WP_Term Object
(
    [term_id] => 34
    [name] => Ansys, Inc.
    [slug] => ansys-inc
    [term_group] => 0
    [term_taxonomy_id] => 34
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 262
    [filter] => raw
    [cat_ID] => 34
    [category_count] => 262
    [category_description] => 
    [cat_name] => Ansys, Inc.
    [category_nicename] => ansys-inc
    [category_parent] => 157
)
3dic banner 800x100 
WP_Term Object
(
    [term_id] => 34
    [name] => Ansys, Inc.
    [slug] => ansys-inc
    [term_group] => 0
    [term_taxonomy_id] => 34
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 262
    [filter] => raw
    [cat_ID] => 34
    [category_count] => 262
    [category_description] => 
    [cat_name] => Ansys, Inc.
    [category_nicename] => ansys-inc
    [category_parent] => 157
)
Ansys, Inc.
Posted on by Daniel Nenni

Take a Leap of Certainty at DAC 2022

Take a Leap of Certainty at DAC 2022
by Daniel Nenni on 05-22-2022 at 6:00 am
Categories: Ansys, Inc., EDA, Events

Ansys DAC 2022 1

The live events I have attended thus far this year have been very good. As much as I liked the virtual events, attending in the comfort of my home or sailboat, it is great to be live and networking inside the semiconductor ecosystem, absolutely.

Ansys has been a great supporter of the Design Automation Conference but this year they are going big. Ansys is also a strong supporter of SemiWiki and a joy to work with.

We have written extensively about 3D-IC, 2.5D/3D packaging, power integrity, and other multiphysics challenges so this will be a great time to sync up on where we are today and what Moore’s Law has in store for us tomorrow. Bespoke Silicon is also a trending topic as the systems companies make their own chips so you don’t want to miss that.

Ansys is also great at customer engagements so stop by their theater to see who is using what tools and why. Here is the Ansys preview, I hope to see you  at DAC 2022!

Request a meeting or demo

WE’RE SHOWING THE LATEST IN DESIGN TECHNOLOGY

The semiconductor and electronics industries collide as 3D-IC technology, enabling companies to design differentiating bespoke silicon. The advent of 3D-IC requires more physics domains in a multiphysics challenge requiring new tools and approaches to building electronic design teams. At DAC 2022, we’ll share the latest technologies for 5nm power integrity signoff, dynamic voltage drop coverage, electrothermal signoff for chips & PCBs, advanced 2.5D/3D packaging, and photonic design.

See the Latest Multiphysics Signoff Technology

Did you know? Ansys delivers the industry’s broadest range of foundry-certified golden signoff tools for semiconductor design, electronic design, and full system design.

Stop by our booth to see the latest advances in Power Integrity, Thermal Analysis, Electromagnetics, and Photonics for semiconductor and board designers. Our technical experts are available to answer your questions. Or you can schedule a meeting in our booth. 

Grab a seat in our booth theater featuring short presentations by our customers, partners, and technologists on a variety of topics at regular intervals during the exhibit hours. While there, you just might pick up a unique NFT.

Learn From the Experts at DAC

We’re participating in the DAC Pavilion Roundtable Discussion on “Bespoke Silicon“ where industry experts look at the technical and business implications of companies increasingly turning to tailored silicon solutions to differentiate their key products.

Listen to Ansys customers present their actual semiconductor projects during DAC’s Engineering Tracks and Poster Sessions, listed below.

WHAT ARE THE BIG OPPORTUNITIES IN THE NEXT RENAISSANCE OF EDA?

Research Panel: Tuesday, July 12th, 3:30pm-5:30pm PDT
Prith Banerjee, CTO, Ansys

NEW DIRECTIONS IN SILICON SOLUTIONS

Engineering Track: Tuesday, July 12th, 3:30pm-5:00pm PDT
Norman Chang, Fellow & Chief Technologist, Ansys

BESPOKE SILICON-TAILOR MADE FOR MAXIMUM PERFORMANCE

DAC Pavilion Panel: Wednesday, July 13th, 2:00pm-2:45pm PDT
John Lee, VP & GM, Electronics & Semiconductors, Ansys

About Ansys

If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

Also Read:

Bespoke Silicon is Coming, Absolutely!

Webinar Series: Learn the Foundation of Computational Electromagnetics

5G and Aircraft Safety: Simulation is Key to Ensuring Passenger Safety – Part 4

Share this post via:

Comments

There are no comments yet.

You must register or log in to view/post comments.