This 15-minute webinar will be a live demo showing how to couple Ansys Rocky and Ansys Mechanical for FEA-DEM simulations. Time: May 27, 2021 10:30 AM EDT / 3:30 PM BST / 8 PM IST Venue: Online About this Webinar Using Discrete Element Method (DEM) and Finite Element Analysis (FEA) provides great value. Ansys Rocky …
Thu, May 27, 2021 6:00 AM - 7:00 AM MDT The simulation market is expanding beyond Fluids and Structures towards modeling of particulate systems. Particle mechanics can now solve issues related to particle motion and the interaction between particles & fluids and/or structures. DEM (Discrete Element Modeling) is a branch of CAE that is gaining …
In this lightning talk, discover how engineers from the Aerospace and Defense industries can reduce hands-on pre-processing time for external aerodynamics applications using Ansys Fluent Meshing. Time: June 1, 2021 10 AM EDT / 3 PM BST / 7:30 PM IST Venue: Online About this Webinar In this lightning talk, discover how engineers from the …
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1 June 2021 12:00 pm U.S. Eastern Time The semiconductor industry remains on track to deliver another strong year of growth despite the panic of ongoing shortages in specific sectors of the market. The super cycle that began at the end of 2019 will continue to strengthen this year and should continue to …
Overview Physical design constraints become a lot more complicated in the advanced nodes, leading to the exponential growth of design rules while adding complexity. Decreasing the active device sizes and higher geometry densities results in increased design rule check (DRC) run time, a big metal fill impact on chip functionality, and greater antenna sensitivity of …
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Overview Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems. Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff. Takeaways: Seamless integration with Cadence’s OrbitIO™ Interconnect Designer and Voltus™ …
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Cowen 49th Annual Technology, Media & Telecom Conference June 1-June 3, 2021
Main Themes COMPUTEX has grown, transformed with the industry, and established its reputation as the world’s leading platform. The expo will continue with the position of “BUILDING GLOBAL TECHNOLOGY ECOSYSTEMS”, featuring the latest tech trends: AI, IoT, 5G, Edge Computing, HPC, Cyber Security, Gaming, Innovations & Startups. Established in 1981, COMPUTEX TAIPEI (also called COMPUTEX) …
As the semiconductor industry emerges from the global health crisis and leads the way to economic recovery; TSMC, our customers and partners will gather together at the 2021 TSMC Technology Symposiums. Tuesday, June 1 - TSMC North America Technology Symposium Wednesday, June 2 - TSMC China, Europe, and Taiwan Technology Symposiums Our semiconductor industry is …
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The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The technical program contains papers covering leading edge developments …
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June 03, 2021 07:00 AM America/Los_Angeles Technology advancements in the Automotive market are nothing new. For years the auto industry has made technical advancements to push the industry forward. The advancements now have reached the point where adding more ECUs will not solve the problems, and a new way to look at hardware and software …
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This webinar will highlight the new GUI based adaptation workflow, easy-to-use setup, and new pre-defined adaption criteria for external aerodynamic applications. Time: June 3, 2021 10 AM EDT / 3 PM BST / 7:30 PM IST Venue: Online About this Webinar In pre-processing workflows for CFD, high-quality mesh generation of complex geometries over a range …
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STMicroelectronics is designing complex SoCs in advanced technology nodes, containing tens of thousands of embedded memories. Many divisions at STMicroelectronics chose to use the Synopsys Star Memory System (SMS) IP for test, repair and bitmap of their most advanced products. This presentation describes the flow setup by STMicroelectronics R&D and Networking divisions to test and …
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