imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMCAt the recent TSMC Technology Symposium 2026, Siemens…Read More
PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026As the threat of quantum computing to modern…Read More
Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)The semiconductor industry has achieved extraordinary mastery in…Read More
imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scalingimec announced that IC-Link by imec has joined…Read MoreCrossing the Yield Cliff: IDP V6 and the Future of Manufacturing Forecasting
The paper, Industrial Defectivity Prediction (IDP) V6: A Two-Layer Yield Cliff Framework for Cross-Industry Mass-Production Forecasting, presents a generalized industrial yield-modeling architecture that extends the classical Negative Binomial framework through a two-layer phenomenological structure designed … Read More
From the Selfie to Samantha: The Next Trillion-Dollar Behavior
At CES 2026, Samsung called it a “companion.” Lenovo called it “ambient intelligence.” OpenAI spent $6.4 billion on a screenless device designed to be a continuous presence in your pocket. Meta acquired Limitless, the AI pendant that had been tracking everything its wearers said and heard. Every major consumer electronics company… Read More
AI Chip Design Moves Beyond Monolithic Silicon with Alchip 3DIC
Artificial intelligence processors are entering a new era. For more than two decades, semiconductor innovation was driven primarily by transistor scaling and process node shrinks. Today, however, AI infrastructure demands are growing faster than traditional Moore’s Law improvements can sustain. The industry is now shifting… Read More
CEO Interview with RP Singh of Seasia Infotech
Rupinder Pal Singh is the co-founder and CEO of Seasia Infotech, a role he takes great pride in. Sharing insights into the business and industry is something he always looks forward to. As the leader of the Seasia Group of Companies, Singh is tasked with overseeing all aspects of operations, ensuring that the company delivers… Read More
CEO Interview with Adi Gelvan of Speedata
Adi Gelvan is a veteran tech executive and serial entrepreneur, currently serving as the CEO of SPEEDATA, a semiconductor startup redefining analytics infrastructure with its purpose-built Analytics Processing Unit (APU). Known for his sharp operational instincts and deep technical insight, Adi joined Speedata in 2025 … Read More
Podcast EP346: How EMD Electronics Bridges the “Lab to Fab” Gap With Ganesh Panaman
Daniel is joined by Ganesh Panaman, the President of Intermolecular Services at EMD Electronics. In his current role, Ganesh is dedicated to accelerating product time-to-market, securing first-mover advantages on disruptive technologies, and actively engaging with the dynamic startup ecosystem in the Silicon Valley. … Read More
TSMC’s Record Tool Orders Hint at Another CapEx Shockwave
TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More
CEO Interview with Nagesh Gupta of llmda.ai
Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor.
He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory interface generators for Xilinx designs and was later acquired by … Read More
The “New Shift-Left”: Why FPGA Prototyping is the Ultimate RISC-V IP Sandbox
In the EDA world, “Shift-Left” has traditionally been a mantra for early software development—booting the OS before the silicon even leaves the fab. But as the RISC-V revolution accelerates, the goalposts have moved. We are seeing the emergence of a “New Shift-Left”, one that focuses on critical architectural… Read More



ASML High-NA EUV is Not Ready for High-Volume Production