WEBINAR: Is Agentic AI the Future of EDA?The semiconductor industry is entering a transformative era,…Read More
FPGA Prototyping in Practice: Addressing Peripheral Connectivity ChallengesModern chip design verification often encounters challenges when…Read More
An Insight into Building Quantum ComputersGiven my physics background I’m ashamed to admit…Read More
I Have Seen the Future with ChipAgents Autonomous Root Cause AnalysisI have seen a lot of EDA tool…Read More
I have written before about an inter-chiplet communication challenge to realizing the dream of multi-die designs built around open-market chiplets. Still a worthy dream but it’s going to take a journey to get there. Arm recently donated their Foundation Chiplet System Architecture (FCSA) to the Open Compute Project (OCP) as… Read More
IP-XACT, defined by IEEE 1685, is a standard that pulls together IP packaging, integration, and reuse. For anyone building modern SoCs (Systems on Chip), IP-XACT isn’t just another XML schema: it is a productivity multiplier and a risk-reduction tool that brings order to your electronic system design.
What is IP-XACT?
IP-XACT… Read More
Murat Eskiyerli, PhD, is the founder of Revolution EDA
Modern software development environments have evolved dramatically. A developer can download Visual Studio Code, install a few plugins, and be productive within minutes. The cost? Perhaps a few hundred dollars per month for cloud development resources. Compare that to… Read More
The patterning of features outside a DRAM cell array can be just as challenging as those within the array itself [1]. The array contains features which are densely packed, but regularly arranged. On the other hand, outside the array, the minimum pitch features, such as the lowest metal lines in the periphery for the sense amplifier… Read More
Dr. Zou is one of the industry’s leading experts in power delivery for high performance processors. Before founding PowerLattice, he held technical leadership roles at Qualcomm/NUVIA, Huawei and Intel, where he led the multidisciplinary teams advancing integrated voltage regulator technologies across magnetic materials,… Read More
Daniel is joined by Pedro Pires, a product and technology leader with a strong background in IP and data management within the EDA industry. Currently a product manager at Keysight Technologies, he drives the roadmap for the AI-driven data management solutions. Pedro’s career spans roles in software engineering and data science… Read More
There were quite a few announcements at the Silicon Catalyst event at the Computer History Museum last week. The event itself was eventful with semiconductor legends in the audience and on the stage. First let’s talk about the announcements Silicon Catalyst made then we will talk about the event itself.
In addition to expanding… Read More
By Todd Burkholder and Per Viklund, Siemens EDA
The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More
Verification is always a top priority for any chip project. Re-spins result in lost time-to-market and significant cost overruns. Chip bugs that make it to the field present another level of lost revenue, lost brand confidence and potential costly litigation. If the design is part of the avionics or control for an aircraft, the… Read More
In the rapidly evolving landscape of connected devices, where artificial intelligence meets the physical world, Ceva has unveiled a groundbreaking solution: the Ceva-Waves Wi-Fi 7 1×1 client IP. Announced on October 21, 2025, this IP core is designed to supercharge AI-enabled IoT devices and pioneering physical AI systems,… Read More
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TSMC Formally Sues Ex-SVP Over Alleged Transfer of Trade Secrets to Intel