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Update on SystemC for High-Level Synthesis

Update on SystemC for High-Level Synthesis
by Tom Dillinger on 03-26-2019 at 12:00 am

The scope of current system designs continues to present challenges to verification and implementation engineering teams. The algorithmic complexity of image/voice processing applications needs a high-level language description for efficient representation. The development and testing of embedded firmware routines… Read More


Device-as-a-Service – a Market for the Future

Device-as-a-Service – a Market for the Future
by Krishna Betai on 03-25-2019 at 5:00 am

There is an emerging market in the world of IoT, and service providers are yet to realize the potential of it. With x-as-a-Service — x taking the shape of either software, platform, or infrastructure — already in play, it is only a matter of time before Device-as-a-Service becomes a cash cow for these providers.

Like its predecessors,… Read More


A Smarter Way to Do Multi-Board PCB Systems

A Smarter Way to Do Multi-Board PCB Systems
by Daniel Payne on 03-23-2019 at 2:15 pm

Many electronic product ideas start out as sketches on the back of a napkin, then migrate over to diagrams drawn in Visio or PowerPoint, finally entered into EDA-specific tools. With that methodology there’s a big disconnect between the diagrams drawn with a purely graphical tool and the EDA tools, because there’s… Read More


Semiconductor Market Downturn in 2019

Semiconductor Market Downturn in 2019
by Bill Jewell on 03-23-2019 at 5:00 am

The global semiconductor market grew 13.7% in 2018, according to World Semiconductor Trade Statistics (WSTS). Each year, we at Semiconductor Intelligence review semiconductor forecasts and compare them to the final WSTS data. We used projections which were publicly released from late 2017 through early 2018, prior to the … Read More


SPIE Advanced Lithography Conference – ASML EUV Update

SPIE Advanced Lithography Conference – ASML EUV Update
by Scotten Jones on 03-23-2019 at 12:00 am

At the SPIE Advanced Lithography Conference ASML gave an update on both the current 0.33NA system and the 0.55 high-NA system development. I saw the presentations and got to sit down with Mike Lercel (Director of Strategic Marketing).… Read More


Attend Parts of DAC For Free, Really

Attend Parts of DAC For Free, Really
by Daniel Payne on 03-22-2019 at 5:00 am

The Design Automation Conference (DAC) is the must-see, annual event for semiconductor professionals that design chips, use EDA software, and buy semiconductor IP. Like all conferences there’s an entrance fee, but for the 11th year now you can get a free pass, courtesy of three sponsors: Avatar Integrated Systems, ClioSoftRead More


Narrow-Band IoT Adoption Grows as IP Options Narrow

Narrow-Band IoT Adoption Grows as IP Options Narrow
by Bernard Murphy on 03-22-2019 at 12:00 am

Cellular as a method to communicate with the IoT is on a tear for obvious reasons. It’s long-range with no concerns about the lesser reach of Bluetooth or Wi-Fi, it needs no added infrastructure since it already works with 2G/3G/4G (and ultimately 5G I presume) and it’s designed for ultra-low power, supporting those devices expecting… Read More


ARM, NXP Share Usage, Challenges at Synopsys Lunch

ARM, NXP Share Usage, Challenges at Synopsys Lunch
by Bernard Murphy on 03-20-2019 at 7:00 am

Synopsys runs a “Industry verifies with Synopsys” lunch at each DVCon, which isn’t as cheesy as the title might suggest. The bulk of the lunch covers user presentations on their use of Synopsys tools which I find informative and quite open, sharing problems as much as successes. This year, Eamonn Quiqley, FPGA engineering manager… Read More


The Revolution Evolution Continues – SiFive RISC-V Technology Symposium – Part II

The Revolution Evolution Continues – SiFive RISC-V Technology Symposium – Part II
by Camille Kokozaki on 03-20-2019 at 5:00 am

During the afternoon session of the Symposium, Jack Kang, SiFive VP sales then addressed the RISC-V Core IP for vertical markets from consumer/smart home/wearables to storage/networking/5G to ML/edge. Embedding intelligence from the edge to the cloud can occur with U Cores 64-bit Application Processors, S Cores 64-bit Embedded… Read More


Qualcomm Intel Facebook and Semiconductor IP

Qualcomm Intel Facebook and Semiconductor IP
by Daniel Nenni on 03-20-2019 at 12:00 am

What does Qualcomm, Intel, and Facebook have in common? Well, for one thing they all bought network onchip communications (NoC) IP companies. As I have mentioned before, semiconductor IP is the foundation of the fabless semiconductor ecosystem and I believe this trend of acquisitions will continue. So, if you are going to start… Read More