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EDA Flows for 3D Die Integration

EDA Flows for 3D Die Integration
by Tom Dillinger on 07-20-2021 at 6:00 am

future integration

Background

The emergence of 2.5D heterogeneous die integration using a silicon (or organic) interposer has enabled unique system architectures.  The term “More than Moore” has been used to describe the circuit density and cost advantages of leveraging multiple die in the package, the die potentially in different process technologies. … Read More


How can Semiconductor Manufacturers add new Capacity to Meet Demand as Quickly as Possible?

How can Semiconductor Manufacturers add new Capacity to Meet Demand as Quickly as Possible?
by Daniel Nenni on 07-19-2021 at 10:00 am

Aston Webinar

The causes of the chip shortage crisis have been widely discussed, but what about specific solutions? How can semiconductor manufacturers add new capacity to meet demand as quickly as possible?

While there is a lot of talk about investment in building new chip plants, these traditional methods of manufacturing capacity growth… Read More


VLSI Technology Symposium – Imec Alternate 3D NAND Word Line Materials

VLSI Technology Symposium – Imec Alternate 3D NAND Word Line Materials
by Scotten Jones on 07-19-2021 at 6:00 am

T8 1 Arjun Page 08

At the 2021 VLSI Technology Symposium, Imec presented on Ruthenium (Ru) and Molybdenum (Mo) as alternate Word Line (WL) materials for 3D NAND Flash “First Demonstration of Ruthenium and Molybdenum Word lines Integrated into 40nm Pitch 3D NAND Memory Devices”. I had an opportunity to interview one of the authors: Maarten Rosmeulen.… Read More


Wireless Transportation Disruption

Wireless Transportation Disruption
by Roger C. Lanctot on 07-18-2021 at 10:00 am

Wireless Transportation Disruption

One of the toughest tech tasks is adopting a new emerging technology that is fundamentally incompatible with the old. In the realm of connected cars, car makers and their suppliers labored for more than two decades on a wireless standard – called dedicated short-range communications (DSRC) – that was intended to enable intervehicle

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GloFo inside Intel? Foundry Foothold and Fixerupper- Good Synergies

GloFo inside Intel? Foundry Foothold and Fixerupper- Good Synergies
by Robert Maire on 07-18-2021 at 6:00 am

Intel GlobalFoundries Acquisition

Intel reportedly talking to Abu Dhabi to buy GloFo for $30B
Would jumpstart Intel Foundry but require investment & repair
Avoids IPO risk – Allows Abu Dhabi escape- NY benefits
Doesn’t impact near term shortage or market share

Reported by WSJ- Intel in talks to buy GloFo
The Wall Street Journal reported that Intel… Read More


Podcast EP29: An exploration of Minima’s energy optimized design technology

Podcast EP29: An exploration of Minima’s energy optimized design technology
by Daniel Nenni on 07-16-2021 at 10:00 am

Dan is joined by Lauri Koskinen, CTO and co-founder of Minima Technology. Dan explores the unique near-threshold design and operation of Minima’s energy optimized technology.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization,… Read More


CEO Interview: Pete Rodriguez of Silicon Catalyst

CEO Interview: Pete Rodriguez of Silicon Catalyst
by Daniel Nenni on 07-16-2021 at 6:00 am

Pete Rodriguez Silicon Catalyst

Pete Rodriguez has over 35 years of experience in the Semiconductor industry. Pete is currently CEO of Silicon Catalyst and on the board of Hysai, advisory board of Harvest Management Partners and an observer on the boards of Mentium Technologies, Espre Technologies and Owl AI. Pete was formerly VP & GM of Interface and Power… Read More


Cadence Tensilica FloatingPoint DSPs

Cadence Tensilica FloatingPoint DSPs
by Kalar Rajendiran on 07-15-2021 at 10:00 am

Tensilica FP DSPs

Being engrossed in the digital information world, it is easy to forget that the real world is comprised of mostly analog signals and data. Digital Signal Processors (DSP) take digitized forms of these worldly signals and manipulate them mathematically. Although floating-point is a more relevant and accurate way of representing… Read More


Is EDA Growth Unstoppable?

Is EDA Growth Unstoppable?
by Mike Gianfagna on 07-15-2021 at 6:00 am

Is EDA Growth Unstoppable

SemiWiki has covered the Q2, Q3 and Q4 ESD Alliance quarterly revenue reports previously. The Q2 2020 report suggested that EDA had COVID immunity. The Q3 2020 report inspired an Up and to the Right comment. The Q4 2020 report  demanded a Juggernaut label.  And now the Q1 2021 report posts yet more record-breaking growth. This is … Read More


Fully Modeling the Semiconductor Manufacturing Process

Fully Modeling the Semiconductor Manufacturing Process
by Tom Simon on 07-14-2021 at 10:00 am

Modeling the Semiconductor Manufacturing Process

A lot of folks in the semiconductor business are familiar with Dassault Systèmes because of their product life cycle management (PLM) products for IC design. They are, of course well known in other industries as well for their 3D modeling and simulation software. Over the years they have added capabilities and intelligence to … Read More