I recently took a look at the current status and future direction of FinFET based logic processes in my Leading Edge Logic Landscape blog. I thought it would be interesting to take a similar look at FDSOI and to compare and contrast the two processes. My Leading Edge Logic Landscape blog is available here.… Read More
TSMC 16nm, 10nm, 7nm, and 5nm Update!
Word on the street is that TSMC is on schedule with 16FFC, 10nm and 7nm, which is a very big deal for the fabless semiconductor ecosystem. As Scotten Jones has illustrated in the graphic below, for the first time in the history of the semiconductor industry a pure-play foundry (TSMC) will have the process lead over Intel. And this is… Read More
The 2016 Leading Edge Semiconductor Landscape
The leading edge semiconductor logic landscape has in recent years collapsed to just four companies. The following is a summary of what is currently known about each company’s plans and how they compare. ASML has analyzed many logic nodes and developed a formula that normalizes processes to a “standard node”.… Read More
Qualcomm is Back on Top of the SoC World!
In 2015 Qualcomm stunned the fabless semiconductor world with an unprecedented layoff. When I first heard about it the number was 5% but it kept growing and finally hit 15%. The big misstep here was, that after being the SoC leader starting in 2007 with the Snapdragon series of chips that powered the Smartphone revolution, QCOM did… Read More
Memory War Z: Samsung spins antidote to 3D XPoint
The 2016 edition of the Flash Memory Summit produced more than the usual amount of excitement. Samsung’s response to the Intel/Micron 3D XPoint challenge arrived in new slideware, indicating the war for next-generation SSDs is just starting. Who has the advantage?
We’d all like to think this is about creating a breakthrough technology,… Read More
Foundry Technology Packaging Solutions
A significant shift is underway in the fabless semiconductor business model. As the application markets have become more diverse (and more cost-sensitive), product requirements have necessitated a new focus on multi-die packaging technology. … Read More
10nm Will Be an Epic Process Node!
In the history of the fabless semiconductor industry the foundries have always been a process node or two behind the leading semiconductor manufacturers. Starting in Q1 2017, for the first time in fabless semiconductor history, the foundries will have a process node advantage. This is horrible news for some but great news for … Read More
Samsung Embraces Both Public And Private Cloud With Joyent Acquisition
As the mobile industry growth slows and looks to growth in IoT, companies like Samsung Electronics are looking for ways to initiate change or adapt to the new climate around them. One of the ways mobile companies are going to be profitable in the future is through offering, building and sometimes hosting those services beyond just… Read More
STT-MRAM – Coming soon to an SoC near you
An increasing percentage of SoC die area is being allocated to memory arrays, as applications require more data/instruction storage and boot firmware. Indeed, foundries invest considerable R&D resources into optimizing their array technology IP offerings, often with more aggressive device features than used for other… Read More
Highlights of the 28nm FD-SOI San Jose Presentations
Most of the presentations from the FD-SOI Symposium in San Jose last month (April 2016) are now available on the SOI Consortium website (click here to see the full list — if they’re posted, you can download them freely from there). If you don’t have time to wade through them all, here are some of the highlights. … Read More
Facing the Quantum Nature of EUV Lithography