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Apple iPhone Super Cycle Update!

Apple iPhone Super Cycle Update!
by Daniel Nenni on 09-01-2017 at 7:00 am

In 2014 Apple released the iPhone 6 which included the first SoC built on a TSMC (20nm) process. This phone started what many call a “Super Cycle” of people upgrading. According to Apple, they now have more than 1 billion activated devices so this super cycle could be seriously super, absolutely.… Read More


High Bandwidth Memory ASIC SiPs for Advanced Products!

High Bandwidth Memory ASIC SiPs for Advanced Products!
by Daniel Nenni on 08-30-2017 at 7:00 am

When someone says, “2.5D packaging” my first thought is TSMC and my second thought is Herb Reiter. Herb has more than 40 years of semiconductor experience and he has been a tireless promoter of 2.5D packaging for many years. Herb writes for and works with industry organizations on 2.5D work groups and events at conferences… Read More


Samsung, Synopsys and Qualcomm at DAC

Samsung, Synopsys and Qualcomm at DAC
by Daniel Payne on 08-24-2017 at 12:00 pm

I’m a user of many Samsung products as my family has Samsung Galaxy smart phones and my MacBook Pro uses Samsung SSD for storage, so at DAC I attended a breakfast panel with presenters from Samsung, Synopsys and Qualcomm. This was the second day of DAC and they served us breakfast, and with the big names on the panel the room was… Read More


TSMC OIP Ecosystem Forum 2017 Preview!

TSMC OIP Ecosystem Forum 2017 Preview!
by Daniel Nenni on 08-23-2017 at 12:00 pm

The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth… Read More


SEMICON West – EUV Readiness Update

SEMICON West – EUV Readiness Update
by Scotten Jones on 08-11-2017 at 12:00 pm

At the imec technology forum held at SEMICON West, Martin Van Den Brink, President and CTO of ASML presented on the latest developments on EUV. I also had an opportunity to sit down with Mike Lercel, ASML Director of Strategic Marketing for an interview.… Read More


Samsung Sloppy Sailor Spending Spree!

Samsung Sloppy Sailor Spending Spree!
by Robert Maire on 07-31-2017 at 12:00 pm

Last week, TEL (which is the Japanese equivalent to AMAT & LRCX) reported a June quarter which saw revenues drop to 236B Yen from March’s 261B Yen and saw earnings drop from March’s 47B Yen to June’s 41B Yen, a respective 9.3% decrease and a 12.8% decrease in earnings.

We don’t think this is attributable… Read More


SEMICON West – Advanced Interconnect Challenges

SEMICON West – Advanced Interconnect Challenges
by Scotten Jones on 07-28-2017 at 12:00 pm

At SEMICON West I attended the imec technology forum where Zsolt Tokei presented “How to Solve the BEOL RC Dilemma” and the SEMICON Economics of Density Scaling session where Larry Clevenger of IBM presented “Interconnect Scaling Strategic for Advanced Semiconductor Nodes”. I also had the opportunity… Read More


Semicon West – The FDSOI Ecosystem

Semicon West – The FDSOI Ecosystem
by Scotten Jones on 07-21-2017 at 12:00 pm

At Semicon West last week I attended presentations by Soitec and CEA Leti, and had breakfast with CEA Leti CEO Marie Semeria, key members of the Fully Depleted Silicon On Insulator (FDSOI) ecosystem. I have also seen some comments in the SemiWiki forum lately that make me believe there is some confusion on the roles of different companies… Read More


Applying ISO 26262 in a Fabless Ecosystem – DAC Panel Discussion

Applying ISO 26262 in a Fabless Ecosystem – DAC Panel Discussion
by Tom Simon on 07-18-2017 at 12:00 pm

The fabless movement was instrumental in disaggregating the semiconductor industry. Vertical product development at the chip and system level has given way to a horizontal structure over the years. This organization of product development has been doing an admirable job of delivering extremely reliable products. However… Read More


Standard Node Trend

Standard Node Trend
by Scotten Jones on 07-15-2017 at 4:00 pm

I have previously published analysis’ converting leading edge logic processes to “standard nodes” and comparing standard nodes by company and time. Recently updated details on the 7nm process node have become available and in this article, I will revisit the standard node calculations and trends.… Read More