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March 9, 2022 Overview System planning is a major part of the multi-chiplet design. Whether it’s a 2.5-D configuration with an interposer or full-stacked 3D design mounted on a package, it is important to have an automated way to do bump assignment and optimization along with 3D structures implementation. With methodology evolving for different types …
Overview A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a major power integrity (PI) and thermal integrity challenge. Early analysis also is extremely critical in 3D-ICs since changing the die stack up later in the …
Overview Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise. Addressing these concerns through simulation during system planning and continuing through signoff will accelerate the 3D-IC design cycle by avoiding expensive design re-spins. Therefore, it …
Overview Electronics products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise. Addressing these concerns through simulation during system planning and continuing through signoff will accelerate the 3D-IC design cycle by avoiding expensive design re-spins. Therefore, it …
This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design. TIME: NOVEMBER 3, 2022 11 AM EDT / 3 PM GMT / 8:30 PM IST REGISTER HERE About this Webinar This webinar introduces the Multiphysics requirements to meet performance, integrity, and reliability expectations for 3DICs. Beyond ‘golden solver’ requirements for …
