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Samsung Electronics Opens Path to Chase TSMC with 3nm Foundry Collaboration with AMD
latest reply by Mooredaddy onstarted by Daniel Nenni on -
TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes
started by Daniel Nenni on -
China Chipmakers Catching Up Fast in AI, SenseTime’s Xu Says
latest reply by KevinK onstarted by Daniel Nenni on -
Computing at the Edge, Lower Data Center loads
started by Arthur Hanson on -
Where is all the power going to come from for AI/ML
latest reply by blueone onstarted by Arthur Hanson on -
Declining density scaling trend for TSMC nodes
latest reply by IanD onstarted by Fred Chen on -
Nvidia's suspected 2025 processor is now rumored to be built by Intel using off-the-peg Arm cores. Yes, an Nvidia chip built by Intel
latest reply by nghanayem onstarted by Daniel Nenni on -
ASML sets new EUV chipmaking density record, proposes Hyper-NA tools and radical EUV speed boosts
latest reply by IanD onstarted by Daniel Nenni on -
All that’s left: A self-defeating semiconductor export tactic for China
latest reply by tooLongInEDA onstarted by Daniel Nenni on -
Samsung teases 16-layer 3D DRAM with VCT DRAM as a 'stepping stone' for future RAM
latest reply by Barnsley onstarted by Daniel Nenni on
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