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3D NAND – Moore’s Law in the third dimension

3D NAND – Moore’s Law in the third dimension
by Scotten Jones on 05-07-2016 at 4:00 am

For more than a decade 2D NAND has been the leading driver of lithography shrinks, for example, Samsung went from 120nm in 2003 to 16nm in 2014 with shrinks on an almost yearly basis, but the shrinks came at a price. At 16nm Self Aligned Quadruple Pattering (SAQP) was required for the most critical layers and patterning related costs… Read More


Samsung 10nm and 7nm Strategy Explained!

Samsung 10nm and 7nm Strategy Explained!
by Daniel Nenni on 04-23-2016 at 7:00 am

Samsung Foundry had an intimate gathering recently for 200 customers and partners that I missed, but I know several people who attended. This event was a precursor to #53DAC where Samsung has the largest foundry presence. I was able to clarify what I had heard via a phone call with Kelvin Low so here is my version of what is important:… Read More


ARM and FD-SOI are like Peanut Butter and Jelly!

ARM and FD-SOI are like Peanut Butter and Jelly!
by Daniel Nenni on 04-19-2016 at 4:00 pm

When I first heard about a foundry possibly licensing FD-SOI I would have bet it was SMIC in China. What better market for a low cost, low power, easy to manufacture alternative to FinFETs? The foundry of course was Samsung which also made complete sense since they have 28nm gate-first capacity that matches up nicely to 28nm FD-SOI.… Read More


EUV is coming but will we need it?

EUV is coming but will we need it?
by Scotten Jones on 04-12-2016 at 4:00 pm

I have written multiple articles about this year’s SPIE Advanced Lithography Conference describing all of the progress EUV has made in the last year. Source power is improving, photoresists are getting faster, prototype pellicles are in testing, multiple sites around the world are exposing wafers by the thousands and more. Read More


In the Valley & thinking about FD-SOI for your next chip design? Epic (and free) symposium 13 April

In the Valley & thinking about FD-SOI for your next chip design? Epic (and free) symposium 13 April
by Adele Hars on 04-02-2016 at 7:00 am

If you’re in the chip biz in Silicon Valley, check out the SOI Consortium FD-SOI Symposium on April 13th in San Jose. They’ve been running these things since 2009, and I have to say that this one is the most comprehensive to date. Headliners include Cisco, Sony, NXP, SigmaDesigns, ARM, Ciena plus the big FD-SOI foundries,… Read More


10nm SRAM Projections – Who will lead

10nm SRAM Projections – Who will lead
by Scotten Jones on 03-25-2016 at 12:00 pm

At ISSCC this year Samsung published a paper entitled “A 10nm FinFET 128Mb SRAM with Assist Adjustment System for Power, Performance, and Area Optimization. In the paper Samsung disclosed a high density 6T SRAM cell size of 0.040µm[SUP]2[/SUP]. I thought it would be interesting to take a look at how this cell size stacks … Read More


Positive pointers from Samsung, GF, Renesas, NXP/Freescale, ST, Soitec – so will 2016 be the year of FD-SOI?

Positive pointers from Samsung, GF, Renesas, NXP/Freescale, ST, Soitec – so will 2016 be the year of FD-SOI?
by Adele Hars on 02-10-2016 at 4:00 pm

A little over a month into 2016 and we already have a raft of FD-SOI news from Samsung, GlobalFoundries, NXP/Freescale, Renesas and more. Quite a bit of it came out of the recent SOI Consortium forum in Tokyo. Many of the presentations are now available on the SOI Consortium website (click here to see what’s there) – but keep checking… Read More


2016 Samsung Foundry Update!

2016 Samsung Foundry Update!
by Daniel Nenni on 01-30-2016 at 9:30 am

When sketching out the chapters for our book “Mobile UnLeashed” we sought out the events and technology that empowered the mobile devices that literally changed our world. One of the companies that enabled this change of course is Samsung. Cleverly embedded in chapter 8 “To Seoul, via Austin” is the story of how Samsung got into … Read More


IEDM Blogs – Part 5 – Intel and Micron 3D NAND

IEDM Blogs – Part 5 – Intel and Micron 3D NAND
by Scotten Jones on 12-29-2015 at 7:00 am

At IEDM Intel and Micron presented “A Floating Gate Based 3D NAND Technology With CMOS Under Array” authored by Krishna Parat and Chuck Dennison.

As I previously discussed in my blog on the IEDM memory short course and blog on IMEC’s work on high mobility 3D NAND channels, continuing to scale 2D Flash has become extremely difficult… Read More


Samsung Versus Intel at 14nm

Samsung Versus Intel at 14nm
by Scotten Jones on 12-01-2015 at 6:00 pm

Daniel Nenni recently blogged about Intel’s claims of industry leading process density that were made at their analysts meeting. It isn’t clear to me why Intel makes this such a big focus at the analysts meetings, they really don’t compete with the foundries much but this seems to be a big deal to them. I thought it would be interesting… Read More