Synopsys is catalyzing the era of pervasive intelligence with comprehensive engineering solutions spanning silicon design, IP, and simulation and analysis. At this year’s Design Automation Conference (DAC), the company will showcase innovations transforming silicon and systems development for a wide range of applications… Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI ConnectivityPCI Express (PCIe), PCIe switches, Time Division Multiplexing…Read More
DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!Analog Bits, Inc. is an established provider of…Read More
Perforce Enabling Innovation Without Introducing Risk at DAC 2026Perforce delivers a DevOps Tech Stack for teams…Read More
Arteris at DAC 2026 Connecting Innovation for Silicon SuccessThe semiconductor industry has entered a new era…Read More
DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verificationMach42 spun out of the Department of Physics…Read MoreDAC 2026: Join Accellera for a dynamic luncheon exploring how artificial intelligence is reshaping the standards landscape for design and verification.
Accellera Systems Initiative invites the design and verification community to join us at the 2026 Design Automation Conference for a focused technical luncheon, “Embracing AI for Advanced Design and Verification,” on Tuesday, July 28, from 12:30–1:45 p.m. at the Long Beach Convention Center, Meeting Room 104C.
Artificial… Read More
Podcast EP355: An Overview of the Q126 Electronic Design Market Data Report with Wally Rhines
Daniel is joined by Wally Rhines, CEO of Silvaco to discuss the Electronic Design Market Data report that was just released. Wally is the industry coordinator for the EDA data collection program called EDMD. SEMI and the Electronic System Design Alliance collect data from almost all of the electronic design automation companies… Read More
Enabling AI to Understand Complex Runtime Behavior for Accurate, Automated Root Cause Analysis — DAC 2026
Undo gives AI coding agents the runtime context they need to solve hard problems in complex software and system verification workflows Undo’s technology records complete program execution, allowing engineers and AI coding agents to understand exactly what happened during execution rather than inferring behavior from source… Read More
AI Driven Semiconductor Systems
AI-driven semiconductor systems are the next major transformation in chip design and manufacturing. The central idea is that semiconductor workflows are becoming too complex, too data-intensive, and too time-sensitive to be managed only through traditional human-driven engineering processes. Modern chips now involve… Read More
CEO Interview with Dr. Albert Liu of Kneron
Dr. Albert Liu is the Founder and CEO of Kneron, a full-stack edge AI company pioneering next-generation Neural Processing Unit (NPU) architectures and localized AI infrastructure.
Widely recognized as a pioneer in NPU architecture, Dr. Liu has spent decades advancing AI hardware, semiconductor systems, and computer vision… Read More
Executive Interview with Ebrahim Hussain and Aaditya Subediand of Architect Labs
Ebrahim Hussain is Co-Founder of Architect Labs, where he is building AI-powered systems to accelerate semiconductor design and engineering. He brings deep expertise in AI and hardware development, with a focus on transforming how advanced chips are designed and brought to market.
Aaditya (Aadi) Subedi is Co-Founder of … Read More
Podcast EP354: How Siemens EDA is Conquering New Lithography Challenges with Sagar Saxena
Daniel is joined by Sagar Saxena, Senior Product Engineer at Siemens EDA specializing in computational lithography, optical proximity correction (OPC), and advanced patterning solutions for leading-edge semiconductor manufacturing. Sagar has led the development and deployment of advanced OPC technologies, including… Read More
CEO Interview with Mark Ren of Agentrys
Mark Ren has 26 years of EDA and AI R&D experience spanning IBM Research and NVIDIA Research, driving design automation innovations that power modern chip design. He received the IBM Corporate Award for contributions to the design closure for high-performance microprocessors. At NVIDIA, he helped establish the company
TSMC A16 Backside Power at VLSI 2026
TSMC’s A16 technology, presented as Paper T1.5 at the June 2026 IEEE/JSAP VLSI Symposium, marks the company’s first angstrom-class CMOS platform combining enhanced nanosheet gate-all-around transistors with backside power delivery. The key integration feature is Super Power Rail, or SPR, which TSMC describes as a backside… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging