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HYBRID FORMAT SEPTEMBER 29-30, 2022 AIM OF THE WORKSHOP With increasing system complexity, security, stringent runtime requirements for functional safety, and cost constraints of a mass market, the reliable and …
SEMI Headquarters
673 South Milpitas Blvd., Milpitas, CA, United States
EDPS 2022 is now scheduled for October 6th, and 7th, at the SEMI building in Milpitas. Registration is now open. Please see the Registration page. Please note that most of the …
The five-day conference will be held in Detroit, Michigan | October 9 – October 13, 2022. ECCE is the pivotal international conference and exposition event on electrical and electromechanical energy conversion field. …
Hybrid: In-Person and Virtual Conference
San Diego, CA, United States
30 October - 3 November 2022 // San Diego, California, US Hybrid: In-Person and Virtual Conference The Premier Conference Devoted to Technical Innovations in Electronic Design Automation Jointly sponsored by …
Moscone Center
747 Howard Street, San Francisco, CA, United States
IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM …
Daniel Hotel Herzliya
Ramat Yam Street 60, Herzliya, Israel
IEEE EMC & SI PI CONFERENCE, ISRAEL 2022 We are excited to invite you to the 2022 IEEE Israel Electromagnetic Compatibility, Signal & Power Integrity Conference, the biggest EMC SI/PI …
Holiday Inn Munich City Centre
Hochstrasse 3, Munich, Germany
Workshop on the Evolution of SystemC Standards, held on 8 December 2022 The seventh SystemC Evolution Day is a full-day, technical workshop on the evolution of SystemC standards to advance …
Presenter: Boris Murmann Description Abstract: Inspired by the possibilities of open-source chip design, the IEEE Solid-State Circuits Society (SSCS) launched its new Platform for IC Design Outreach (PICO) in the …
Next-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so they behave as a single device. The new Tessent Multi-die software delivers comprehensive automation …
The Glasshouse
2 South Market St., San Jose, CA, United States
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was …
Crowne Plaza, Melbourne-Ocean front
2605 N Hwy A1A, Melbourne, FL, United States
About Wamicon The 23rd annual IEEE Wireless and Microwave Technology Conference, WAMICON 2023, will be held in Melbourne, Florida, on April 17-18, 2023. The conference will address up-to-date multidisciplinary research …
About CICC The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The …