I think we’re all familiar with the cloud/edge debate on where intelligence should sit. In the beginning the edge devices were going to be dumb nodes with just enough smarts to ship all their data to the cloud where the real magic would happen – recognizing objects, trends, need for repair, etc. Then we realized that wasn’t the best… Read More
Semiconductor Intellectual Property
Essential Analog IP for 7nm and 5nm at TSMC OIP
When TSMC’s annual Open Innovation Platform Exposition takes place, you know it will be time to hear about designs starting on the most advanced nodes. This year we were hearing about 7nm and 5nm. These newer nodes present even more challenges than previous nodes due to many factors. Regardless of what kind of design you are undertaking… Read More
ARM Turns up the Heat in Infrastructure
I don’t know if it was just me but I left TechCon 2017 feeling, well, uninspired. Not that they didn’t put on a good show with lots of announcements, but it felt workman-like. From anyone else it would have been a great show, but this is TechCon. I expect to leave with my mind blown in some manner and it wasn’t. I wondered if the SoftBank … Read More
Does the G in GDDR6 stand for Goldilocks?
In the wake of TSMC’s recent Open Innovation Platform event, I spoke to Frank Ferro, Senior Director of Product Management at Rambus. His presentation on advanced memory interfaces for high-performance systems helped to shed some light on the evolution of system memory for leading edge applications. System implementers now… Read More
Who is Responsible for SIP Revenue Decline in Q2 2018?
According with ESDA, EDA revenues have grown YoY by 16.2% in Q2 2018, and this is the good news for our industry. The bad news is the decline of SIP (Design IP) revenues, by (3.1%) at the same time. As far as I am concerned, this figure looks weird, so I will try to understand the reason why SIP category can go wrong in a healthy EDA market,… Read More
Avionics and Embedded FPGA IP
The design of electronic systems for aerospace applications shares many of the same constraints as apply to consumer products – e.g., cost (including NRE), power dissipation, size, time-to-market. Both market segments are driven to leverage the integration benefits of process scaling. … Read More
ARM TechCon 2018 is Upon Us!
ARM TechCon is one of the most influential conferences in the semiconductor ecosystem without a doubt. This year ARM TechCon has moved from the Santa Clara Convention Center to the much larger convention center in San Jose. Last year the conference seemed to be busting at the seams so this move makes complete sense. A little less … Read More
How to Increase Energy Efficiency for IoT SoC?
If you have read the white paper recently launched by Dolphin, “New Power Management IP Solution from Dolphin Integration can dramatically increase SoC Energy Efficiency”, you should already know about the theory. This is a good basis to go further and discover some real-life examples, like Bluetooth Low Energy (BLE) chip in … Read More
One Less Reason to Delay that Venture
Many of us dream about the wonderful widget we could build that would revolutionize our homes, parking, health, gaming, factories or whatever domain gets our creative juices surging, but how many of us take it the next step? Even when you’re ready to live on your savings, prototypes can be expensive and royalties add to the pain. … Read More
Synopsys Seeds Significant SIM Segue
It turns out that consumers are not alone in their love-hate relationship with SIM cards. SIM cards save us from increasingly widespread cellphone cloning. However, if your experience is anything like mine, it seemed that with every new phone, a new SIM card format was needed. Furthermore, people travelling overseas who wanted… Read More


RISC-V and AI: The Architecture Shift Is Now