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JJohnSHealey posted the thread Understanding SEMI S3 9.12 for Process Liquid Heating in SemiWiki Main Forum ( Ask the Experts! ).SEMI S3 9.12 requires either a GFCI or a "grounded conductive barrier between the heating element and the HTF". Is a grounded metal...
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Daniel Nenni posted the thread Breker Verification Systems Launches Unique RISC-V TrekApp for Automated, High-Coverage System Integration Test Suite Synthesis in Breker Systems.Developed with SiFive to Address RISC-V System Integration Validation; Generates High-Impact SoC Verification Test Suite with Minimal... -
Daniel Nenni posted the thread SiFive Announces New Technologies for Mission-Critical and AI Markets in SiFive.New SiFive Apex cores for mission-critical markets and SiFive Intelligence cores for vector processing workloads create a comprehensive...
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Daniel Nenni posted the thread Lattice and SiFive Announce Collaboration to Allow Lattice FPGA Developers Easy Access to RISC-V Processors in SiFive.Scalable Processor Core IP Running on Low Power, Small Form Factor FPGAs Could Power Millions of Smart Devices at the Edge SAN MATEO...
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Daniel Nenni posted the thread CEA-LETI AND PARTNERS DEMONSTRATE POTENTIALLY SCALABLE READOUT SYSTEM FOR LARGE ARRAYS OF QUANTUM DOTS in General Press.Results Hold promise for Fast, Accurate Single-Shot Readout ‘Of Foundry-Compatible Si MOS Spin Qubits’ SAN FRANCISCO – Dec. 11, 2019 –...
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Daniel Nenni posted the thread Enflame Technology Announces CloudBlazer with DTU Chip on GLOBALFOUNDRIES 12LP FinFET Platform for Data Center Training in GlobalFoundries.Shanghai, China, December 12, 2019 – In conjunction with the launch of Enflame’s CloudBlazer T10, Enflame Technology and...
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Daniel Nenni posted the thread Kandou Demonstrates Prototype of First USB4 Multiprotocol Retimer at CES in General Press.Matterhorn’s Benefits Include Faster Video Processing, Data Transfer Connections to Drive Next-Generation USB-Enabled Devices...
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Daniel Nenni posted the thread Intel hires former GlobalFoundries, IBM chip executive Dr. Gary Patton! in SemiWiki Main Forum ( Ask the Experts! ).Another interesting move by Intel! Gary's LinkedIn profile says : In Transition Company Name none Dates Employed Dec 2019 – Present...
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Daniel Nenni posted the thread MediaTek selects Nucleus RTOS for next-generation modem technology in Mentor, a Siemens Business.· MediaTek selected the ReadyStart edition of the Nucleus real-time operating system (RTOS) platform for its next-generation...
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Daniel Nenni posted the thread Mythic Signs Multi-Year Agreement with Methodics for Enterprise-Wide IP Lifecycle Management Solution in Methodics.Methodics Percipient Platform Chosen for Open Architecture, Scalability, and Reliability San Francisco, CA, December 11, 2019 –...
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Daniel Nenni posted the thread Dialog Semiconductor and Flex Logix Establish Strategic Partnership for Mixed Signal Embedded Field-Programmable Gate Arrays (eFPGA) in Flex Logix.Increasing configurability of Dialog’s Advanced Mixed Signal product offerings in target markets London, United Kingdom and Mountain...
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Daniel Nenni posted the thread TowerJazz and the Technion Developed a Breakthrough Analog Platform for Artificial Intelligence in Edge Devices in General Press.The technology allows ultra-low power data processing in sensors and IoT edge devices Research paper was published in the December...
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Daniel Nenni posted the thread Everspin Achieves Data Center OEM qualification of its 1Gb STT-MRAM Solution in General Press.With this customer design win qualification, Everspin also announces production shipments of the 1Gb STT-MRAM Chandler, Ariz., Dec...
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Daniel Nenni posted the thread CEA-LETI BUILDS FULLY INTEGRATED BIO-INSPIRED NEURAL NETWORK WITH RRAM-BASED SYNAPSES & ANALOGUE SPIKING NEURONS in General Press.Functionality of Circuit Presented at IEDM 2019 Was Demonstrated With Handwritten Digits Classification on a Tablet Screen SAN...
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AArthur Hanson reacted to clhende's post in the thread ? on Packaging, Layers Replacing Node Shrink with
Like.
I think that packaging can be used to help reduce the size of the electronic system somewhat further. The combination of...
