Senior Application Engineer
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Website ANSYS
Summary / Role Purpose
Join the Ansys Customer Excellence team to partner with our customers to engineer what’s ahead, solve their real-world engineering problems, deploy Ansys software in their design workflows, and grow Ansys’ business. As a hands-on expert in Ansys products, you will use advanced-level engineering knowledge to provide technical pre-sales support, perform professional services, and help translate customer requirements into exciting new product features. You will be working within Electronics thermal management team and multi-disciplinary teams to advance your knowledge, experience, and business impact.
Key Duties and Responsibilities
- Lead/Assist in coordinating and executing all technical activities throughout the sales opportunity lifecycle such as technical discovery, product presentations, demonstrations, and evaluations.
- Responsible for providing best in class thermal management solutions involving electronics chip, Package and System.
- Collaborate with the cross regional and cross functional teams to establish Multiphysics simulation workflows and solutions.
- Implement new age product development methodologies such as model order reduction and machine learning.
- Work in advanced technology areas such as 5G, Industrial IoT.
- Participate in external and internal events to further enhance Electronics thermal simulation solutions, marketing, and professional growth.
- As a product expert with one or more Ansys products, interact with customers to understand their product design needs and engineering design workflows; analyze how to address customers’ requirements using Ansys products and platform; articulate Ansys’ value proposition.
- Collaborate with the Ansys product development teams to translate customer requirements into exciting new product features; test new releases of Ansys products on industrial problems.
- Support Ansys field and digital marketing
- Contribute to consulting services, conduct introductory and/or intermediate training classes.
- Create custom workflows involving Ansys tools and machine learning libraries.
Minimum Education/Certification Requirements and Experience
- Required education and degree type: Master’s degree in Aerospace/Mechanical/Civil Engineering or related engineering field with 3~6 years of experience in electronics thermal simulation
- In depth understanding and fundamentals related to fluid dynamics and heat transfer is a must.
- Familiarity with package, printed circuit boards and connector design processes
- Experience in using programming language (Python, C#, Javascript etc.) for automating simulation workflows.
- Experience with using ANSYS Icepak or other thermal management simulation software involving real world, industry level applications.
- Experience having worked on machine learning projects.
- Familiarity with any machine learning library – TensorFlow, PyTorch, Theano, CNTK.
- Logical problem-solving, strong interpersonal and communication skills, fluent in writing and speaking English.
- Strong organizational and time management skills, possesses a sense of urgency.
- Projects a professional image and demonstrates business acumen, driven to succeed.
- Ability to travel domestically up to 25% of time
Preferred Qualifications and Skills
- Deep understanding of electronics industry trends, technologies, engineering environment, product design complexity, development challenges etc.
- Ability to understand customer requirements and generate requirements document.
- Flexibility and adaptability to learn and understand new technologies.
- Ability to research and debug software-related issues.
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