IEEE International Symposium on Hardware Oriented Security and Trust (HOST) is the premier symposium that facilitates the rapid growth of hardware-based security research and development. Since 2008, HOST has served …
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The IEEE Symposium on Field-Programmable Custom Computing Machines is the original and premier forum for presenting and discussing new research related to computing that exploits the unique features and capabilities …
May 21 - May 25, 2023 Monterey, California, USA About IEEE ISCAS 2023 The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits …
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OPEN TO EVERYONE Note, The Michigan EMC Fest is May 25, 2023 <here> This will be a great MiniSymposium, guaranteed to sell out If you are working in the EMC field, …
The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This time we would like to invite you to Kraków. …
About DAC The Design Automation Conference (DAC) is recognized as the premier event for the design and design automation of electronic chips to systems. DAC offers outstanding training, education, exhibits …
Welcome Message from the General Co-Chairs Jamesina J. Simpson University of Utah Reyhan Baktur Utah State University You are cordially invited to the 2023 IEEE International Symposium on Antennas and …
About IEEE AUTOTESCON 2023 Increasing System Availability Through Advanced Test and Support Technology AUTOTESTCON is the world’s premier conference that brings together the military/aerospace automatic test industry and government/military acquirers …
SoCs and SiPs for Edge Intelligence and Accelerated Computing System-on-Chip (SoC) and System-in-Package (SiP) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS) are foundations of ubiquitous embedded high-performance computing (HPC). Such …
Home The ARTS workshop focuses exclusively on test, reliability, and safety of automotive and mission-critical electronics, including design, manufacturing, burn-in, system-level integration and in-field test, diagnosis and repair solutions, as well as …
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INTRODUCTION With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems, incorporating more and more sophisticated manufacturing processes and system integration technologies in …
The Design and Analysis Frontier for Electronic Packaging 32nd Conference on Electrical Performance of Electronic Packaging and Systems EPEPS is the premier international conference on advanced and emerging issues in electrical …
