PIC Summit Europe 2026

Photonic Integrated Circuits (PICs) are entering commercial deployment, high-volume manufacturing, and critical applications in markets such as data and telecom.

PIC Summit Europe 2026 reflects this shift. Discussions move beyond technology potential to address what is required to deliver PICs at scale, from advanced packaging and testing to yield, qualification, and supply chain readiness.

Industrialisation, scaling, and real-world adoption of PICs are at the core of the programme.

• Industrialisation: Focus on the practical challenges of scaling PIC production, including packaging, testing, yield, and supply chain readiness.
• End-users and customers: Requirements, constraints, and adoption realities shape the programme, bringing real-world perspectives into every discussion.
• From development to deployment: Sessions move from technology to implementation and market use, addressing how PICs transition into scalable, real-world applications.