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Overview Physical design constraints become a lot more complicated in the advanced nodes, leading to the exponential growth of design rules while adding complexity. Decreasing the active device sizes and …
Overview Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems. Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem …
Main Themes COMPUTEX has grown, transformed with the industry, and established its reputation as the world’s leading platform. The expo will continue with the position of “BUILDING GLOBAL TECHNOLOGY ECOSYSTEMS”, …
As the semiconductor industry emerges from the global health crisis and leads the way to economic recovery; TSMC, our customers and partners will gather together at the 2021 TSMC Technology Symposiums. Tuesday, June 1 - TSMC North America Technology Symposium Wednesday, June 2 - TSMC China, Europe, and Taiwan Technology Symposiums Our semiconductor industry is …
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The technical program contains papers covering leading edge developments …
June 03, 2021 07:00 AM America/Los_Angeles Technology advancements in the Automotive market are nothing new. For years the auto industry has made technical advancements to push the industry forward. The advancements now have reached the point where adding more ECUs will not solve the problems, and a new way to look at hardware and software …
This webinar will highlight the new GUI based adaptation workflow, easy-to-use setup, and new pre-defined adaption criteria for external aerodynamic applications. Time: June 3, 2021 10 AM EDT / 3 PM BST / 7:30 PM IST Venue: Online About this Webinar In pre-processing workflows for CFD, high-quality mesh generation of complex geometries over a range …
STMicroelectronics is designing complex SoCs in advanced technology nodes, containing tens of thousands of embedded memories. Many divisions at STMicroelectronics chose to use the Synopsys Star Memory System (SMS) IP for test, repair and bitmap of their most advanced products. This presentation describes the flow setup by STMicroelectronics R&D and Networking divisions to test and …
Mon, Jun 7, 2021 10:15 AM - 11:15 AM MDT The ASME TURBO EXPO, ASME's premier turbomachinery technical conference and exposition, goes online and is set for June 7-11, 2021. The 5-day conference attracts the industry's leading professionals and key decision makers, whose innovation and expertise are helping to shape the future of the turbomachinery …
Overview In MEMS and semiconductor design, 20% of the upstream design decisions affect 80% of the downstream foundry processing, packaging, assembly, and system-level performance and yield. Device designers are seldom able to consider the implications of their design decisions on system-level robustness because the tools and workflows to analyze design impacts on device and system …
This mini webinar will highlight several key best practices in the areas of geometry, meshing, solution and post-processing, which can improve the end-to-end efficiency of a project and help ensure accurate and reliable predictions. Time: June 8, 2021 10 AM EDT / 3 PM BST / 7:30 PM IST Venue: Online About this Webinar Many …
June 8, 2021; 10:00 GMT / 11:00 CET / 12:00 EET and Israel / 14:30 India Speaker: Guillaume Foix Accurate libraries are key to getting quality results out of any design tool. With an automated way to accurately generate IPC standard-compliant ECAD libraries from MCAD, you can adapt to any changes in the board technology or …