I had the opportunity to speak with Pete Rodriguez and Alain Labat in regards to the upcoming webinar on M&A. I have worked with both Pete and Alain in the past so I can tell you personally that this event will be well worth your time. This is truly an all star cast with a collective experience base with billions of dollars worth of … Read More





A Hardware Security Standard Advances
Security is a slippery topic. We all agree that “something should be done”, but most of us are waiting for someone else to lead the way. There’s no shortage of proprietary solutions, though given the distributed nature of the problem it’s difficult to see how those separately or collectively can rise to the occasion. What we really… Read More
EDA Flows for 3D Die Integration
Background
The emergence of 2.5D heterogeneous die integration using a silicon (or organic) interposer has enabled unique system architectures. The term “More than Moore” has been used to describe the circuit density and cost advantages of leveraging multiple die in the package, the die potentially in different process technologies. … Read More
How can Semiconductor Manufacturers add new Capacity to Meet Demand as Quickly as Possible?
The causes of the chip shortage crisis have been widely discussed, but what about specific solutions? How can semiconductor manufacturers add new capacity to meet demand as quickly as possible?
While there is a lot of talk about investment in building new chip plants, these traditional methods of manufacturing capacity growth… Read More
VLSI Technology Symposium – Imec Alternate 3D NAND Word Line Materials
At the 2021 VLSI Technology Symposium, Imec presented on Ruthenium (Ru) and Molybdenum (Mo) as alternate Word Line (WL) materials for 3D NAND Flash “First Demonstration of Ruthenium and Molybdenum Word lines Integrated into 40nm Pitch 3D NAND Memory Devices”. I had an opportunity to interview one of the authors: Maarten Rosmeulen.… Read More
Wireless Transportation Disruption
One of the toughest tech tasks is adopting a new emerging technology that is fundamentally incompatible with the old. In the realm of connected cars, car makers and their suppliers labored for more than two decades on a wireless standard – called dedicated short-range communications (DSRC) – that was intended to enable intervehicle
GloFo inside Intel? Foundry Foothold and Fixerupper- Good Synergies
Intel reportedly talking to Abu Dhabi to buy GloFo for $30B
Would jumpstart Intel Foundry but require investment & repair
Avoids IPO risk – Allows Abu Dhabi escape- NY benefits
Doesn’t impact near term shortage or market share
Reported by WSJ- Intel in talks to buy GloFo
The Wall Street Journal reported that Intel… Read More
Podcast EP29: An exploration of Minima’s energy optimized design technology
Dan is joined by Lauri Koskinen, CTO and co-founder of Minima Technology. Dan explores the unique near-threshold design and operation of Minima’s energy optimized technology.
The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization,… Read More
CEO Interview: Pete Rodriguez of Silicon Catalyst
Pete Rodriguez has over 35 years of experience in the Semiconductor industry. Pete is currently CEO of Silicon Catalyst and on the board of Hysai, advisory board of Harvest Management Partners and an observer on the boards of Mentium Technologies, Espre Technologies and Owl AI. Pete was formerly VP & GM of Interface and Power… Read More
Cadence Tensilica FloatingPoint DSPs
Being engrossed in the digital information world, it is easy to forget that the real world is comprised of mostly analog signals and data. Digital Signal Processors (DSP) take digitized forms of these worldly signals and manipulate them mathematically. Although floating-point is a more relevant and accurate way of representing… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet