Todd Burkholder and Andras Vass-Varnai, Siemens EDA
As semiconductor devices become smaller, more powerful and more densely integrated, thermal management has shifted from an afterthought to a central challenge in modern IC design. In contemporary 3D IC architectures—where multiple chiplets are stacked and closely arrayed—power… Read More



![[white paper] Parasitic Analysis Figures](https://semiwiki.com/wp-content/uploads/2025/10/Fig1-net-level-visualization.jpg)



The AI PC: A New Category Poised to Reignite the PC Market