Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated …
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Build Trust in your Software Software is at the core of digital transformation, enabling you to create value for your customers in new, innovative ways. However, software introduces business risks …
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See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations …
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Join us on March 7th to hear about the latest updates and newest features in Ansys Icepak and Ansys Mechanical Thermal. Some new capabilities include breakthroughs that will be of considerable use to engineers involved in hardware design for Telecommunications, Consumer Electronics, A&D, and Automotive products. TIME: MARCH 7, 2024 11 AM EST / 5 PM CET …
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