senior Vice President of Strategic Marketing, responsible for expanding the company’s tier 1 and automotive OEM customer base, as well as supporting product roadmap development. Chet has worked in the technology industry for over 25 years in a variety of technical and commercial… Read More
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TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design