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Ansys 2023 R1: Ansys Icepak with AEDT What’s New
March 22, 2023 @ 8:00 AM - 9:00 AM
The 2023 R1 update to Ansys Icepak contains multiple improvements, such as faster simulations, more robust PCB meshing, and an enhanced Compact Thermal Model for supporting Redhawk-SC Electrothermal.
TIME:
MARCH 22, 2023
11 AM EDT / 3 PM GMT / 8:30 PM IST
Venue:
Virtual
About this Webinar
The 2023 R1 release for Ansys Icepak offers a large set of enhancements – meshing improvements, faster simulations, and an upgrade to the Compact Thermal Model for use with Redhawk-SC Electrothermal and encrypted TSMC technology.
What You Will Learn
- New Meshing Enhancements include stair step meshing (2D multilevel), capturing individual layers and details, resulting in a more robust PCB meshing that functions on stacked and layered structures
- Enhanced post-processing for thermal fields resulting in a 2-3X speedup in performance over the 22R2 version
- Compact Thermal Model (CTM) Version 2 supports code simulation bidirectionally with Redhawk-SC ET when utilizing encrypted TSMC technology
- Capture environmental effects (fans/airflow and convection/radiation) and then return this thermal data to RHSC-ET
Who Should Attend
Icepak users
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