I sat down for a chat with Gary Patton, the CTO of GlobalFoundries, at today’s SEMI Strategic Materials Conference where he had just given one of the keynotes (which I’ll cover another time). His family name isn’t really Patton, his grandfather’s name was Funkhauser, but his step-grandfather’s… Read More
New Sensing Scheme for OTP Memories
Last week at TSMC’s OIP symposium, Jen-Tai Hsu, Kilopass’s VP R&D, presented A New Solution to Sensing Scheme Issues Revealed.
See also Jen-Tai Hsu Joins Kilopass and Looks to the Future of Memories
He started with giving some statistics about Kilopass:
- 50+ employees
- 10X growth 2008 to 1015
- over 80 patents (including
Dialog and Atmel, 2 cultures to build 1 successful company ?
Consolidation is on-going in semi industry, as we learn that Dialog Semi just announced the acquisition of Atmel. Is it a good news for Atmel, or for Dialog ? Apparently not for the stock market, as Dialog stock went down by 20% within the last few hours… But we can try to look more in-depth at the potential synergy between these two companies’s… Read More
The Paradox of Atmel No More
Technology pundits said Atmel is one of the best-positioned companies in the Internet of Things (IoT) realm, if not the best IoT company outright. The San Jose, California–based chipmaker boasts an enormous portfolio of microcontrollers and a deep expertise in security and automotive electronics hardware. Yet its underperforming… Read More
Four Takeaways from the TSMC OIP 2015
Paul M. did an excellent job summarizing the technical information that TSMC presented at the recent Open Innovation Platform symposium. I’d like to also share an impression on four areas that struck me as key to TSMC’s strategy.… Read More
TSMC OIP: What to Do With 20,000 Wafers Per Day
Today it is TSMC’s OIP Ecosystem Innovation forum. This is an annual event but is also a semi-annual update on TSMC’s processes, investment, volume ramps and more. TSMC have changed the rules for the conference this year: they have published all the presentations by their partners/customers. Tom Quan of TSMC told… Read More
3D Xpoint and the Future of Memory
Recently Intel and Micron announced a new three dimensional cross point (3D Xpoint) memory. The 3D Xpoint announcement has generated a lot of questions and interest in what this new memory is and where it may fit in the semiconductor market. … Read More
Mongoose: The Making of Samsung’s Custom CPU Core
Samsung is seemingly ready to move to a new milestone in its brief but exciting system-on-chip (SoC) history: a custom CPU core codenamed Mongoose. It’s going to be based on ARMv8 instruction set and is expected to outperform the Exynos 7420 application processor that Samsung unveiled this year. There are some media reports… Read More
FDSOI As a Multi-Node Platform
One of the main criticisms of the FDSOI technology has been that it is a one-node solution at best and is not scalable to the future. Such arguments are typically based on the “gate-length-scaling” assumptions which do not capture the past and current trends of the CMOS technology as I discussed in my earlier post. Back in the early… Read More
Intel – "Inside" good markets, outside bad- Huge potential in Memory & Photonics
Intel’s lack of exposure to handsets/China is now a positive rather than a negative
Intel’s strength in “cloud” & servers avoids much consumer weakness in China & developing Markets
Crosspoint has huge upside- Coupled with Photonics it fortifies Intel server dominance
The shoe is on the other… Read More
AI RTL Generation versus AI RTL Verification