March 24, 2020 12:00 PM - 1:00 PM (EDT) Venue: Online Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical simulations …
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Learn about the latest updates and newest functionality in Ansys Icepak and Mechanical in AEDT. The 2022 R2 update will describe the new features & capabilities of the Icepak and Mechanical Thermal simulators in detail. Time: September 6, 2022 11 AM EDT / 4 PM BST / 8:30 PM IST Venue: Virtual About this Event …
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AEDT Icepak 2022 R2 features enhanced meshing workflows for slider bar meshing to accommodate more complex geometries. Register for this webinar and see the new features for enhanced productivity and advanced modeling. TIME: SEPTEMBER 12, 2022 2 AM EDT / 7 AM BST / 11:30 AM IST About This Webinar For many years, Icepak has …
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Customer Spotlight Webinar with Webasto We'll present a comprehensive workflow for thermal simulation of PCBs. And show how this solution can be automated using Python to speed up overall simulation time and considerably decrease labor costs. TIME: SEPTEMBER 21, 2022 9 AM EDT / 2 PM BST / 6:30 PM IST / 3:00 PM CET About …
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The ever-increasing need for faster, smaller, and multi-tasking electronic devices poses a significant thermal management challenge for the processor and the system. Manufacturers need to strike a good balance between hardware-based and software-based thermal management strategies to avoid overdesign and minimize the impact on user experience. Further, using simulations to evaluate thermal control strategies can …
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Learn about the latest updates to the Electronics Reliability product portfolio, including more advanced integrations between Mechanical, LS-DYNA, Sherlock & Icepak. TIME: MARCH 1, 2023 11 AM EST About This Webinar Ansys 2023 R1 introduces significant advances across the Ansys suite of tools supporting Electronics Reliability applications. In addition to critical enhancements within Ansys Sherlock, …
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The 2023 R1 update to Ansys Icepak contains multiple improvements, such as faster simulations, more robust PCB meshing, and an enhanced Compact Thermal Model for supporting Redhawk-SC Electrothermal. TIME: MARCH 22, 2023 11 AM EDT / 3 PM GMT / 8:30 PM IST Venue: Virtual About this Webinar The 2023 R1 release for Ansys Icepak …
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See the improvements to Ansys Icepak and Ansys Mechanical Thermal as part of the 2023 R2 update to Thermal Integrity for Electronics. Solver and meshing improvements are combined with integrations to other Ansys simulators to enhance designer modeling and simulation of electronics products from a multiphysics standpoint. TIME: SEPTEMBER 14, 2023 11 AM EST Venue: …
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Every electromagnetic simulation needs material properties as an input. The accuracy of the material data has a direct impact on the accuracy of your simulation. Ansys Granta offers Material Data for Simulation (MDS) for Ansys Electronics Desktop tools like Ansys Maxwell, Ansys HFSS, and Ansys Icepak with a wide range of low and high-frequency electromagnetic material …
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Every electromagnetic simulation needs material properties as an input. The accuracy of the material data has a direct impact on the accuracy of your simulation. Ansys Granta offers Material Data for Simulation (MDS) for Ansys Electronics Desktop tools like Ansys Maxwell, Ansys HFSS, and Ansys Icepak with a wide range of low and high-frequency electromagnetic material …
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