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Date and Time Wednesday, May 27, 2020 Time: 10:00am - 11:00am (PDT) Providing the best alternative to advanced monolithic SoCs, multi-chiplet packages have become a very attractive option for the next generation of cost-sensitive designs. However, as many engineers begin to realize the benefits of a multi-chiplet packaging approach, including 3D stacking, they are struggling …
Tokyo Big Sight
3 Chome-11-1 Ariake, Koto City, Tokyo, Japan
December 14-16, 2022 Venue: Tokyo Big Sight SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging …
The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts, …
Tuesday, February 21, 2023 8:00 am PT / 11:00 am ET UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The newly formed UCIe Consortium fosters an open chiplet …
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in a system simulation. …
Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups, DoD projects, and academic research. Chiplet-based architectures bring their own set of challenges however, especially in the context of IP …
Date: Wednesday, August 30, 2023 Time: 11:00am PDT | 1:00pm CDT | 2:00pm EDT Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The industry’s fastest emerging interconnect standard called Universal Chiplet Interconnect Express (UCIe) enables end users to combine chiplets …
About Innovative die disaggregation technologies, enable a future where a catalog of chiplets will be available to mix and match based on the end application. The industry’s fastest emerging interconnect standard called Universal Chiplet Interconnect Express (UCIe) enables end users to combine chiplets with different functionality and technology nodes to develop highly sophisticated electronic chips. …
Cadence Headquarters, San Jose, CA
2655 Seely Ave, San Jose, CA, United States
Event Overview Date: Monday, November 13, 2023 Time: 10:00am – 4:00pm, followed by an exclusive networking event Location: Cadence Headquarters, San Jose, CA There is an unprecedented demand for advanced-node chip design that pushes beyond traditional boundaries. Computing power, security, reliability, and other multifaceted requirements have surpassed the basic performance, power consumption, and area constraints of traditional chip design. …
